IPC Conference Paper Archive

Solder paste printing is known to be one of the most difficult processes to quality assure in electronic manufacturing. The challenge increases as the technology development moves toward a mix .. read more

The demands on volume delivery and positioning accuracy for solder paste deposits are increasing as the size and complexity of circuits continue to develop in the electronics industry. Accordin .. read more

The utilization of embedded components has increased across many applications in various industries,and with rapid emergence of technologies and the need to secure IP,new methodologies are bein .. read more

In light of new process and product technologies in the field of embedded components,questions arise with respect to advantages and potential disadvantages to standard SMT component placement w .. read more

Embedded capacitors offer board designers the ability to address the demands of high switching speeds and high I/O count packages while stemming the proliferation of minute decoupling capacitor .. read more

The objective of this study is to evaluate conformal coatings for mitigation of tin whisker growth. The conformal coatings chosen for the experiment are acrylic,polyurethane and parylene. The c .. read more

The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). The test setup consist .. read more

Nickel-palladium-gold-finished terminals are susceptible to creep corrosion. Excessive creep corrosion can result in device failure due to insulation resistance loss between adjacent terminals. .. read more

This paper is an extension of an IPC paper [1] presented last year which addressed microwave insertion loss of common PCB transmission line circuits. Insertion loss of these circuits is made up .. read more

As channel speeds approach 25 Gbps,near the expected maximum bandwidth for traditional copper-based PCBs,every available tool to minimize total insertion loss in the board material system will .. read more

The use of bottom terminated components (BTC) has become widespread,specifically the use of Quad Flat No-lead (QFN) packages. The small outline and low height of this package type,improved elec .. read more

Bottom terminated components (BTC) are leadless components where terminations are protectively plated on the underside of the package. They are all slightly different and have different names,s .. read more

Bottom Termination surface mount Components (BTC) are extremely popular because of their low cost,low stand-off height and excellent thermal and electrical properties. In this manufacturing are .. read more

Complexity of test development for LED test and long LED test execution time in production are big challenges faced by the PCB manufacturing industry. This paper introduces a parallel multi-cha .. read more

This paper proposes an integrated design and test strategy which uses functional design blocks common to both designs and test fixtures,with the aim of saving time and money. Benefits of this s .. read more

To find defects of solder joint in printed wiring board assembly,quite a few test methods have been developed so far. Capacitance method and IEEE 1149.1 or boundary scan method are often used t .. read more

In today’s world it is important that a product has sufficient accreditation that it can be enter many different market places. While accreditation can be a costly process,it is prudent to know .. read more

What’s the Future of Interposers for Semiconductor IC Packaging? .. read more

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In the past few years,several papers,test methods and methodologies have been developed to estimate pad cratering under Ball Grid Array (BGA) pads in Printed Circuit Board Assemblies (PCBAs). .. read more

Assembly defects can effectively shorten reliability lifetimes in addition to lowering manufacturing yields or creating premature service failures. This paper describes and characterizes an unu .. read more

Commercial-off-the-shelf column grid array packaging (COTS CGA) technologies in high reliability versions are now being considered for use in a number of National Aeronautics and Space Administ .. read more

BGA Rework is now largely mature,although new supplemental processes that provide improved process control such as Solder Paste Dipping and Non-Contact Site Cleaning can now be integrated into .. read more

This paper examines the nature; the consequences and the mitigation of electrical overstress (EOS) caused by electromagnetic interference (EMI),or electrical noise,on power lines and ground in .. read more

Over the last years more and more International newspapers reported in Europe / USA and Japan: “Tunnel train got stuck under the Channel – thousands of people stranded “Recall of thousands of c .. read more

The purpose of this study is to determine whether or not aerosol benchtop cleaning can consistently and reliably clean reworked boards. Different variables that play a role in the effectiveness .. read more

Recycling cleaning and rinsing fluids in the manufacturing process is becoming very popular for many reasons. Competitiveness is the key issue as the electronics industry ages. In our golden ye .. read more

Two major drivers in electronic industry are electrical and mechanical miniaturization. Both induce major changes in the material selection as well as in the design. Nevertheless,the mechanical .. read more

Sn3.0Ag0.5Cu (SAC305) is the most popular near eutectic lead-free alloy used in the manufacturing processes. Over the last several years,the price of silver has dramatically increased driving a .. read more

This paper is the first of two papers discussing the Celestica/Honeywell Lower Melt Alloy program. The program explores the manufacturability and reliability for Pb-freethree Bi-containing allo .. read more

For the past few years there has been a shift in the Lighting Industry that has carried over to the surface mount technology assembly line. What is this shift you may ask? Well it is the LED re .. read more

Microsystems Enabled PV: •Technology benefits •Process flow/assembly examples •Cost analysis •From R&D to commercialization •3DIC/hybrid assembly and new functionality .. read more

New Low Temp. Alloys were developed,through elemental additions,to improve mechanical strength,fatigue life and drop shock resistance. •Effect of these elemental additions on the new alloys was .. read more

Low temp solders are a viable solution and their performance can be enhance thought final finish selection. Initial data suggest that an organic metal final finish in combination with a low tem .. read more

Low Temperature Conversion •Substantial cost savings over regular processes •Savings can outweigh paste cost differences •Can be mechanically stronger if done right •Involves more than just cha .. read more

•Jet printing introduction •Industry challenges •Jet printing low temperature paste –Collaboration Alpha-MYDATA –Rheology –Results •Low temperature paste offers a production solution for advanc .. read more

As more components are becoming lead free and not available in the tin lead alloy,there is an industry wide interest when it comes to the reballing and the subsequent effects it has on the stre .. read more

Automated Optical Rework (AOR) is a new method of reworking shorts by using a fully automated fine laser beam to ablate any excess copper in fine-line PCB patterns. This includes shorts,protrus .. read more

Although the vast majority of electronic equipment has made the transition to lead-free without significant issue,some market segments still utilize tin-lead solder. The European Union’s RoHS l .. read more

Many manufacturers employ one or more In-Circuit Test (ICT) systems in their PCB manufacturing facilities to help them detect manufacturing process and component defects. These “bed-of-nails” e .. read more

HALT & HASS technology uses a combination of accelerated stresses to expose product flaws early in the design and manufacturing stages (often at board level),improving product reliability and c .. read more

In light of the recent technological trends within PCB manufacturing industry,there is an increasing degree of interest in understanding the influence factors of mechanical stress on the durabi .. read more

As the FPGA device technology migrates to 28nm technology node and high performance applications,selecting the right package to meet the customer usability requirements and to achieve product r .. read more

The successful integration of package-on-package (PoP) stacking utilizing through mold via (TMV) technology hinges on a robust assembly process. In this study,seven dip materials were investiga .. read more

The growth of portable and wireless products is driving the miniaturization of packages resulting in the development of many types of thin form factor packages and cost effective assembly proce .. read more

1.Obtain suggestions from the solder manufactures Low-Ag SAC Paste •Increase in reflow temp •Impact on thermal fatigue and wetting Sn-Bi low-temp Paste •Impact on shock strength •Creep fatigue .. read more

SAC-Bi and Sn-Ag-Bi alloys have demonstrated superior performance in thermal cycling reliability tests of printed circuit boards,such as the National Center for Manufacturing Sciences programs .. read more

The very small solder joints that now account for an increasing proportion of the connections on which modern electronics depends are typically made up of only a few grains,sometimes only a sin .. read more