Welcome to IPC's collection of technical papers presented at conferences since 2002. You can search by author, title and keyword. You can also search for keywords and topics in the Tag field. Access to the papers is reserved for IPC members.

The Electronic Considerations of Embedded Passive Components in Optical PCB Fabrication

Description The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with which we are all relatively familiar. .. read more
Author(s)
James Howard
Event
IPC Fall Meetings 2002

Fundamentals of Embedded Passive Components

Description X .. read more
Author(s)
Greg Link
Event
IPC Fall Meetings 2002

Fundamentals of Buried Passive Components

Description Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of surface mounted discrete capacitors and resistors. .. read more
Author(s)
Greg Link
Event
IPC Fall Meetings 2002

Trimming Embedded Resistors

Description The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies. .. read more
Author(s)
Dr. D.O.K. (Kim) Fjeldsted,Stacy L. Chase
Event
IPC Fall Meetings 2002

IPC Alternate Surface Finishes Task Group

Description X .. read more
Author(s)
N/A
Event
IPC Fall Meetings 2002

Surface Finishes,an OEM Perspective

Description X .. read more
Author(s)
Mike Barbetta
Event
IPC Fall Meetings 2002

What the EMS Provider wants in a Board Finish

Description There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations,which can impact assembly yield and solder joint reliability. .. read more
Author(s)
Bruce Houghton
Event
IPC Fall Meetings 2002

What to Look for From Your Board Supplier When Changing to an Alternate Surface Finish to HASL

Description Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderable planar surface that increases their yields at assembly. .. read more
Author(s)
Gerard O'Brien
Event
IPC Fall Meetings 2002