The Electronic Considerations of Embedded Passive Components in Optical PCB Fabrication
Description
The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with which we are all relatively familiar.
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Event
IPC Fall Meetings 2002
Fundamentals of Buried Passive Components
Description
Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of surface mounted discrete capacitors and resistors.
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Event
IPC Fall Meetings 2002
Trimming Embedded Resistors
Description
The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies.
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Event
IPC Fall Meetings 2002
What the EMS Provider wants in a Board Finish
Description
There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations,which can impact assembly yield and solder joint reliability.
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Event
IPC Fall Meetings 2002
What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL
Description
Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderable planar surface that increases their yields at assembly.
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Event
IPC Fall Meetings 2002