IPC Conference Paper Archive

Major industrial nations,around the world,are rapidly moving to eliminate lead from the electronic manufacturing processes. While some companies are taking advantage of the situation and are us .. read more

An issue that has emerged from the increasing use by the electronics industry of lead-free solders in mass production wave soldering is the erosion of the copper of printed circuit board patter .. read more

Developing lead free connector products involves at least two distinct steps: removing the lead from the product and ensuring the product has sufficient thermal stability. Lead is most commonly .. read more

The commercial use of lead-free solder has been making significant gains worldwide in recent years. To identify the effects of thermo-mechanical stress on Sn-Ag-Cu and Sn-Zn-Bi solder with diff .. read more

As we inch towards the somewhat shifting deadlines towards lead (Pb) restriction in Japan and Europe,there is an increase seen in the amount of studies performed for electronics assemblies sold .. read more

This paper presents a quantitative analysis of solder joint reliability data for lead-free Sn-Ag-Cu (SAC) and mixed assembly (SnPb + SAC) circuit boards based on an extensive,but non-exhaustive .. read more

For SnAgCu solders,the voiding rate at microvia was studied with the use of simulated microvia,and was the lowest with 95.5Sn3.8Ag0.7Cu and 95.5Sn3.5Ag1Cu. The voiding rate increased with decre .. read more

Movements to lead-free assembly are being influenced by legislative and market requirements. Specifically Europe has passed legislation requiring the removal of lead from electronics assembly b .. read more

The continued functional densification and integration in networking products is driving the need to study large form factor printed circuit boards that use high I/O packages (either ceramics c .. read more

The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout the electronics supply chain. The University of Massachusetts Lowell has bro .. read more

As the need for higher performance,higher I/O count packaging solutions at lower costs continues to grow,opportunities exist to support these applications with higher performance wire bonded pa .. read more

A new,green epoxy mold compound has been developed to encapsulate fine pitch PBGA and 3D-stacked die CSP packages. When evaluated on these packages,the compound provided very good wire sweep pe .. read more

A variety of mechanical and thermal stress related problems related to Flip Chip Ball Grid Array Packages (FCBGAs) are often solved by the Finite Element Method. Often,the question for the stre .. read more

The selection and use of solder joint modification configurations for printed wiring assemblies has traditionally been a design specific activity. The implementation and use of a standardized s .. read more

Various test methods are used to characterize the PCB plated-thru-hole reliability. One such method is the Interconnect Stress Test (IST). The results from this test are often used to qualify P .. read more

Conductive Anodic Filamentation is a subsurface failure mode for woven glass reinforced laminates (FR4) materials,where a copper salt filament allows bridging between via walls or other copper .. read more

Lead-free alloys under consideration have physical properties,which may directly impact industry standard electronic assembly cleaning processes. The purpose of this study is to evaluate how th .. read more

The ever-increasing use of high frequency in high density interconnect (HDI) assemblies,combined with the worldwide move toward lead-free manufacturing,has initiated a closer scrutiny towards e .. read more

Chip scale packages (CSPs) are widely used in portable electronic products where there is also a growing trend to lead free assembly. Many CSP designs will meet the thermal cycle or thermal sho .. read more

The miniaturization trend in electronics has proliferated the use of Chip Scale Packages (CSPs) in electronics assembly. CSPs used in portable devices are subjected to harsh mechanical and ther .. read more

A cyclic board-bending technique has been developed to ensure a reproducible multiaxial stress state at the Chip Size Package (CSP) solder fillet. Mechanically stressing the package serves as a .. read more

When we think of optoelectronics in the USA,we automatically think of telecom applications. These fueled huge growth at the turn of the millennium,and even after the bubble burst in 2001-2,tele .. read more

Results from a National Electronics Manufacturing Initiative (NEMI) project,formed to improve aspects of fiber optic fusion splicing,are reported. The focus of this paper is ultra low loss spli .. read more

The lack of consistency and compatibility in process carrier designs was cited as an early barrier to automation in the nascent fiber-optics industry. Under the auspices of the National Electro .. read more

The outlook for optical PCBs is unclear for mainly three reasons: 1) today's limits for copper boards can be stretched with design and manufacturing improvements,2) the market demand for next g .. read more

This paper will describe the method used to automate drawing note creation at Lockheed Martin. It will discuss the reasons for the automation and some of the decisions that needed to be made be .. read more

Driving factors for the use of via in pad technology include the growing trend towards more dense and complex printed circuit board designs as well as the need to minimize parasitic capacitance .. read more

This paper discusses the work and testing performed to obtain extreme high reliability performance from high layer count, large panel format multilayer printed wiring boards that are used for b .. read more

Embedded passives,i.e.,resistors and capacitors built right into the printed circuit board substrate,is a rapidly emerging and pivotal technology for the PCB industry preceded only by the plate .. read more

Embedded passives technologies can provide benefits of size,performance,cost,and reliability to high density,highspeed designs. A number of embedded passive technology solutions are available t .. read more

This paper will discuss the use of thin film buried resistors and thin core plane pairs in high layer count high reliability printed wiring boards used in single and double sided surface mount .. read more

The newly developed Ohmega-Ply “Resistor-Built-in-Trace” technology uses low-ohmic resistive materials for embedded resistors congruent to the circuitry in a multilayer PCB or HDI substrate. Hi .. read more

We have previously published our work on developing thin substrates for use as embedded capacitor layers. Based on this work we have continued to characterize the performance and reliability of .. read more

Novel configurations of decoupling capacitors were formed by anodizing Ta,resulting in Ta2O5 films 2000 Å thick and k = 23,giving about 110 nF/cm2. Since the dielectric is very thin,the parasit .. read more

Motorola has been using embedded polymer thick film resistors on immersion silver-plated copper terminations in products for four years,and in the past year other firms have begun using this te .. read more

This paper will demonstrate the effect high reflow temperatures in lead free processes will have on the reliability of printed circuit boards from a broad range of laminate materials for both t .. read more

The Lead-free electronics manufacturing has become a reality. As of this writing,a few manufacturers have rightfully reported their total completion to Lead-free production across all facilitie .. read more

The migration to Lead Free raw materials in the Electronics Industry will happen faster than the date proposed in the original draft of the legislation. A true Pb-free solution for product such .. read more

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With the advent of CAD and CAM tools,the need arose for a more complete method of data transfer. As layer count increased,the number of files increased. As trace size and spacing began to decre .. read more

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As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC .. read more

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Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly emerging and pivotal technology for the PCB industry,perhaps preceded only .. read more

Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relega .. read more

A flexible circuit is more than just thin materials made into an interconnecting device. Understanding the characteristics of the materials and their properties versus circuit design type and r .. read more

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Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures .. read more

Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. And even thoug .. read more