Automating the Control of Moisture-Sensitive Components Benefits and ROI Analysis
The control of moisture-sensitive devices (MSDs) prior to SMT reflow is a critical assembly issue that has a direct impact on final product reliability and customer satisfaction as well as manu
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Event
IPC APEX 2002
Paste Inspection Study
Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be availa
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Event
IPC APEX 2002
Chip Scale Package and Flip Chip Assembly Using Tacky Flux
Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most co
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Event
IPC APEX 2002
AOI/AXI Combinational Inspection Strategy
The purpose of this study is to understand the capability of both AOI and AXI machines and where the two could be combined to increase the inspection coverage,reduce the overall cycle time of t
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Event
IPC APEX 2002
Comparative Properties of Optically Clear Epoxy Encapsulants
Three epoxy systems were evaluated for physical and optical properties. The three systems chosen for the study were selected on the basis of their optical clarity,color and chemistry. Three dis
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Event
IPC APEX 2002
Continuous Improvement Strategies for Automated X-ray Inspection
Automated X-ray inspection (AXI) is more often a part of an effective test strategy for today's PCBAs1 because of the benefits it provides manufacturers in meeting challenges resulting from2:
•
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Event
IPC APEX 2002
CSP Underfill,Processing,and Reliability
The use of Chip Scale Packaging (CSP) is rapidly expanding,particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these app
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Event
IPC APEX 2002
Developing SPC Methods for use with AOI Equipment in a Contract Manufacturing Environment
In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a proce
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Event
IPC APEX 2002
Development of Lead-Free Wave Soldering Process
Lead-free wave soldering was studied in this work using Sn/Ag/Cu alloy. A process DOE was developed,with three
variables (solder bath temperature,conveyor speed,and soldering atmosphere),using
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Event
IPC APEX 2002
Development of Wafer Scale Applied Reworkable Fluxing Underfill for Direct Chip Attach,Part II
Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,and less expensive packages,and flip chip is an important enabling tec
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Event
IPC APEX 2002
Developments in Vapor Phase Soldering Technology
Vapor phase soldering is in discussion of the recent past. Some of the topics of our own work are presented in this paper,like the combination of vapor phase reflow soldering with wave solderin
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Event
IPC APEX 2002
Does the Presence of Components Make a Difference? A New SIR Test Protocol to Characterize a Lead-Free,Electronic Production Process
Surface Insulation Resistance (SIR) Testing,has been used traditionally to characterise process materials,
particularly solder fluxes. Existing Surface Insulation resistance (SIR) test methods
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Event
IPC APEX 2002
Dynamic and Static Grouping in PCB Assembly
Group technology (GT) concepts can be applied in printed circuit board (PCB) assembly when determining a setup strategy for a single machine. In the group setup strategy,PCBs,which have similar
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Event
IPC APEX 2002
Quantifying Parasitic Induced by No-Clean Solder Paste Residue at RF Frequencies
Residue left behind from no-clean assembly is a visually obvious artifact of the manufacturing process that can
cause concern to those with RF circuit assemblies. This paper describes a test ve
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Event
IPC APEX 2002
Effects of Substrate Design on Underfill Voiding Using the Low Cost,High Throughput Flip Chip Assembly Process and No-Flow Underfill Materials
The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device di
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Event
IPC APEX 2002
Evaluating the Effect of Conformal Coatings in Reducing the Rate of Conductive Anodic Filament Formation
Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Cer
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Event
IPC APEX 2002
Evaluation of the Comparative Solderability of Lead-free Solders in Nitrogen
Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. It is expected that soldering in a nitrogen atmosphere might over
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Event
IPC APEX 2002
Evaluation of Two Novel Lead-Free Surface Finishes
Two new electrolytically plated lead-free surface finishes,satin bright tin on nickel and palladium-cobalt on nickel followed by gold flash coating,are evaluated for their wettability,bond stre
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Event
IPC APEX 2002
Factors Influencing the Optical Performances of Fiber Optic Connectors
Optical connectors are used to connect optical devices to other optical devices or systems. The presence of these optical connectors makes it possible to switch conveniently from one device or
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Event
IPC APEX 2002
The Formal Development of a Pb-Free Electronics Manufacturing Operation
To successfully navigate the transition from an entrenched Pb-based electronics manufacturing model to a fully integrated Pb-free manufacturing operation will require significant and coordinate
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Event
IPC APEX 2002