IPC Conference Paper Archive

A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux residue is designed to provide an interference-free service performance,in addition .. read more

As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead solders,manufacturing companies are asking questions regarding what they need to .. read more

To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit outstanding cleaning performance for a variety of flux residues. The new cleanin .. read more

The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE- 7200) provides the fluid dynamics to build engineered cleaning fluids that exhi .. read more

With the ban of CFC’s,various cleaning processes have emerged and have been established as viable alternatives1,2,3. Several cleaning processes such as ultrasonic and spray in air batch and in- .. read more

The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core competencies that enhance shareholder value. This outsourcing trend i .. read more

The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the increase in outsourcing of manufacturing services. This has resulted in the conseq .. read more

With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New .. read more

The internet explosion of the 90’s created much hype around public exchanges that has never materialized. The current business environment of a multi-company value chain,alliances and partnersh .. read more

In a low-volume,high-mix electronics manufacturing environment,the ability to delineate design concerns before a customer’s product goes to production is paramount. Design deficiencies or devia .. read more

As outsource to EMS,the requirement for Automated Optical Inspection (AOI) equipment changes as well. Due to the diversity of the business,EMS providers require equipment that can handle a myri .. read more

The increasing demand for portable electronic products has accelerated the quest for even greater miniaturization. At the current state of electronic production technology,volume and weight red .. read more

Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip interconnection types including anisotropic conductive film or .. read more

Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time consuming to setup,and relatively expensive. This is because support pins or dedica .. read more

The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products mandate the enhancement of manufacturing systems and assembly yields. In fine pit .. read more

One of the electronic assembly markets that has been emerging in recent years is the automation equipment associated with odd form component placement and final product assembly. As with insert .. read more

Stability and repeatability are imperative in any reflow oven today. If oven operation is not validated periodically,all subsequent profiles and adjustments are not reliable in finding or maint .. read more

Flux management methods for reflow soldering have been debated for years. Current data suggests that multi-stage filtration systems offer many benefits,particularly in dealing with the byproduc .. read more

The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu) .. read more

Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. It is expected that soldering in a nitrogen atmosphere might over .. read more

The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless ni .. read more

Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB a .. read more

Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus whisker growth can be regarded as a grain growth phenomenon. In this paper we examine .. read more

The OEM desires identified in the 2002 – 2003 roadmap clearly identify,through their emulators,the present and future needs of the products that the emulators represent. There are a total of ei .. read more

We have organized in JPCA a committee for the standardization of optoelectronic assembly technology in collaboration with JIEP (Japan Institute of Electronics Packaging) with cooperation of JEI .. read more

High speed systems operating at speeds of 2GHz and above are placing increasing demands on the specifications of substrates and packaging of components used within these systems. BPA has review .. read more

National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key issues identified by the industry. These cover the areas of Fiber Management,Sig .. read more

Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC package terminals in terms of solder wetting ability. Current industrial .. read more

The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is key to proper solder joint formation. Robust solder paste performance is needed .. read more

The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process. The presence of solder flux residues,solder mask,underfill or any SMT material .. read more

Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and cabin management systems for the Boeing family of commercial airplanes. Boeing speci .. read more

As line speeds increase and production looks to decrease size and energy requirements,radiation curing becomes a more attractive technology option over the incumbent thermal and moisture curing .. read more

Conformal or protective coatings are widely used in the electronics industry today and are available in a large variety of different types and adjustments. The "classic" or conventional conform .. read more

Over the years,electronic components have become increasingly smaller and integrated. Spacing between components and line to line spacing has continually shrunk. This miniaturization has magnif .. read more

The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the commercially available tin-silver-copper alloys and their processing and reliabilit .. read more

With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to minimize the pollution on the environment. The use of the lead free solder is repl .. read more

Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics when fresh but then suffer rapid degradation. Although rosin based pastes .. read more

This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle designed to resemble real world manufacturing applications. Four different Pb-free a .. read more

Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating of these alloys is challenging because of great difference in reduction pote .. read more

The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is one of the alternatives and may be the simplest system as a “drop-in” replac .. read more

Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks to the Wave Soldering process is the high cost associated with maintaining and o .. read more

The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s Wave Solder systems. Users are experiencing higher maintenance frequency and re .. read more

Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical connection. Solder paste is generally deposited using a mass imaging process,suc .. read more

The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process. The largest changes are in the reflow process,as Pb-free pastes requ .. read more

Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn. Coupons of solder joints (prepared by melting some of each solder alloy on a copper-p .. read more

The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based corporations to investigate lead-free (Pb-free) surface mount soldering technology. The .. read more

With the Waste Electrical and Electronic Equipment (WEEE) Directive in Europe outlawing lead from many electronic devices produced and imported in the EU by July 2006,as well as with foreign co .. read more

The full hermetic package for electronics and optoelectronic (OE) devices was first developed in the 1800’s and has served these industries well. The earliest optoelectronic devices,cathode ray .. read more

A new type of Micro-Electro-Mechanical System (MEMS) structure has been developed on a printed wiring board (PWB) platform. PWB,embedded passives (EP) and High Density Interconnect (HDI) techno .. read more

One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging needs for MicroSystems and MEMS technology vary by structure and application. Major i .. read more