IPC Conference Paper Archive

The drive for miniaturization of both commercial and aerospace/military technologies are not compatible with the current standard United States domestic PCB manufacturing processes at the vo .. read more

The need for increasingly complex electronics combined with the obsolescence of larger component packages is driving innovation to provide alternatives to the traditional subtractive-etch fa .. read more

The competitive pressures that electronics companies experience today are exceptional, even for an industry accustomed to a relentlessly high rate of innovation. Manufacturers are challenged .. read more

The Vertical Segments of the Electronic Products Manufacturing Industry (Semiconductor, Outsourced System Assembly, and Test, and Printed Circuit Board Assembly) are converging and service o .. read more

Robotic soldering is a growing market within the PCB Assembly industry and interest in robotic soldering equipment and applications is increasing every year. This method is more efficient th .. read more

The electronics industry is still searching for alternative lead-free alloys. Selective soldering requires relatively high solder temperatures to get proper hole filling. Alternative alloys .. read more

This paper presents results from a joined R&D project between two companies; Automotive Tier-1 and Technology Provider of structural electronics. Key benefits of structural electronics a .. read more

Electronic components are exposed to impact loadings and mechanical vibrations during assembly, material handling, and transportation. These loadings might affect the fatigue life of solder .. read more

Radio Detection and Ranging (radar) sensors require specialized materials and specific tolerances in order to optimize their function. However, although not new to many markets, such as the .. read more

Commonly used integrated circuits have been increasingly moving from leaded packages that are reworkable with a soldering iron to leadless packages such as BGAs that require complex rework t .. read more

Multiple Electronics Markets are driving the growing need for components with higher performance in smaller form factors with higher pin count and greater reliability. Ball Grid Ar .. read more

Whilst many forward-thinking companies invest time, effort and cost into up front work to fix snags which would lead to issues with yield during production, this paper shows the efforts of a .. read more

If you don't measure, you don't know. These are appropriate words for the application of statistical methods for measuring machine and process capabilities in surface mount technology (SMT) .. read more

With the growth of Surface Mount Technology (SMT) driven by new technological innovations and next generation products, machine feeder density becomes extremely important in electronics manu .. read more

Customer demands for smaller form factor electronic devices are driving the use of thinner electronic components and thinner printed circuit boards (PCB) in the assembly process. The use of .. read more

Warning required to be provided for exposing person to a listed chemical, unless “person in the course of doing business” can demonstrate it does not pose “significant risk”   •App .. read more

California Clear and reasonable warnings •Overview of new warning regulation  •Retailer warnings accompanying sale  •Warnings website •Listings•Compliance assis .. read more

Intended for use as technical guidance by ADHP (Aerospace, Defense, and High-Performance) electronics system customers to provide the technical structure needed to allow the designer to eval .. read more

J-STD-001G Amendment 1 standard requires an OEM and EMS to qualify soldering and/or cleaning processes that result in acceptable levels of flux and other residues. Objective evidence shall b .. read more

Findings and recommendations are reported from phase 1 of the Transient AMR(absolute maximum ratings) project, which is sponsored by the EOS/ESD Association and Industry Council on ESD Targe .. read more

High-frequency materials are characterized by several important parameters, including the dielectric constant or relative permittivity (εr) and the dissipation factor (Df). For those paramet .. read more

This paper analyzes the reasons of inaccurate PCB impedance simulation of the traditional simulator and introduces a novel and cost-effective method for accurate PCB impedance simulation of .. read more

The importance of signal integrity is emphasized as signal speed increases, and higher frequencies are applied. The PCB manufacturer uses SI coupons that can replace the in-product circuit t .. read more

Driven by rapid changes and markets, the electronics industry has seen massive growth over the past few decades. The short product life cycle has pushed PCB fabrication technology to its lim .. read more

Phosphorus content in electroless nickel deposits, for PCB and electronic connectors, is a critical factor in controlling the nickel layer’s corrosion resistance and solderability. Improveme .. read more

The development of nano-scale surface finishes over copper pads such as Electroless Palladium and Autocatalytic Gold (EPAG) has been evolving in the recent years due to ever increasing deman .. read more

Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) is a well-accepted and established finish for high performance applications. The properties of the coating are determined mai .. read more

The evolution of internet-enabled mobile devices has driven innovation in the manufacturing and design of technology capable of high-frequency electronic signal transfer.  Among the pri .. read more

QFN-Quad Flat No-lead SMT-surface mount technology components continue to be increasingly used and also becoming smaller for applications further requiring a high level of thermal performanc .. read more

Voiding in solder joints has been studied extensively, and the effects of many variables compared and contrasted with respect to voiding performance. Solder paste flux, solder powder size, s .. read more

WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o .. read more

WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations o .. read more

Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. Technological advancements toward 5G standards,wireless charging of mobile electronics,in-pack .. read more

In this study,the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids,such as solder paste and conductive adh .. read more

The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various .. read more

In this era of electronics miniaturization,high yield and low cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip .. read more

The demand to produce smaller electronic devices and products to meet the needs of consumer electronic applications has resulted in thinner ball grid array (BGA) packages with finer pitches. Du .. read more

Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excess .. read more

Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Pack .. read more

This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. It enables automatic micro .. read more

Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili .. read more

Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturabili .. read more

The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important tec .. read more

Leadless semiconductor plastic packages (QFN) is a growing package category in terms of market share and diversity. This is also valid for low pin count semiconductors (e.g.: transistors and di .. read more

The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. Thermal pads under said components are .. read more

Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf .. read more

Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. The presence of manuf .. read more

E-textiles,also known as electronic textiles,smart textiles,smart clothing,smart garments,or smart fabrics,are fabrics with electronic components and sensors embedded in them. Key components of .. read more

The Augmented Reality and Virtual Reality market is expected to cross $44 billion by the year 2025 according to various industry experts. This exciting new technology is not exactly new,but has .. read more

Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number o .. read more