Conformal Coating over No Clean Flux
As the proliferation of modern day electronics continues to drive miniaturization and functionality,electronic designers/assemblers face the issue of environmental exposure and uncommon applica
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Event
IPC APEX EXPO 2013
Reliability Assessment of No-clean and Water-soluble Solder Pastes Part I
Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature: two ways of cleaning were possible,either with solvent or by using wa
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Event
IPC APEX EXPO 2013
Liquid Flux Selection and Process Optimization for Selective Soldering Applications
There has been a rapid increase in the use of selective soldering equipment for PCB assembly
–Lower equipment costs
–Smaller equipment footprint
–Lower solder “inventory” cost (smaller pots)
–D
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Event
IPC APEX EXPO 2013
Halogen Free Solder Paste
•What is a halogen?
•Impact on the environment
•Halides and halogens
•Halides in electronics
•Halogens in electronics
•Definition of halogen free
•Technical challenges to remove halogen
•Curren
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Event
IPC APEX EXPO 2013
Lead-free Nanosolders and Nanowire Joining for Microelectronics/Nanoelectronics Assembly and Packaging
- Nanosolder on multi-segment nanowires have been successfully fabricated by electrodeposition method;
- Flux assisted environment enhanced reflow result and micron scale solder spheroids forme
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Event
IPC APEX EXPO 2013
The Last Will and Testaments of Tin/Lead and Lead-free BGA Voids
Conclusions:
•Tin/Lead BGAs: The location of the void within the solder joint was the primary root cause for the loss of solder joint integrity.
•Lead-free BGAs: The statistical analysis and th
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Event
IPC APEX EXPO 2013
Voiding Mechanism and Control in Mixed Solder Alloy System
•Transition to Pb-free soldering is incomplete for high reliability or high temperature applications
•For those not fully converted into Pb-free,mixed system is common due to lack of some Pb-co
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Event
IPC APEX EXPO 2013
Method to Measure Intermetallic Layer Thickness and Its Application to Develop a New Equation to Predict Its Growth
Lead Free Technology has brought new materials and different quality concerns to the Electronics Industry. For that,the creation of new methods to determine the quality of materials is needed a
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Event
IPC APEX EXPO 2013
Assembly Materials for High Temperature Application
Based on the trend for new technology in the automotive market including high power modules for e-mobility,and a combination of logic and power which will be developed for the future market wit
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Event
IPC APEX EXPO 2013
Reliability of Lead-Free LGAs and BGAs: Effects of Solder Joint Size,Cyclic Strain and Microstructure
An accelerated thermal cycle experiment comparing similarly constructed area array devices representing Land Grid Array
(LGA) and Ball Grid Array (BGA) technology with 0.254,0.30,and 0.40mm dia
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Event
IPC APEX EXPO 2013
Quantitative Analysis of Corrosion Resistance for Electroless Ni-P Plating
An electroless nickel (EN) layer is frequently used in various industrial applications. Commonly it is used as the barrier layer in electroless nickel/immersion gold (ENIG) as a solderability p
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Event
IPC APEX EXPO 2013
Simulation of Embedded Components in PCB Environment and Verification of Board Reliability
Embedded components technology has launched its implementation in volume products demanding for highest miniaturization level. Small modules with embedded dies and passive components on the top
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Event
IPC APEX EXPO 2013
Embedded Passive Technology
Embedded Passive Technology is a viable technology that has been reliably used in the defense and aerospace industry for over 20 years. Embedded Passive (Resistors and Capacitors) Technology ha
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Event
IPC APEX EXPO 2013
Warpage Optimization of Printed Circuit Boards with Embedded Active and Passive Components
Importance of the properties during curing:
- Curing analysis has to be carried in a PCB level to improve understanding warpage mechanism. Specially it is very important in a laminating process
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Event
IPC APEX EXPO 2013
Insertion Loss Comparisons of Common High Frequency PCB Constructions
Printed Circuit Boards (PCB’s) have been used for many years in low loss,high frequency microwave applications and many of these circuits have become increasingly complex. Often these complex c
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Event
IPC APEX EXPO 2013
Influence of Via Stub Length and Antipad Size on the Insertion Loss Profile
The growing transmission speed and volume of digital content increases the pressure on reduction of overall insertion loss of printed circuit boards permanently.
