IPC Conference Paper Archive

This paper presents a functional signature analysis method for the end-of-life management of products,particularly for electrical-electronics and electromechanical applications. Due to the fast .. read more

Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and conditions that designers needs to consider to introduce microvias t .. read more

One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how far technology would have progressed if not for the automation of computer .. read more

There are many ways of specifying units for many different measurements,and over the years they have developed a life of their own. For example,length was once measured with glorious imprecisio .. read more

The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This paper reviews one of the single most important,but sometimes overlo .. read more

The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are becoming mature and their reliability assessed. 3-D technology constitutes the .. read more

This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the joint research project "TLSD". By the use of temporary liquid solder j .. read more

During the last several years there has been and continues to be an enormous investment by both governments and industry in the development and manufacture of fuel cells. The United States,Japa .. read more

The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area array assembly has been adopted by many board designers and component asse .. read more

Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter, and less expensive packages,and flip chip is an important enabling te .. read more

Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a simple and cost effective process. However,the material properties of .. read more

A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and wells filled with solder paste are provided on a flexible substrate serv .. read more

There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted using a stencil aperture that is larger than the wafer pad. This perm .. read more

Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as viable drop-in replacements to tin-lead solder. High melting point tin alloys such .. read more

Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is expected to continue. Markets utilizing these designs include high pe .. read more

A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in this investigation. These equations are applied to a 256PBGA (plastic ba .. read more

Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have been the standard in printed circuit assembly processes. Lead-free sol .. read more

Solder preforms are precise shapes of metal,produced by the high-speed stamping or forming of solder wire or ribbon. Preforms provide a highly repeatable volume of solder,with 100% metal conten .. read more

Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower ultimate cost of SMT makes it a preferred assembly technology. However,the .. read more

Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards in the range of 40-93 mils and the typical 6 to 8 layers. This resear .. read more

This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high - frequency & flex designs by examining: 1. How the material set has now been .. read more

A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance tolerances before any components are attached. A popular technique is to .. read more

Efforts to reduce high frequency signal losses associated with dielectric materials have driven development and commercialization of more cost effective low loss laminate materials. These devel .. read more

This paper will discuss the two primary transmission components that concern designers today. These components affect the signal integrity of all high-speed transmissions in printed circuit boa .. read more

The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials are greatly impacting high speed interconnect designs. As the transf .. read more

When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond material costs.1 Impacts to the overall reflow process should be caref .. read more

Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized reflow profile. Years ago,when IR ovens were the norm and solder pastes we .. read more

Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits (ICs). The primary purpose of encapsulating the SMT package using these .. read more

We often hear or use the terms “World Class Manufacturing” or “Best in Class Manufacturing” in reference to our manufacturing operation or perhaps a competitor’s or supplier’s manufacturing ope .. read more

To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability indices (Cp,Cpk,etc.) are used. What most people fail to realize,howeve .. read more

Today,there are only three certainties in a circuit board market that for the last three years has proven anything but certain: death,taxes,and military business. As the overall North American .. read more

The overall mission and foundation of business today,as it was yesterday and undoubtedly will be tomorrow,is to maximize customer service. Customer Relationship Management (CRM),although a rela .. read more

Loyal customers are customers who will pay premium price for exceptional products and services,refer other customers to buy products and services,buy a whole range of products and services from .. read more

Lean and Continuous Improvement are distinct performance improvement strategies. Each has its own objective and methodology and is highly inter-woven. Lean Manufacturing uses the strategy of Ka .. read more

Mass transfer effects and reactor design play an important role in the plating process of electronic interconnects. To improve the behaviour and performance of the plating reactors used for ele .. read more

Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is especially the case in high technology and quick turn applications .. read more

There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR) plating to electroplate printed circuit boards. PPR plating offers .. read more

With an increasing number of designers specifying conductive material for plugging through-holes,a more robust process to produce 100% fill is needed for the whole range of aspect ratios. With .. read more

This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster,smaller and higher performance communication and electronic devices,build-u .. read more

The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability high layer count multlayer interconnect devices is moving rapidly. PWB f .. read more

PTFE material is very hydrophobic and among the most difficult to deposit electroless copper or direct metallization. These materials have very low friction,which makes a surface non-wettable. .. read more

Traditional reduced black oxide processes for inner layer bonding have been superseded by a newer generation of peroxidesulfuric texturing processes. These lower cost processes,based on an orga .. read more

In most of today's high speed digital interconnects,the signal loss associated with the printed circuit board (PCB) is the dominate factor. Material selection,trace geometry,and choice of coppe .. read more

Microvias are the fastest growing new technology for printed circuits. Once you understand the basics,the advanced topics bring the real advantage to light. This talk will highlight the procedu .. read more

The need for dynamic compact models for Integrated Circuits (ICs) is a well-recognized problem in electronics cooling simulations of electronic systems. Simplified thermal models have been repo .. read more

The electrical properties of PCB substrates are one of the primary factors used in designing high-frequency printed circuit boards. The loss tangent is the electrical property used by material .. read more

As digital data rates reach 5Gb/s,10Gb/s and beyond,digital designers are finding it increasingly difficult to meet their design constraints using FR4. While there are a host of alternative mat .. read more

Whilst the number of new ASIC designs has decreased over the last couple of years,there has been a dramatic increase in the number of FPGA designs implemented. Not only have the number of desig .. read more

Tombstoning of SnAgCu is affected by the solder composition. At vapor phase soldering,both wetting force and wetting time at a temperature well above the melting point have no correlation with .. read more

The hypothesis that the “whisker growth phenomenon” in electrodeposited tin is a re-crystallization process driven by stress has gained popularity among leading research institutes and industri .. read more