Calumet Electronics Earns IPC-1791 QML Recertification

Calumet Electronics further positions itself as an industry leader in printed circuit board and IC substrate engineering for the defense industry with its recent IPC-1791 Qualified Manufacturers Listing (QML) recertification. This designation affirms Calumet's commitment to securing trusted domestic supply chains within the U.S. electronics industry, a critical component of rebuilding and restoring the U.S. industrial base. Calumet Electronics was one of three pilot companies to earn the accreditation when the standard was first introduced.

"Trust is an absolutely critical component of our partnerships with defense OEMs and the Department of Defense," said Todd Brassard, Calumet Electronics VP/COO. "The IPC-1791 QML offers additional evidence of our readiness and ability to handle the most sensitive information and technologies."

IPC standards such as IPC-1791 QML help ensure superior quality, reliability, and consistency in electronics manufacturing. To achieve the status of a trusted supplier, manufacturing facilities are rigorously vetted and undergo an intensive audit process. Stringent requirements for this certification include reviews of a company’s systems, including product and quality, supply chain risk management, facility security, cybersecurity (NIST 800-171), and compliance to export control laws such as ITAR and EAR.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to recognize Calumet Electronics for continuing to be a member of IPC's network of trusted QML suppliers with their re-qualification as a IPC-1791 trusted fabricator."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.  

"APCT Inc. Earns IPC-1791, Qualified Manufacturers Listing (QML) as Trusted Electronics Fabricator "

IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronics Fabricator Requirements Qualified Manufacturers Listing (QML) to APCT Inc.'s printed circuit board (PCB) manufacturing facilities in Anaheim and Orange County, Calif.  

Following initial audits by IPC, both facilities passed stringent Type 2 fabricator requirements, helping to optimize product quality, reliability, and consistency across the entire manufacturing operations, earning both facilities a spot on IPC’s global network of rigorously vetted, trusted sources.

Requirements for certification and QML listing to IPC-1791 includes product and quality system, supply chain risk management system (SCRM), security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system (ChoC) review.

Steve Robinson, CEO of APCT Inc. commented on the accomplishment, “APCT is dedicated to the protection of CUI data and the trusted printed circuit board manufacturing needs of our customers. We strive to deliver best in class solutions with our industry leading cycle times, technology and service, as we support the current and future needs of our highly diversified and expanding customer base.”

IPC's Validation Services QPL/QML Program was developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards. The IPC-1791 QML verifies security systems and recognizes companies for either trusted electronic designer, fabricator, or assembler ensuring a high level of integrity.

"IPC's Validation Services Audit Programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize the APCT Inc. facilities in Anaheim and Orange County, California on becoming members of IPC's network of trusted QML suppliers."        

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.   

IPC Hand Soldering Competition - Regional Qualification - UK

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IPC would like to invite you to join the United Kingdom regional qualification for the IPC Hand
Soldering Competition (HSC) to be held at Southern Manufacturing and Electronics, Hall #1 –
Stand# M100 from 8 to 10 February 2022. Skilled soldering experts (F/M) will be competing
during 60 minutes on a complex circuit board assembly to win the 2022 United Kingdom
National title, earn a cash prize and a coveted spot at the IPC Hand Soldering World
Championship.

Farnborough International Convention Center - Regional HSC Competition - UK

Show Centre, Etps Road
Farnborough
GU146FD
United Kingdom

Farnborough International Convention Center - Regional HSC Competition - UK

Farnborough International Convention Center - Regional HSC Competition - UK
Show Centre, Etps Road
Farnborough, GU146FD
United Kingdom

Best Technical Papers at IPC APEX EXPO 2022 Selected

Expanded technical conference award categories include NextGen and Student Research

The best technical conference papers of IPC APEX EXPO 2022 have been selected. Voted on by members of the IPC APEX EXPO 2022 Technical Program Committee (TPC), the paper authors will be recognized during show opening remarks on Tuesday, January 25.

“The TPC is absolutely focused on providing highest quality content to the technical conference,” said Matt Kelly, IPC chief technologist. “This commitment to quality is reflected in this year's selection of Best of Conference, NextGen, and Best Student Research papers. We extend our congratulations to all the award winners."

