IPC Conference Paper Archive

To meet future requirements for PWBs,various technologies of processes,materials and tools of PWBs have been discussed. Especially important are technologies of circuit formation for high-end P .. read more

A recent trend of increasing circuit density,particularly in the areas of plastic packages and multi-layer boards,has resulted in ceaseless demand of improved mechanical properties for laminate .. read more

Recent increasing demand for miniaturization and multi-functionality of electronic devices has lead to higher PWBs circuit density design,requiring thinner insulation layers,smaller via holes a .. read more

With the objective of developing high thermal conductive laminates capable of being used as high current-carrying wiring boards for automotive and industrial applications,we identified the opti .. read more

Japan has a long history of publishing very important technology roadmaps. Some of the Japanese roadmaps published in the past are: JPCA Roadmaps Report on the Technology Roadmap for Advanced S .. read more

A unified European roadmap for PWBs does not exist today. It is also most unlikely that a unified roadmap will available in a foreseeable future time. However,the EIPC has worked together with .. read more

Have you ever been confused after you have read two or three different roadmaps and even though they were supposedly mapping the same attribute in the same time periods,the numbers in the cells .. read more

The use of acid copper plating process for via-filling effectively forms interlayer connection in build-up PWBs with high-density interconnections. However,in the case of copper film deposited .. read more

This paper will review eductor agitation systems at PWB installations to improve the electroplating of printed circuit boards. Significant environmental and productivity improvements have been .. read more

In contrast to electroless copper,direct metallization processes are inherently less expensive to operate,more environmental friendly,requires less floor space and are more efficient. Among the .. read more

The use of lead-free (LF) solders as a replacement for traditional tin-lead (SnPb) solders in military and high reliability applications has a number of technical challenges unique to the indus .. read more

Much work has been done involving the introduction of RoHS and WEEE Directives across the European Union and the world. Although the use of Pb is limited in new products and equipment,older Pb- .. read more

We coated copper substrate with tin-zinc lead-free solder (Sn-9Zn and Sn-8Zn-3Bi),and then we performed the following corrosion tests: the salt mist test,the gas corrosion test,and the weatheri .. read more

In recent years,along with the further progress of network systems,mobile communication systems and high performance servers printed wiring boards (PWBs),which are key components in these produ .. read more

The trends of increased functionality and reduced size of portable wireless products,such as handsets; PDAs are demanding increased routing densities for printed circuit boards. The handheld wi .. read more

This newly developed material and process enable the manufacturing,using a single pressing process,of multi-layer circuit boards with inner via-holes in every layer. Because this material utili .. read more

A Design of Experiment (DOE) was conducted to determine the best filler,or combination of fillers that would offer the best reduction of CTE expansion from 50oC to 260o C without compromising e .. read more

As a promising candidate for future substrate with high pin-count and low transmission loss at high frequency,we have developed an all polyimide multi-layered board laminated by single batch pr .. read more

We have developed a new thermosetting polyimide build-up material for high performance build-up PWBs,which can mount high speed CPUs with high I/O numbers. These PWBs meet the following require .. read more

The objectives of the present study are to design,fabricate,and test various configurations of micro-vias over military thermal environment,and then evaluate the impacts of micro-via design/man .. read more

The trends of increased functionality and reduced size of portable wireless products,such as handsets and PDAs,are demanding increased routing densities for printed circuit boards. The handheld .. read more

In recent years,Wafer Level Chip Scale Packages (WLCSP) are used not only in the hand held devices but also in high-end networking and telecommunication products. Due to their small footprint a .. read more

With the function of today’s electronic devices become more and more complicate,the high I/O flip chip ball grid array package (FCBGA) is used more popularly in recent years. The FCBGA package .. read more

Higher I/O Ball Grid Arrays (BGAs) are high speed,high pin count,and high performance array packages. These BGAs are also more complex in structure than “standard” BGAs and are generally target .. read more

Quantifying SMT adhesive dispensing performance has typically been attribute analysis via a microscope. Individual adhesive deposits were inspected for strings or tails,extra dots,missing dots .. read more

Conductive adhesives (CAs) have been an important problem-solving class of assembly materials for decades,but primarily as die attaches products,ever since they replaced metallurgical systems. .. read more

The electronic industry trend of smaller component packages and tighter spacing has put greater demands on manufacturing for process control and product verification. Defects must be caught ear .. read more

Industry cost control pressures and technology drivers demand more powerful 3D AOI machines for control of solder paste printing. Here is an inside look at the factors potential purchasers of t .. read more

The behavior of BGA solder joints under dynamic loads has become more significant in recent years. This work explored test methodologies for solder joint failure evaluation under dynamic loads. .. read more

Non-destructive testing during the manufacture of printed wiring boards (PWBs) has become ever more important for checking product quality without compromising productivity. Using x-ray inspect .. read more

Evaluation of printed wiring boards (PWBs) for thermal reliability during assembly and rework operations by Thermal Mechanical Analyzer (TMA) “T-260” testing has been an accepted practice for m .. read more

The popularity of low voltage technologies has grown significantly over the last decade as semiconductor device manufacturers have moved to satisfy market demands for more powerful products,sma .. read more

Process,Process,Process – these words must ring loudly in our ears,and must be at the forefront of lead free implementation. The smaller process windows dictated by lead free alloys are going t .. read more

A novel electrochemical plating process for depositing gold and silver surface finishes using environmentally benign, organic-based solutions as the plating bath is being investigated. The plat .. read more

In order to understand the reaction mechanism of an auto-catalytic type gold plating bath,it is necessary to recognize the following reactions --- oxidation of reducing agent,gold deposition an .. read more

The SMT (surface mount technology) assembly process for 0.4 mm pitch CSP (chip scale package) components was studied in this work. For the screen printing process,the printing performance of di .. read more

As Electrostatic discharge,humidity can have a bad impact on assembly quality. It requires environmental conditions and process controls but also risks knowledge. To overcome humidity issue,par .. read more

SPC data has shown that the solder paste printing process is the primary source of soldering defects in SMT assembly. Consequently,verification of the specified printing properties of solder pa .. read more

Recently,wafer bumping using solder paste with very fine solder powder has come into focus as more cost effective than conventional sputtered or plated methods. This additive method revolves ar .. read more

The research discussed in this paper uses an innovative enhancement technique for printing High Density substrates. The technique takes advantage of high frequency low amplitude vibrations appl .. read more

The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing production facility; typical values presented are around the 60% range. Fact .. read more

Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional squeegee printing. By design,enclosed print heads offer several advan .. read more

There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a wide variety of phosphorus and non-phosphorus systems have been .. read more

A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion after electroless plating could be engineered into existing Resin Coated Foils .. read more

An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is currently a mainstream final finishing application for mobile phone Printed Wir .. read more

With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly becoming more critical,fabricators and OEM’s must determine the mo .. read more

The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the reliability of the solder joint integrity was investigated. The solder joint .. read more

To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled SnPb solder to alternative final finishes. A thin .. read more

At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the electronics supply chain thoroughly evaluated the new printed circ .. read more

This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate the impacts resulting from the use of lead and lead-free solders during t .. read more