IPC Conference Paper Archive

The structures of electronic components become smaller and smaller. 5 volts or smaller voltage of an electrostatic charge are enough to damage or change the structures in small electronic compo .. read more

The next generation miniaturised SMT devices waiting to make their mark will require the assembly community to re think their processes and toolsets. The feature sizes that are involved in this .. read more

Paste release characteristics are driven by the Area Ratio formula,which is based upon conventional stencil foil materials such as a variety of stainless steel alloys,nickel,etc. The surface en .. read more

Although QFN devices present a challenge to the SMT assembly process with proper stencil design,proper stencil technology selection (Laser,Electroform,Nano-Coat),and proper PCB solder mask layo .. read more

The next generation of smart phones will demand very thin multi-layer boards to reduce the product thickness again. This paper shows three different manufacturing approaches,which can be used f .. read more

•Two primary failure modes from trapped moisture: •Premature resin decomposition from incomplete resin cross-linking. •Explosive vaporization during high temperature thermal exposure. .. read more

Micro Trace Resistor Technology allows thin film resistors to be built within a printed circuit trace that is less than 100 microns wide. Using standard subtractive printed circuit board proces .. read more

In this work we report results of the fracture toughness of a high thermal stability resin system toughened by The Dow Chemical Company proprietary particulate-type toughening material. Results .. read more

•Voiding of QFN a concern due to large thermal pad,low standoff,and many thermal via •Divided thermal pad preferred,with SMD better than NSMD •This work focus on systematic study on effect of S .. read more

Eutectic god-tin (Au80Sn20) is widely used as the die-attach material for making radio-frequency (RF) and microwave devices. The metallic bonding is typically achieved by soldering using a gold .. read more

Circuit complexity and density requirements continue to push PCB fabrication capability limits. Component pitch and routing requirements are continually becoming more aggressive and difficult t .. read more

The thermal stability of silicone polymers,fluids and resins has been well documented and studied extensively. The high temperature performance of silicone adhesives and sealants used for elect .. read more

The use of plasma processing in the manufacture of electronics is growing as we discover more and more applications for this technology. It is now common for plasma etching and cleaning to be u .. read more

The portable electronics market has driven steep-slope growth for over a decade and continues to deliver amazing handheld electronic devices; manufacturers of these products are facing challeng .. read more

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Multi-layer organic laminates which make up over 90% of the present types of interconnecting substrates in today’s electronics can develop a loss of insulation resistance between two biased con .. read more

A new non-halogen flame retardant has been developed and is useful for a variety of high performance applications. This non-reactive phosphorus-based material satisfies fire safety needs for a .. read more

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Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is even more crucial in today’s packaging,due to the high ratio of passive components .. read more

Examination of historical data for a defunct electronics manufacturing plant in Ontario,Canada has allowed the determination of the potential global warming contribution by the plant for the ye .. read more

Electronic assembly innovations drive more performance using highly dense interconnects. Assembly residues may increase the risk of premature failure or improper functionality. The challenge fo .. read more

The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performan .. read more

QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges includ .. read more

Lead-free assembly has introduced many challenges and non-conformances. One of the more troubling non-conformances is “Pad Cratering”. Pad cratering is when the copper pad completely separates .. read more

The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of co .. read more

Recent advances in polymer science and nanomaterials have fueled a frenzy of scientific activity in multifunctional coatings and films. This rich subject area encompasses several scientific dis .. read more

TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materia .. read more

There has been increasing interest in the development of capillary ion chromatography (IC) systems and methods for determination of ionic species. The practice of ion chromatography in capillar .. read more

Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed a .. read more

The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG h .. read more

Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advan .. read more

There are a variety of stencil approaches in which the new product process engineer can deal with the assembly of both high solder paste and low solder paste volume in an SMT assembly environme .. read more

Electronic Assemblies are cleaned in order to remove contaminations that may affect yields,service life and reliability. Highly dense interconnects entrap flux residues under the Z-axis. Volati .. read more

Lead-free solder is more than a swap for SnPb and more than simply an alternative alloy. Five years after implementation discussion remains regarding which alloy is the best for which applicati .. read more

With the miniaturization of components in the semiconductor industry,the need for specialized solder pastes with finer powder mesh sizes for package-on-package (PoP) assemblies has become imper .. read more

Executive Summary There are many issues to consider when developing a new circuit material for the PCB industry. It is a given assumption that the new material must be compatible to standard PC .. read more

Companies that have initiated internal resources to obtain compliance data have realized that collecting,and more importantly,maintaining the currency of that data requires more resources than .. read more

- Live Cycle Assessment - Early Product Analysis / “DFX” Challenge - Keys to Scaling #1: Processes and Systems - Systems can Extend “Traditional” LCA - Keys to Scaling #2: Data Exchange Standar .. read more

Pure tin is a common finish for copper hook up wire,coaxial cable,ground braid and harness assemblies used on electronic assemblies. Historically there have been fewer reports of whisker growth .. read more

Twenty-nine different cells phones have been disassembled,ground up,dissolved and analyzed for elemental content,mainly for information about the metals present in the phones,but also for some .. read more

Compliant press-fit zones apply external mechanical stress to copper and tin surfaces of plated through holes at printed circuit boards during and after performing the press-in process. This ex .. read more

The physical mechanisms behind tin whisker formation in pure tin (Sn) films continue to elude the microelectronics industry. Despite modest advances in whisker mitigation techniques (i.e.,barri .. read more

Many companies use “one stop testing” as a solution to the test issues in a manufacturing environment rather than discrete “islands of test”. Low volume,high mix electronic manufactures are con .. read more

Test point optimization for the PCB electrical test domain brings the test speed faster for the flying probe tester (FPT), and the fixture cost lower for the fixture type tester. The importance .. read more

The world of spring-loaded test probes and special probes for in-circuit and functional tests have grown tremendously over the past few years. Ever increasing demands for electro mobility appli .. read more

Voids in solder joints are representing one of the main problems especially for power electronics. A low and homogeneous thermal resistance of solder joints is demanded for a quick and uniform .. read more

Prior to committing production boards to vapor phase soldering,we performed an evaluation to assess reliability and evaluate the vacuum soldering option. The reliability of vapor phase processe .. read more

A joint project between Flextronics Inc. and North Star Imaging Inc. is being conducted to correlate current x-ray imaging and cross-section analysis of BGA voiding with state of the art high r .. read more

A great deal of work has already been done to determine the equilibrium temperature of a PCB when exposed to a heat source such as the thermal environment of reflow soldering. This study will g .. read more

Working through the New Product Introduction (NPI) flow between the product design and manufacturing is usually a challenging process,with both parties being experts in their own fields and ine .. read more