IPC APEX EXPO 2021 Goes Virtual

Digital event delivers new opportunities to learn, connect and collaborate

IPC APEX EXPO 2021 will be offered virtually, March 8-12, 2021.

“Given ongoing COVID-19 health and safety concerns and continued restrictions for large gatherings and events in California, it was not feasible to safely convene the nearly 9,000 expected participants at IPC APEX EXPO 2021,” said IPC President and CEO John Mitchell. “The event will now take place in a safe, all-virtual format.”

While the event is going virtual, IPC APEX EXPO will still be the place to connect, collaborate and learn as the event’s virtual platform will allow attendees, exhibitors and speakers to easily navigate more than 100 technical conference sessions and professional development courses as well as product demonstrations, and schedule one-on-one meetings with exhibitors. As an added bonus, technical conference sessions will be available to registered attendees for replay, providing a unique opportunity to take advantage of education for 90 days after the event.

And rounding out the immersive experience, attendees can attend multiple keynotes, a “meet and greet” with IPC Hall of Famers and Emerging Engineers, participate in a virtual trivia event, and learn about cutting edge products and technologies during daily exhibitor new product introductions.

Mitchell added, “Be it in person or via an online platform, it is IPC’s goal to maintain IPC APEX EXPO’s position as the premier event for the electronics manufacturing industry, providing practical applications for learning – knowledge that attendees can immediately apply to their work and as well as far-reaching insights that can be applied toward implementing future technologies. Wherever in the world you may be located, IPC APEX EXPO 2021 is the place to be.”

Registration for IPC APEX EXPO 2021 is expected to open December 17. To view schedule at a glance and exhibitor list, visit www.ipcapexexpo.org. IPC APEX EXPO will return to an in-person format in 2022 and will take place January 25–27, 2022 at the San Diego Convention Center.

WHMA 28th Annual Wire Harness Conference Cancelled Due to COVID-19 Concerns

WHMA and IPC news release header

For nearly three decades, Wiring Harness Manufacturer’s Association (WHMA) staff and Board members looked forward to connecting with attendees, exhibitors and speakers at its annual wire harness conference, but given escalating concerns with COVID-19 infection rates, event organizers have cancelled the 2021 WHMA 28th Annual Wire Harness Conference.

“Though our 2021 conference will no longer take place in the way we intended, we remain committed to the wire harness community and are planning a virtual event on February 17, complete with speakers who will present on wire harness industry economics, new technologies and more,” said David Bergman, WHMA executive director.

Added Rick Bromm, WHMA chair, “Though not a replacement for the annual conference that so many have come to rely on for their education and business needs, we hope the virtual event will still provide an opportunity for attendees to learn, grow, share, and discover new approaches to the many aspects of our dynamic industry. We will provide updates as progress is made on this virtual event. For those who desire an in-person event, WHMA/IPC are partnering with the Wisconsin Center to produce the 2021 Electrical Wire Processing Technology Expo (EWPTE) in Milwaukee, Wisconsin. Workshops, conference and exhibition are planned for May 11-13.”

WHMA Annual Conference dates for 2022 are still being finalized but event location and venue remains unchanged and will take place at the Westin La Paloma Resort & Spa in Tucson, Ariz. For additional information on the February 17 virtual event, visit www.whma.org.

Statement from IPC President and CEO John Mitchell on Final Passage of National Defense Authorization Act

Statement from John Mitchell, IPC president and CEO:

“President Trump's threat to veto the National Defense Authorization Act (NDAA) unless it includes a repeal of Section 230 imperils passage of legislation critical to U.S. military readiness. Tying an unrelated, controversial legislative priority related to liability for content posted on online platforms to the must-pass defense bill creates an unnecessary game of political chicken where, regardless of the outcome, the American people lose.

“IPC urges President Trump and the members of Congress to stay focused on the issues central to the nation’s defense with the goal of enacting the NDAA into law next week.”

IPC Releases IPC-2581 Revision C, Generic Requirements for Printed Board Assembly Products Manufacturing Description Data and Transfer Methodology

Heralds Design-through-Manufacturing 4.0

IPC-2581C, Generic Requirements for Printed Board Assembly Product Manufacturing Description Data and Transfer Methodology is the eagerly anticipated update of IPC’s widely adopted global standard for PCB design through manufacturing data flow. Revision C introduces groundbreaking new features, automation supporting Industry 4.0, and bidirectional DFX intelligence capability that eliminates the time-consuming back and forth between design house and manufacturers before production can begin.

