Jetting of liquids is becoming the standard in our industry. MYDATA has developed a unique tool to jet solder paste. This non-contact method of applying solder paste has a large number of advantages compared to standard screen printing or dispensing. The challenges of today’s production environment are not only the fact that components getting smaller but the biggest challenge is the combination of small and large components on the same board. Putting the right amount of solder paste for each component will be required to deliver the right quality. The jetting technology allows to build up the volume by single dots to achieve the right amount for each component. Special applications like pin in paste,applying paste in cavities and many more challenges of today’s requirement can be easily accommodated with this technology. Practical production challenges will be covered and a suggested solution will be provided.

The case of processing issues with Electroless Nickel/Immersion Gold (ENIG) is well documented,even as it endures as a very popular surface finish. Certainly the market says that quality ENIG has some advantages over other surface finishes. This presentation will present data surrounding the question of whether best practice process control and quality assurance are sufficient to ensure reliable solderability after multiple reflow cycles. Or is it perhaps a frequent case of bath longevity and process capability being oversold?
This presentation will also address mitigation strategies such as:
Ni bath control (fewer MTOs)
XRF control charting
The new IPC spread test solderability “W” coupon after reflow preconditioning

Moisture poses a significant threat to the reliability of microelectronic assemblies,especially for scientific research products that are designed for marine environment and can be attributed as being one of the principal causes of many early-life failures. The presence of moisture in plastic packaging alters thermal stress through alteration of thermo-mechanical properties like,change of elastic modulus,shear strength and glass transition temperatures. Moisture also induces hygroscopic stress through differential swelling,reduces interfacial adhesion strength,induces corrosion and acts as an unwanted resistance when present between the two nodes of component and result in lowering the resistance which results in faster depletion of budgeted power. In this study,an analytical model was developed and validated both by experiments and simulation to determine the ingress rate of the moisture through bi-material interface. Moisture diffusion ingress rate is calculated and validated through finite element modeling. After calculating diffusion coefficients of the two polyurethane materials,moisture ingress rate was calculated using analytical model and also simulated through finite element analysis. The diffusion coefficient was experimentally determined using absorption data (Mt/M8) by weight gain experiment as prescribe in ASTM D570 method. Once the diffusivity coefficient is known,theoretical Fickian curve is plotted with the experimental data to see if the absorption is Fickian or not. For very prolonged times,curve becomes non-fickian,therefore,diffusion coefficient is calculated by considering only the linear part of the curve. The 99% saturation approach helps to define the limit of Fickian diffusion hence eliminate error caused by non-fickian absorption. Since the Fick’s moisture diffusion equation follows the same governing differential equation as the diffusion of heat,with a change of the dependent variable,temperature,with moisture concentration and the thermal diffusivity with moisture diffusivity,commercially available heat transfer simulation software can by used to solve transient moisture diffusion problem. However,a unique problem arises in the diffusion of moisture. Since diffusion coefficient is constant for particular material,for bi-material analysis,interfacial concentration discontinuity cannot be analyzed as an interfacial discontinuity result where two materials having different saturated concentrations are joined. The results of ingress rate through FEA simulation came close to the calculated values hence validating the model.

There has been increasing interest in the development of capillary ion chromatography (IC) systems and methods for determination of ionic species. The practice of ion chromatography in capillary format offers a number of advantages. Because the eluent consumption is very low,capillary IC systems can be operated continuously and thus are always on and always ready for analysis. Capillary IC systems offer improved compatibility with applications where amount of sample is limited. Capillary IC systems provide improved performance for determination of target analyses at trace levels. The use of capillary columns can improve separation efficiency and/or speed. The operation of capillary IC systems at low flow rates improves the system compatibility with a mass spectrometer. In addition,the use of capillary separation columns opens the door for the possibility of offering new selectivity for difficult applications using new columns packed with stationary phases which are more costly and difficult to prepare.

TLPS materials are an attractive alternative to PbSn for IC power device packaging. They provide a low VOC composition,lead free die attach solution that meets the RoHS guidelines. TLPS materials also demonstrate the desired electrical and thermal reliability properties demanded by these devices. Industry changes to green compositions and cleaner assembly materials normally draw great cost increases due to change of operation. TLPS materials are managing the technical properties for conductivity and thermal drain at lower costs than the precious metal-containing materials being offered today as Pb-free die attach options for IC power device packages.