Taking top honors in the Best of Conference category, the winning papers are:

  • “Analysis of a Dynamic Flexed Flat Cable Harness” by Bhanu Sood, Ph.D., NASA Goddard Space Flight Center. His co-authors are Mary E. Wusk, Eric Burke, Dave Dawicke, George Slenski, NASA Langley Research Center; and Stephen Lebair, NASA Goddard Space Flight Center. This paper will be presented during Technical Conference Session 7 on Tuesday, January 25.
  • “Microvia Reliability Testing Utilizing D-Coupons to Understand Best Design Practice” by Kevin Kusiak, Lockheed Martin. This paper will be presented during Technical Conference Session 2 on Tuesday, January 25.
  • “A Critical Analysis of CAF Testing—Temperature, Humidity, and the Reality of Field Performance” by Kevin Knadle, TTM Technologies, Inc. This paper will be presented during Technical Conference Session 11 on Tuesday, January 25.

The NextGen best paper is awarded to:

  • “Bio-based Encapsulation Resins: Good for the Environment, Good for Your Environment” by Beth Turner, Electrolube. Turner will present her paper during Technical Conference Session 28 on Thursday, January 27.

Selected for the Student Research award, the best paper is:

  • “Reliability and IMC Layer Evolution of Homogenous Lead-Free Solder Joints During Thermal Cycling” by Mohamed El Amine Belhadi, Ph.D. Candidate, Auburn University. His co-authors are Xin Wei, Palash Vyas, Rong Zhao, Sa’d Hamasha, Haneen Ali, Jeff Suhling, Pradeep Lall, Barton C. Prorok, all with Auburn University. The paper will be presented at Technical Conference Session 32 on Thursday, January 27.

In addition to the “best of” categories, eight papers were selected in the honorable mention category. Honorable mentions go to:

  • “Towards Artificial Intelligence in SMT Inspection Processes” by Mario Peutler, Continental Automotive GmbH; co-authors Michael Boesl, Johannes Brunner and Thomas Kleinert, Ph.D., Continental Automotive GmbH.
  • “A Multiphase Model of Intermittent Contact in Lubricated Electrical Contacts” by Robert Jackson, Auburn University; co-author Santosh Angadi, Nitte Meenakshi Institute of Technology.
  • “Electro-thermal-mechanical Modeling of One-Dimensional Conductors, Whiskers, and Wires Including Convection, and Considering Tin, Bismuth, Zinc and Indium” by Robert Jackson, Auburn University; co-author Erika R. Crandall, TE Connectivity.
  • “Design and Testing of Three Levels of Microvias for High-Reliability PCBs” by Maarten Cauwe, Ph.D., imec-CMST; co-authors Jason Furlong, PWB Interconnect Solutions; Stan Heltzel, ESA-ESTEC; Marnix Van De Slyeke, ACB; Bob Neves, Microtek Changzhou Laboratories; Kevin Knadle, TTM Technologies.
  • “Recrystallisation and the Resulting Crystal Structures in Plated Microvias” by Roger Massey, Atotech GmbH; co-authors T. Bernhard, K. Klaeden, S. Zarwell, S. Kempa, E. Steinhaeuser, S. Dieter, F. Brüning, all with Atotech GmbH.
  • “Defluxing of Copper Pillar Bumped Flip Chips” by Ravi Parthasarathy, ZESTRON Corporation; co-author Umut Tosun, ZESTRON Corporation.
  • “Reliability SoH Degradation and Life Prediction of Thin Flexible Batteries Under Flex-to-Install Dynamic Folding, Dynamic Twisting and Battery Lamination” by Pradeep Lall, Ph.D., Auburn University; co-authors Ved Soni, Jinesh Narangaparambil, Hyesoo Jang, Auburn University; Scott Miller, NextFlex Manufacturing Institute.
  • “Electromechanical Testing of Flexible Hybrid Electronics” by Mark Poliks, Ph.D., Binghamton University; co-authors Mohammed Alhendi, Behnam Garakani, Udara S. Somarathna, Gurvinder Singh Khinda, all with State University of New York at Binghamton.

All technical conference papers were evaluated on their technical content, originality, test procedures and data used to deduce conclusions, quality of illustrations and the clarity and professionalism of writing as well as value to the industry.

To register for the IPC APEX EXPO 2022 technical conference or for more information on all the activities taking place, including professional development courses, exhibition, standards development committee meetings, keynote presentations, networking activities and more, visit www.IPCAPEXEXPO.org.

F2 Webinar Series: Opportunities and Benefits of Digitalization for Small and Mid-Sized Electronics Manufacturers

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Many small to medium size companies are drowning in poorly tracked cost of poor quality, struggling to understand parts and labor and not able to always see the full or real-time picture. Without full, live data, it is nearly impossible to make decisions that can make an outsized impact on cost of poor quality (COPQ). In this session, David Rendel, Quality Business Consultant with QAD, Inc. leads a discussion on how the industry treats quality and the benefits of electronic prevention-based quality systems over reaction-based, siloed quality systems in solving manufacturing problems.

