IPC Conference Paper Archive

Underfilling is a long-standing process issued from the micro-electronics that can enhance the robustness and the reliability of first or second-level interconnects for a variety of electronic .. read more

The electronic industry is currently very interested in low temperature soldering processes such as using Sn/Bi alloy to improve process yield,eliminate the head-in-pillow effect,and enhance re .. read more

The old tactic of outsourcing to a low cost geography simply to deliver lowest cost direct and indirect labor was never a panacea supply chain solution. In fact,when evaluating solutions for lo .. read more

For many years,manufacturing has sought to increase competitiveness by moving off-shore to countries with lower labour costs. Electronic manufacturing services (EMS) companies provided an essen .. read more

The oxide layers are known as wetting inhibitors in component and PCB metallizations. The oxide acts as barrier that prevent the tin diffusion from happening. Besides,in corrosion studies,the r .. read more

Head-In-Pillow (HIP) defects,in which the BGA solder balls and paste deposit come in contact but do not coalesce,have proven to be a major problem since transitioning to RoHS soldering. Compone .. read more

The iNEMI technical subcommittee on creep corrosion is developing a flowers-of-sulfur (FOS) based qualification test for creep corrosion on printed-circuit boards (PCBs). In phase 1 of the proj .. read more

In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6,10 and 50 mil spacing): 12 ionic con .. read more

Conformal Coatings are often used to increase the reliability of electronic assemblies operating in harsh or corrosive environments where the product would otherwise fail prematurely. Conformal .. read more

As consumers become more reliant on their handheld electronic devices and take them into new environments,devices are increasingly exposed to situations that can cause failure. In response,the .. read more

Advances in miniaturized electronic devices have led to the evolution of microvias in high density interconnect (HDI) circuit boards from single-level to stacked structures that intersect multi .. read more

This paper describes the purpose,methodology,and results to date of thermal endurance testing performed at the company. The intent of this thermal aging testing is to establish long term reliab .. read more

The use of microvias in Printed Circuit Boards (PCBs) for military hardware is increasing as technology drives us toward smaller pitches and denser circuitry. Along with the changes in technolo .. read more

Many opportunities exist for flexible circuits in high temperature applications (Automotive,Military,Aerospace,Oil and Gas). Flex circuits in these applications have been hindered by a lack of .. read more

Pad cratering failure has emerged due to the transition from traditional SnPb to SnAgCu alloys in soldering of printed circuit assemblies. Pb-free-compatible laminate materials in the printed c .. read more

Thermal management is a critical element in the design and manufacturing of printed circuit boards (PCBs) for a wide range of applications. Quite simply,heat can be destructive. The more effect .. read more

The paper will propose to present a technology for the fabrication of Printed Circuit Boards (PCBs),used primarily in high-power RF/millimeter wave applications,which involves the use of a ther .. read more

The electronics industry is driven by constant technological changes,which have brought improved innovative products to the marketplace. These advances have placed high demands on material perf .. read more

In technology tendency,signal integrity performance gets more critical upon today’s higher signal transmission speed and quantity demand in every field of applications such as computer CPU and .. read more

This paper examines the use of Light Interferometry and the relevant parameters used to measure copper surface roughness before and after oxide alternative. Also discussed are the limitations a .. read more

Modern consumer electronics are driving the adoption of smaller featured SMT devices such as 0.4 mm or smaller pitch CSP,and 01005’’ / 0402 metric discrete devices. Already roadmaps have been s .. read more

To keep up with shrinking system volume requirements for the Internet of Things and wearable devices while maintaining maximum device functionality requires an integrated approach to SoC and Si .. read more

The world of electronics continues to increase functional densities on products. Many of the miniaturization technologies were developed for the consumer market with the smart phone specificall .. read more

In the past 20 yrs the solvent industry has gone through a great deal of change. In the early 1990s,CFC-113 and 1,1,1-trichloroethane were the workhorses of the industry. The Montreal Protocol .. read more

On January 1,2015,nine months from APEX 2014,the production and use restrictions on HCFC-225 will be in effect throughout the United States. This phase out is encompassing in scope. This phase .. read more

Historically,the determination of the concentration of cleaning agent in high precision electronic cleaning baths has depended on any one of several possible measurable parameters. Refractive I .. read more

The functional reliability of electronic circuits determines the overall reliability of the product in which the final products are used. Market forces including more functionality in smaller c .. read more

RoHS legislated restrictions on the materials used in electronics manufacture have imparted significant challenges on the electronics industry since their introduction in 2006. The greatest imp .. read more

The ever expanding growth in the use of insulated metal substrates (IMS) in power electronics requires a focus on material and mechanical configuration for each application. By optimizing the m .. read more

With increasing power loss of electrical components,thermal performance of an assembled device becomes one of the most important quality factors in electronic packaging. Due to the rapid advanc .. read more

There has been recent activity and interest in Laser-Cut Electroform blank foils as an alternative to normal Electroform stencils. The present study will investigate and compare the print perfo .. read more

The goal of this study was to develop a method by which stencil aperture wall quality can be inspected,and the results quantified. Additionally,we hope to establish a correlation between the st .. read more

Stencil nanocoatings have demonstrated significant improvements in numerous aspects of solder paste printing,including print yield,transfer efficiency,print definition and under wipe requiremen .. read more

Pad cratering is an important failure mode besides crack of solder joint as it’ll pass the regular test but have impact on the long term reliability of the product. A new pin pull test method w .. read more

Pad cratering test methods have been under development with the emergence of this laminate fracture defect mechanism. In additional to ball shear,ball pull,and pin pull testing methods,the acou .. read more

With the electronic industry moving towards lead-free assembly,traditional SnPb-compatible laminates need to be replaced with lead-free compatible laminates that can withstand the higher reflow .. read more

As the Electronic Manufacturing Services (EMS) industry makes a push to bring manufacturing back to the United States it is clear that automation is necessary in order to keep prices competitiv .. read more

In the fast developing electronic industry the demands for production equipment are changing rapidly as well. The industry is looking for both,stable production processes and automated procedur .. read more

The SMT industry’s one constant is change. Standards are continually updated and components are miniaturized for space savings. In addition to the changes that come,the industry is also faced w .. read more

Nanomaterials have shown great promise in various applications including nanoelectronics and devices. However,in order to achieve large-scale nanoelectronics assembly and manufacturing,the deve .. read more

While the density of chip-to-chip and chip-to-package component interconnections increases and their size decreases the ease of manufacture and the interconnection reliability are being reduced .. read more

The Advanced Technology Center of the Lockheed Martin Corporation has developed a nanotechnology enabled copper-based electrical interconnect material that can be processed around 200 °C. The r .. read more

The electrochemical short,Conductive Anodic Filamentation,that that can develop within a PCB can be difficult to diagnose and detect,and there are many material and process issues that can lead .. read more

The onset of copper barrel cracks is typically induced by the presence of manufacturing defects. In the absence of discernible manufacturing defects,the causes of copper barrel cracks in printe .. read more

Conductive filament formation or CAF typically occurs in two steps: degradation of the resin/glass fiber bond followed by an electrochemical reaction. Bond degradation provides a path along whi .. read more

During the last period of newly assembled electrical devices (pcbs),new component types like LGA and QFN were also qualified as well as smaller passive components with reliability requirements .. read more

Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa .. read more

Looking back twenty-five years ago,the solder pastes residues had to be cleaned after reflow due to their corrosive nature; two ways of cleaning were possible,either with solvent or by using wa .. read more

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An estimated 80% of all SMT assembly in the world is performed with a no-clean soldering process,largely due to the predominance of consumer-type electronics. The continuing trend of increasing .. read more