In today’s circuit boards,it is
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Event
IPC APEX EXPO 2013
Embedded System Access - a Paradigm Shift in Electrical Test
Throughout a product’s life cycle it may need to be tested various times. New product designs need to be validated during the prototyping phase,manufacturing defects need to be detected and dia
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Event
IPC APEX EXPO 2013
Why Signal Always Be Loss in a High Speed Frequency Transmission Line
The high speed transmission applications in the electronic product become inevitable developing trend. The signal integrity becomes the most important issue in the electronic industry. The mate
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Event
IPC APEX EXPO 2013
Advanced Second Level Assembly Analysis Techniques - Troubleshooting Head-In-Pillow,Opens,and Shorts with Dual Full-Field 3D Surface Warpage Data Sets
SMT assembly planning and failure analysis of surface mount assembly defects often include component warpage evaluation. Coplanarity values of Integrated Circuit packages have traditionally bee
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Event
IPC APEX EXPO 2013
Head in Pillow X-ray Inspection at Flextronics
Manufacturing technology faces challenges with new packages/process when confronting the need for high yields. Identifying product defects associated with the manufacturing process is a critica
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Event
IPC APEX EXPO 2013
Online Databse of Materials for Printed Electronics
Materials Registry for Printed Electronics
- WMU’s CAPE received an award from FlexTech Alliance to create an online database for accessing technical information on functional materials used in
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Event
IPC APEX EXPO 2013
Improving Yields and Quality: Two Case Studies: Graping and the Head-on-Pillow defect
HoP Mitigation is addressed with respect to solder paste,components,inspection,process and the environment.
Graping minimization recommendations are given with data driven suggestions.
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Event
IPC APEX EXPO 2013
Gravure Printing of ITO Transparent Electrodes for Applications in Printed Electronics
ITO nanoparticles were successfully printed on glass with the AccuPress Gravure System
•A wide range of sheet resistivity values was achieved with different engraving resolutions of the gravure
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Event
IPC APEX EXPO 2013
Printed & Flexible Electronics – Surf’s Up
Printed & Flexible Electronics
• Development Waves – 1st,2nd,and 3rd
• Essentials
• Products and Applications
• Technology and Infrastructure Development
• Printed & Flexible Electronics Pipeli
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Event
IPC APEX EXPO 2013
Mixed Metals Impact on Reliability
With the adoption of RoHS and implementation of Lead Free solders a major concern is how this will impact reliability. Both commercial and military hardware are impacted by this change even tho
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Event
IPC APEX EXPO 2013
Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu
As reliability requirements increase,especially for defense and aerospace applications,the need to characterize components used in electronic assembly also increases. OEM and EMS companies look
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Event
IPC APEX EXPO 2013
Assessment of Reterminated RoHS Components for SnPb Applications
The banning of Pb in electronic component termination finishes has flushed through the supply chain making it impossible in some cases for hi-reliability users to purchase Pb containing interco
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Event
IPC APEX EXPO 2013
The Coming of The MultiChip Module
MultiChip Module Status
•It isn’t a new idea since back in the 1980’s everyone was trying to combine different components into a single package
•It started with Hybrids then different forms of
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Event
IPC APEX EXPO 2013
BVA: Molded Cu Wire Contact Solution for Very High Density Package-on- Package (PoP) Applications
Stacking heterogeneous semiconductor die (memory and logic) within the same package outline can be considered for less complex applications but combining the memory and processor functions in a
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Event
IPC APEX EXPO 2013
Printed Circuit Structures,the Evolution of Printed Circuit Boards
The Printed Circuit Board (PCB) is the backbone of electronics and a large number of consumer devices. The challenge to put more function in a smaller space requires more components utilizing s
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Event
IPC APEX EXPO 2013
Cost effective 3D Glass Microfabrication for Advanced Electronic Packages
Interposer technologies are gathering more importance in IC packaging as the industry continues miniaturization trends in microfabrication nodes and IC packaging to meet design and utility need
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Event
IPC APEX EXPO 2013
TOF SIMS Analysis for SnxOy Determination on Lead-Free HASL PCB’s
During the production of Lead-Free Hot Air Solder Leveling (LF HASL),non-wetting issues in several components were found including BGA pad. The common visual aspect of the suspicious pads was t
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Event
IPC APEX EXPO 2013
Improving Density in Microwave Multilayer Printed Circuit Boards for Space Applications
The need in complexity for microwave space products such as active BFNs (Beam Forming Networks) is increasing,with a significantly growing number of amplitude / phase control points (number of
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Event
IPC APEX EXPO 2013
Behavior of Materials in the Manufacturing Environment
This study was conducted to understand seven materials reliability,behavior of Dielectric constant and Dissipation factor over medium to high frequencies. A modified version of HDPUG design was
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Event
IPC APEX EXPO 2013
Nanomaterials Performance Advantages in Printed Electronics Addressing Implementation Issues
Nanotechnology is a key enabling technology for printed electronics. Low temperature reactivity,reaction speeds,flexibility and fine pitch considerations dictate that nanomaterials should be gi
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Event
IPC APEX EXPO 2013
Phototonic Curing: Broad Implications in Printed Electronics
•Photonic curing uses high-intensity flash lamps to selectively heat target materials.