IPC’s Wage Rate and Salary Survey for North American Electronics Assembly Companies Open Until January 28

IPC's biennial wage rate and salary survey for the North American electronics assembly industry is open with a response deadline of January 28. The confidential survey covers compensation for hourly and salaried technical, manufacturing and sales positions at original equipment manufacturers (OEMs) and contract electronics manufacturing services (EMS) companies in North America. It also covers salary budget growth, planned increases for 2022, and employee benefits and policies.                                                      

Companies can use this study to assess their competitiveness in today’s labor market. The data will be segmented by company type, size and region, enabling companies to assess their competitive position as employers within their region and company-size tier. The study also enables companies to benchmark their compensation, benefits and policies against industry norms, and update their human resource management strategies. It is unique in its focus on the North American electronics assembly industry.                                                                                   

The survey is intended for HR professionals and executives who can provide data on a range of positions and policies. Survey participants will receive the report on the findings at no cost. The survey can be accessed at https://survey.alchemer.com/s3/6505112/0e5497220d70. IPC publishes only aggregate numbers and maintains strict confidentiality. The report will not identify participating companies.

For additional information on IPC’s industry intelligence services, visit   www.ipc.org/advocacy/industry-intelligence.

Rising Material and Labor Costs Continue to Plague Global Electronics Manufacturing Supply Chain

Ease of recruitment and profit margins declining, along with inventories

IPC’s January 2022 global electronics manufacturing supply chain sentiment report found that materials and labor costs continue to be the largest issue facing the electronics supply chain, with nine in 10 electronics manufacturers reporting rising materials costs and more than three-fourths reporting rising labor costs. Though order flows continue to be strong, and both capacity utilization and shipments are expanding, survey respondents reported growing backlogs and shrinking profit margins.

Among other conclusions, the survey results found that:

  • Material costs are currently rising at a higher rate in North American than APAC: 96% of North American manufacturers report rising material costs, a significantly lower 74% report material costs are up in APAC.
  • Inventory available to customers is declining at a higher rate in North America compared to both Europe and APAC: 49% of firms in North America reported declining inventory, while only 21% of firms in Europe and 16% of firms in APAC are experiencing declines.
  • Manufacturers indicate the current semiconductor shortage is driving longer lead times, delayed deliveries, declining orders, increased inventories, rising costs and lost production.  Combined, these impacts are affecting manufacturers’ ability to complete orders, ultimately reducing profitability.

“Manufacturers expect to see continued increase in material and labor costs,” said IPC Chief Economist and report author Shawn DuBravac. “Escalating costs are in turn compressing profit margins. Ease of recruiting and finding skilled talent is expected to remain challenging and inventory levels are expected to remain tight for at least the next six months.”

IPC surveyed hundreds of companies from around the world, including a wide range of company sized and representing the full electronics manufacturing value chain. Survey respondents were from North America (44%), Asia (20%) and Europe (17%).

View full report: The Current Sentiment of the Global Electronics Manufacturing Supply Chain.

Supply Chain Challenges Continue to Hamper Electronics Production

IPC releases economic outlook for January 2022

IPC’s January 2022 Economic Outlook report finds that supply chain challenges remain acute and have improved little from the previous month. Shortages continue to hamper production levels and lead-times remain long. Supply chain challenges will linger well into 2022, and in some instances, into 2023.

Among other data, IPC’s economic outlook report shows:

  • Economic growth will be severely muted at the start of the year as Omicron slows economic activity – gross domestic product (GDP) growth in the United States could drop to as low as 2.5 percent in the first quarter of the year.
  • Inflation in Europe shot-up to 4.9 percent in November, the highest level since records began in 1997, two years before the euro was launched.
  • Consumer sentiment improved marginally in December, but the gains might be short-lived thanks to rising cases of COVID. Consumer sentiment reached lows in November not seen since 2011.
  • The reemergence of COVID had stymied Europe’s recovery early in the year, but Europe is quickly getting growth back on track. Growth in the third quarter was 3.7 percent higher than a year ago.
  • The number of employed persons increased by 0.9 percent in both the Euro area and in the European Union during the third quarter, but the unemployment rate has declined slowly during the recovery.

“It has been a tumultuous year and many of the risk factors that are prevalent today will continue through at least the first half of 2022,” said IPC Chief Economist and report author Shawn DuBravac. “COVID continues to be a major deterrent to economic growth and while the impact of the current outbreak remains unclear, the uncertainty it has created will hinder the recovery in the early months of the new year. While my expectations for growth for 2021 and 2022 are muted from prior months, I still expect the U.S. economy to grow four percent next year.”

View full report: January 2022 Economic Outlook Report.