IPC Conference Paper Archive

A novel epoxy flux was developed with good compatibility with no-clean solder pastes,which imparts high reliability for BGA assembly at a low cost. This compatibility with solder pastes is achi .. read more

The electronics market is divided into many segments each having its own challenges; but one theme that connects the electronics community together is a need for higher yield with lower costs. .. read more

Fine pitch/fine feature solder paste printing in PCB assembly has become increasingly difficult as board geometries have become ever more compact. The printing process itself,traditionally the .. read more

As feature sizes are driven to be smaller,the cost of PCB fabrication is driven higher. In particular,sequential lamination of complex circuit boards is a time consuming and expensive process. .. read more

The purpose of this study is to investigate the effect of plasma surface modification to improve adhesion strength between polytetrafluoroethylene (PTFE) and directly plated electroless copper. .. read more

Mr. Craig Herndon & Mr. Roger Smith will be discussing the Navy’s assignment as the DoD Executive Agent for Printed Circuit Board (PrCB) Technology and its role in ensuring that viable military .. read more

Since the late 1990s,the globalization of the electronics industry has put North American and European manufacturers in competition with manufacturers in China and other low-labor-cost areas. .. read more

One of the more notable trends in the data on electronics manufacturing over the past several years has been a return to regionalization. Defined as building in region for region,this trend is .. read more

The drive towards fine pitch technology also affects the soldering processes. Selective soldering is a reliable soldering process for THT (through hole) connectors and offers a wide process win .. read more

In this study various printed circuit board surface finishes were evaluated,including: organic solderability preservative (OSP),plasma finish (PF),immersion silver (IAg),electroless nickel / im .. read more

This paper is the second of two papers discussing the companies Lower Melt Alloy program. The first paper was presented at IPC APEX2013. The program explores the manufacturability and reliabili .. read more

Low melting 57Bi42Sn1Ag (BiSnAg) was explored for replacing SAC solders as a low-cost solution. In this study,BGAs with SAC105,SAC305,and BiSnAg balls were assembled with SAC105,SAC305 or 57Bi4 .. read more

The move to lead free (Pb-free) electronics by the commercial industry has resulted in an increasing number of ball grid array components (BGAs) which are only available with Pb-free solder bal .. read more

As lead-free alloys shift into high reliability electronics,the issue of tin whisker growth remains a primary concern among those in the industry. Current research shows that there is no perfec .. read more

A molded interconnect device (MID) is an injection molded thermoplastic substrate which incorporates a conductive circuit pattern and integrates both mechanical and electrical functions. The th .. read more

The companies writing this paper have jointly developed Copper (Cu) Pillar micro-bump and TCNCP(Thermal Compression with Non-Conductive Paste) technology over the last two+ years. The Cu Pillar .. read more

Nowadays,consumer electronic product is characterized with miniature,portable,light and high performance,especially for 3G mobile products. More and more fine pitch CSPs (0.4mm) come forth as t .. read more

Solder ball height inspection is essential to the detection of potential connectivity issues in semi-conductor units. Current ball height inspection tools such as laser profiling,fringe project .. read more

Increasing system integration and component densities continue to significantly reduce the opportunity to access nets using standard test points. Over time the size of test points has been dras .. read more

The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor .. read more

The number one issue identified by the 2009 iNEMI Boundary-Scan survey was problems with obtaining correct and compliant boundary-scan description language (.bsdl) files from the semiconductor .. read more

This iNEMI program's focus is on a “Chip” Built-in Self-Test (BIST) study and its promotion for board and system-level applications. In this case,This study has 2 strategic focus areas – short .. read more

Product quality can be improved through proper application of design for test (DFT) strategies. With today’s shrinking product sizes and increasing functionality,it is difficult to get good tes .. read more

Using micro-dispensing with exceptional volume control it is possible to print in 3D space a wide variety of materials and including solders,epoxies,conductive adhesives and ceramic filled poly .. read more

Polyester film substrates have been widely used in making flexible / printed electronic devices for over 30 years. However the early 2000’s brought about an explosion of interest in “additive” .. read more

The company is a producer of thin film batteries of less than 0.45mm in thickness. Battery operated devices have grown smaller and smaller while energy demands have increased as the need for in .. read more

Smart phones are complex,costly devices and therefore need to be reworked correctly the first time. In order to meet the ever-growing demand for performance,the complexity of mobile devices has .. read more

The choice and optimisation of underfills to maximise process productivity and end product performance has been widely studied,and generated numerous performance criteria,flow time cure schedul .. read more

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This paper documents test data on the effects of materials and processes on microvia structures. Thirteen sets of experiments were carried out to evaluate the effects of dielectric material,asp .. read more

The advancement of area-array packages,such as flip chips and chip scale packages,has driven the adoption of high density interconnects (HDIs) that allow for an increased number of I/Os with a .. read more

Reliability of Microvia has been a concern since microvias were introduced to our industry. This study was designed to understand the reliability of Type 1,Type 2,and Type 3 Microvias. Reliabil .. read more

Solder joint reliability of SMT components connected to printed circuit boards is well documented. However,much of the testing and data is related to high-strain energy thermal cycling experime .. read more

Remote sensing products designed for ocean environments sustain the harshness of cold oceans. The reliability of these telemetry devices needs to be very high to measure,collect and transmit da .. read more

Many researchers have used different failure criteria in the published solder joint reliability studies. Since the reported timeto- failure would be different if different failure criteria were .. read more

The PCB industry is ever changing and adapting to new technologies. OEM specifications and requirements have also advanced due to these technologies. In some cases the OEMs are asking for a low .. read more

Substrates have become more critical with regard to pitch and density in today’s designs with challenges for passive components in terms of surface placement. This negates the opportunity for h .. read more

With the push for ever improving performance on semiconductor component I/O interfaces,semiconductor components are being driven into a realm which makes them more sensitive to electrostatic di .. read more

The number of failures caused by electrostatic discharges (ESD) has been increasing for some time now. So,it is necessary for everyone,who handles electrostatic sensitive devices (ESDS),to know .. read more

In the area of Printed Electronics,there are a number of functional materials that can include conductors,Semi-conductors,dielectrics,barriers,and adhesives. There are also a smaller subset of .. read more

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Copper Via-Fill application in acid copper plating of PWB is experiencing a significant growth due to the booming of smartphone and tablet PC. With this growth,the PC board demand of HDI comple .. read more

In order to provide the functionality in today’s electronics,printed circuit boards are approaching the complexity of semiconductors. For flexible circuits with 1 mil lines and spaces,this mean .. read more

An IPC specification is a consensus document that specifies attributes relevant to the plated surface. Plating specifications are designed to be applicable to a wide range of products types. A .. read more

Higher-speed signal transmission is increasingly required on a printed circuit board to handle massive data in electronic systems. So,signal transmission loss of copper wiring on a printed circ .. read more

The printed circuit board assembly industry has long embraced the “Smaller,Lighter,Faster” mantra for electronic devices,especially in our ubiquitous mobile devices. As manufacturers increase s .. read more

Miniaturization and the integration of a growing number of functions in portable electronic devices require an extremely high packaging density for the active and passive components. There are .. read more

Cavity technology in a Printed Circuit Board (PCB) has existed for many years. The methodology to create the cavity in the PCB has evolved over time as technologies have advanced and the manufa .. read more

Transmission of data is a major driver in the electronics industry. Higher data volumes,high speed data transfer and short time signal transmission have to be realized to meet these requirement .. read more