Recent advances in polymer science and nanomaterials have fueled a frenzy of scientific activity in multifunctional coatings and films. This rich subject area encompasses several scientific disciplines,ranging from chemistry,physics and engineering,to biology and medicine. We present a polymer composite large-area coating method designed to impart desirable surface functionalities (such as super-repellency to liquids,or electrical conductivity) to substrates ranging from glass and metals,to porous or flexible materials. The wet-based approach relies on combining a polymer matrix in solvents with other materials to enhance adhesion and allow micro/nanoparticle filler dispersion. The advantage of the technique lies in its inherent ability to impart multiple functionalities by adding the proper ingredients to the solution,which is deposited on the target surface by spray,ink jet or other techniques. The approach combines tunable surface energy with micro-to-nano scale roughness,a necessary condition for super-repellent behavior towards water,oils and alcohols. In some coatings,super-repellency is combined with self-cleaning ability,which is effected by low droplet roll-off angles. We demonstrate thin coatings with controllable micro/nanostructure,liquid repellency,and electromechanical properties,combined with good mechanical or environmental durability. Several examples (including elastomeric,electrically conducting and icephobic coatings) demonstrate the potential of the method. We also discuss patterning of such coatings with spatial resolution approaching the micrometer regime. The present multifunctional nanocomposite coating technology appears well suited for the electronics industry; the coatings can be tuned for different functionalities and processed using large area deposition processes (e.g. ink jet and atomized spray). The coatings can be chemically designed to provide optimal adhesion to both rigid and flexible printed wiring boards.

The purpose of this presentation is to provide considerations for selection of conformal coatings into electronics assembly operations. The types of testing required for selection and use of coating will be presented. Challenges and difficulties of implementation will be discussed. The overall impact of conversion from coating types will be presented.

Lead-free assembly has introduced many challenges and non-conformances. One of the more troubling non-conformances is “Pad Cratering”. Pad cratering is when the copper pad completely separates from the laminate. The separation may occur outright at assembly or as the result of the field failure scenario detailed above. Pad cratering is the result of the technology exceeding the
capabilities of the materials.
To date there has been no solution to the problem of pad cratering,until now. Integral Technology has developed a solution that has the potential to minimize if not eliminate pad cratering. Integral’s solution is a material called Zeta Cap®. Zeta Cap® is a high performance polymer film that is capable of withstanding high temperatures. It has no woven fiber-glass thus making it CAF resistant.
It can be used in combination with current technology as an additional material layer between the outer layer foil and outer most dielectric. Zeta® has a high mechanical strength and flexibility compared to other lead-free compliant laminate materials.
Integral Technology’s Zeta® Lam,Zeta® Bond and Zeta® Cap (patents pending) are breakthrough materials for the PCB industry. The portfolio of Zeta products was spawned as a direct result of conversations with OEM’s and suppliers about how to expand product lines and solve problems. The original idea was to solve the problem of pad cratering (http://en.wikipedia.org/wiki/Pad_cratering). This silent and increasing threat to the electronics business can be eliminated by using Zeta® Cap on the PCB. The industry is enthusiastically embracing Zeta® Cap and its growth in the marketplace is a direct result of all stakeholders focusing on a solution to an emerging industry problem. Integral has evolved the product portfolio from Zeta® Cap alone to include Zeta® Lam and Zeta® Bond,giving Zeta customers’ new opportunities with High Density Interconnects. Zeta® Cap,Zeta® Lam,and Zeta® Bond are fiberglass free laminate and bonding materials that meet the needs of the next generation of electrical,mechanical and thermal demands due to the fact they are thin,high Tg,Low Dk and Low Df materials.

QFN’s offer advantages in reducing size and weight and have excellent thermal and electrical Conductivity related to the ground plane. QFN’s also present printing and assembly challenges including package floating during reflow and the very small stencil aperture area ratio’s resulting from the narrow and short pad design of the packages. This presentation will review stencil design aimed at improving the QFN printing and assembly process,QFN repair options will also be presented

The presentation will discuss the problems that many QFN users are dealing with by having flux trapped under the component that is still gooey and conductive and the effect on circuit performance of sensitive circuits. The reason why the QFN traps show much flux and why the need for a standoff to lift the component off the board surface using soldermask and via plugging. This comparison will be evaluated using localized C3 steam extractions and Ion Chromatography analysis of the two conditions.