•The PulseForge tools are based on the patented use of photonic curing and are designed for use in develop
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Event
IPC APEX EXPO 2013
Development of Printed Flex Circuits
•Developments of Printed FPCs
- PE resist for long FPCs
- Flexible Touch Sensor Panel(TSP) application
- Single-sided Printed FPCs
- Double-sided Printed FPCs
- Smart Printed FPCs
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Event
IPC APEX EXPO 2013
The Effects of Human-Induced Contamination on PCB Assembly Electrical Reliability
With the ever-present pressure toward miniaturization in electronic devices,smaller distances between traces and component terminations are likely to increase the devices’ sensitivity to contam
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Event
IPC APEX EXPO 2013
Capillary IC – A New Platform for High Throughput or High Resolution Separations of Ionic Compounds
High pressure capillary IC allows you to:
Lower operational costs – water,waste,consumables
“Always Ready”
Improved system and analytical performance
Convenience
Rush samples
Enables high-resol
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Event
IPC APEX EXPO 2013
Cleanliness Assessment for Class III Lead-Free No-Clean Assemblies
For mission critical electronics or Class III products,such as those used within the military,aerospace and medical industries,highest electronic reliability is a requirement as failure is not
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Event
IPC APEX EXPO 2013
CO2 Clean Manufacturing Technology for Electronic Device Fabrication
CO2 technology offers electronic device manufacturers a robust platform for a variety of precision cleaning and machining
applications. Surface and substrate contamination such as flux residues
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Event
IPC APEX EXPO 2013
Electrical Test Conditions & Considerations
When testing PCBs it can be quite confusing as to what method to use,parameters are necessary for the Performance Class and what cost to associate in the build to way against the long term reli
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Event
IPC APEX EXPO 2013
Hi Pot Dielectric Breakdown Automated Verification How-To
The Printed Circuit Board (PCB) builds get ever more complex. With this the layer counts climb but the overall thickness remains the same. From this the cores of the build are reduced and the d
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Event
IPC APEX EXPO 2013
Two Print Stencils Systems
The Two print stencils process has been a very useful tool in SMT Assembly and Package Assembly. It is also useful in Assemblies that require mixed technologies; including SMT / Through Hole,SM
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Event
IPC APEX EXPO 2013
Profiled Squeegee Blade: Rewrites the Rules for Angle of Attack
For centuries,the squeegee blade has been used throughout many applications for depositing viscous materials through screens and stencils to transfer images on to substrates,from cloth material
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Event
IPC APEX EXPO 2013
Evaluating the Accuracy of a Nondestructive Thermo Couple Attach Method for Area Array Package Profiling
The oven recipe,which consists of the reflow oven zone temperature settings and the speed of the conveyor,will determine a specific time-temperature profile for a given PCB assembly. In order t
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Event
IPC APEX EXPO 2013
Military Applications of Flexible Circuits
1.Conventional Flex
2.Basic Materials
3.Failure Modes
4.HDI Flex
Summary,conventional builds
Cautions in Design
•Average or above Design Expertise Required
–PTH to close to edge of part
–Panel
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Event
IPC APEX EXPO 2013
Direct Determination of Phosphorus Content in Electroless Nickel Plating Using X-ray Fluorescence (XRF) Spectroscopy
Electroless plating processes are popular because of their performance,reliability and cost effectiveness. The process combines unique deposit properties such as uniform plating build up regard
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Event
IPC APEX EXPO 2013
Via Filling: Challenges for the Chemistry in the Plating Process
Copper filling of laser drilled blind micro vias (BMV´s) is now the standard production method for high density interconnects. Copper filled BMV´s are used as solder bump sites for IC packaging
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Event
IPC APEX EXPO 2013