As technology in the industry progresses, including the latest additive processes with embedded components within the PCB, the IPC-2581 committee of experts has introduced support for the latest technologies, representing every aspect of modern PCB design. Updates include overhauled support for rigid flex, embedded components, cavities, coins, attenuation parameters, connector ports, pin polarities, edge plating, countersink/counterbore, square drill, and intended net-shorts.

Ensuring that all related data is in digital form, IPC-2581 represents the method of choice for automation between design and manufacturing, significantly surpassing proprietary and legacy formats.

As a specific highlight, revision C includes the bi-directional DFX data exchange through which feedback between design and manufacturing is conveyed and tracked before manufacturing begins.

“DFM checking and resolution can be a frustrating and time-consuming process that poses little overall benefit for our customers” said Greg Link, FAE manager for WUS Printed Circuits. “IPC-2581 revision C addresses the need for a collaborative, executable exchange for DFM issues eliminating spreadsheets, PowerPoints, and emails, accelerating new product introduction for our customers."

“As the industry continues to move toward digital data exchange, the timing is right for the technology behind IPC-2581C to bring the opportunity for critical savings and efficiencies in engineering workload. The update benefits both design and manufacturing, supporting agility and responsiveness within the holistic electronics manufacturing process,” stated Matt Kelly, IPC chief technologist.

“IPC-2581C is also a major component of the digital twin architecture and strategy, setting the standard for interoperability between different digital twin solutions, bringing maximum value from data,” Kelly added. “IPC-2581 revision C is much more than an incremental update, providing the industry’s only fully digitalized and automated data exchange. It is ready to be a critical part of any PCB fabrication and assembly manufacturing smart factory strategy.”

For more information or to purchase IPC-2581C, visit the IPC Online Store.

WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2021

Deadline for abstracts and proposals: January 5, 2021

WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit technical conference abstracts for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 11-13, 2021 at the Wisconsin Center in Milwaukee, Wis.

Expert technical presentations are being sought in the following areas:

  • Case Studies on A-620 Success
  • Quality Requirements
  • ESD Impacts on Harness
  • ESD Transmission through Harnesses
  • High Frequency Cabling
  • X-ray Inspection Techniques
  • Crimping Challenges/Dos and Don’ts
  • Crimp Cross Sectioning
  • Wire Harness Troubleshooting
  • Reliability Issues and Failure Analysis
  • Wiring Harness Education and Training
  • Connector Advances
  • Tooling
  • Process Equipment/Productions
    Calibration
  • Ultrasonics Splicing and Terminating
  • Harness Design Drawings
  • Engineering
  • Overmolding
  • Testing – Electrical/Environmental/
    Mechanical
  • Electric Vehicles (EV)/Electric Mobility
  • Cleanliness and FOD
  • Wiring Harness Rework

          An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest, and contain appropriate technical test results. Final selected presentations will be limited to 30 minutes. Technical conference paper abstracts and course proposals are due January 5, 2021. To submit an abstract or course proposal, contact David Bergman, WHMA executive director and IPC vice president, standards and technology, at DavidBergman@ipc.org.

          For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact KimDiCianni@ipc.org or AliciaBalonek@ipc.org.

IPC Day EMS 2020-EMS Day and Beyond

Date
- (2:00 - 7:00am CST)

Presented by IPC Europe and Estonian Electronics Industries Association

10:00-15:00 (UTC +2)

Detailed agenda currently shows (Local Estonian Time) :
• 10.00 – 10:15 Gathering
• 10:15 - 10:25 Welcome and Introduction, Viljar Lubi, Deputy Secretary General of Ministry of Economic Affairs and Communications, Otto Pukk, Chairman of Estonian Electronics Industries Association
• 10:25 – 11:10 The European EMS Industry, structure, development and future, Dieter G. Weiss, in4ma EMS

Market Statistics
• 11:10 - 11:40 Nordic and Baltic Industries During Corona Crisis, Tõnu Mertsina, Swedbank
• 11:40 - 12:10 Estonian Electronics Industry, Arno Kolk, Managing Director of the Estonian Electronics Industries Association
• 12:10 – 12:40 Lunch Break
• 12:40 – 13:00 Electronic Engineering, tbc,
• 13:00 - 13:20 Scanfil - vertically integrated EMS, tbc, Scanfil
• 13:20 - 13:40 OEM View - Why We Built Our Own Factory, Kristjan Maruste, CEO and Co-Founder of

Comodule
• 13:40 - 14:00 Recycling in Electronics Industry, Raido Oras, COO of Kat Metal
• 14:00 - 14:30 Electronics Industry in Latvia, Normunds Bergs, President of LETERA
• 14:30 - 14:50 IPC Green Standards
• 14:50 - 15:00 Wrap up

 

Estonian Electronics Industries Association

Akadeemia tee 23
12618 Tallinn Estonia
Estonia