Welcome to IPC's collection of technical papers presented at conferences since 2002. You can search by author, title and keyword. You can also search for keywords and topics in the Tag field. Access to the papers is reserved for IPC members.

The Electronic Considerations of Embedded Passive Components in Optical PCB Fabrication

The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with whi .. read more
Author(s)
James Howard
Event
IPC Fall Meetings 2002

Fundamentals of Buried Passive Components

Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of sur .. read more
Author(s)
Greg Link
Event
IPC Fall Meetings 2002

Trimming Embedded Resistors

The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies. Embedding passive components into multi-lay .. read more
Author(s)
Dr. D.O.K. (Kim) Fjeldsted,Stacy L. Chase
Event
IPC Fall Meetings 2002

Surface Finishes,an OEM Perspective

Author(s)
Mike Barbetta
Event
IPC Fall Meetings 2002

What the EMS Provider wants in a Board Finish

There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations .. read more
Author(s)
Bruce Houghton
Event
IPC Fall Meetings 2002

What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL

Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderabl .. read more
Author(s)
Gerard O'Brien
Event
IPC Fall Meetings 2002