North American PCB Industry Sales Up 2.3 Percent in September

IPC Releases PCB Industry Results for September 2021

IPC announced today the September 2021 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.25.

Total North American PCB shipments in September 2021 were up 2.3 percent compared to the same month last year. Compared to the preceding month, September shipments grew 18.4 percent.

PCB year-to-date bookings in September were up 19.2 percent compared to last year. Bookings in September grew 4.7 percent from the previous month.

“The PCB sector saw strong shipment growth during September, a hopeful sign that production levels are improving after two months of lower-than-expected deliveries,” said Shawn DuBravac, IPC’s chief economist. “Order flow during the month suggests demand remain strong for electronics manufacturing capacity.”

September 2021 book to bill chart 1
September 2021 book to bill chart 2

View charts in pdf format

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

IPC APEX EXPO 2022

Date
-

IPC APEX EXPO is the premier event for the electronics manufacturing industry, attracting more than 9,000 professionals from 45 countries. From the industry’s leading technical conference and professional development courses to the innovation-driven exhibit floor, IPC APEX EXPO 2022 will provide you with the opportunity to exceed your usual limits as you participate in the transformation of the industry. 

San Diego Convention Center

111 W Harbor Dr
San Diego, CA 92101
United States

San Diego Convention Center

San Diego Convention Center
111 W Harbor Dr
San Diego, CA 92101
United States

IPC Invites Industry Leaders to Submit Poster Abstracts for IPC APEX EXPO 2022 in San Diego

IPC invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO, the industry’s premier conference and exhibition for electronics manufacturing. Poster presentation networking sessions are scheduled for February 25 from 5:00-6:00 pm; February 26 from 2:30-3:30 pm; and February 27 from 12:00-2:00 pm. For the first time ever, poster presentations will take place on the APEX EXPO show floor, maximizing the potential audience for poster presenters.

Technical poster presentations are being sought on all relevant electronics topics, including design, materials, assembly, processes and equipment, especially:

  • Factory of the Future Implementation
  • PCB Fabrication and Materials
  • Quality, Reliability, Test, and Inspection
  • Enabling Future Technologies
  • Meeting Extreme Requirements
  • Circuit Design and Component Technologies
  • Conscientious Engineering
  • Assembly Processes
  • Electronics Materials

An abstract of up to 200 words summarizing technical and previously unpublished work covering case histories, research and discoveries should be submitted by Wednesday, November 17, 2021, to https://www.ipcapexexpo.org/call-participation-poster. Poster presenters are entitled to a free one-day conference pass on January 25. And, to recognize exceptional achievement, a “Best Technical Poster” award will be presented with a USD 750 honorarium.

For more information about poster participation or other technical program opportunities at IPC APEX EXPO, contact Toya Richardson, IPC technical programs coordinator, at ToyaRichardson@ipc.org.

IPC Welcomes Language in Senate Defense Appropriations Bill Supporting R&D on Lead-Free Electronics

The U.S. Senate Appropriations Committee this week released their fiscal year 2022 defense appropriations bill, which for the first time included language supporting further research and development (R&D) into the issues surrounding lead-free electronics in mission-critical applications.

IPC and its allies have called for a five-year, $40 million investment in a public-private R&D program to support the transition of various aerospace, defense, and high-performance (ADHP) electronics to lead-free technologies. To date, Congress has provided a combined $15 million for this purpose in FY20 and FY21.

The U.S. House version of the FY22 defense appropriations bill, which was approved by the House Appropriations Committee in August, included $7.5 million for this purpose. The new Senate language makes it more likely that such funds will be allocated as the legislation is finalized.  

“The gap between commercial and defense electronics has grown as lead-free has become the norm in commercial technologies,” said Chris Mitchell, IPC vice president of global government relations. “Today’s defense electronics are now 15 to 20 years behind the commercial market in terms of the underlying technologies used, creating risks to supply chain resiliency and defense readiness. With lead-based electronics becoming more difficult and expensive for the Defense Department to procure, the transition to lead-free is imperative.

“We salute the leadership of Senate Appropriations Committee Vice Chairman Sen. Richard Shelby (R-AL) on this issue, and we call on Congress to ensure that at least $7.5 million for lead-free R&D is included in the final bill.”

IPC and its partners in the Pb-Free Electronics Risk Management (PERM) Council and the U.S. Partnership for Assured Electronics believe a sustained investment in lead-free R&D will yield more than $100 million in annual defense savings and improve military readiness and overall innovation. Participants in the R&D program include Purdue University, the University of Maryland, Auburn University, Binghamton University, Northrop Grumman, Raytheon Technologies, Lockheed Martin, BAE Systems, Boeing, Plexus, and many others.

 

 

Summit Interconnect Earns IPC-1791, Qualified Manufacturers Listing (QML) as Trusted Electronics Fabricator

IPC's Validation Services Program has awarded an IPC-1791, Trusted Electronics Fabricator Requirements Qualified Manufacturers Listing (QML) to three of Summit Interconnect's printed circuit board (PCB) manufacturing facilities in Anaheim, Orange and Santa Clara, Calif. Following initial audits by IPC, all three facilities passed stringent Type 2 fabricator requirements, helping to optimize product quality, reliability, and consistency across the entire manufacturing operations, earning the three facilities a spot-on IPC’s global network of rigorously vetted, trusted sources.

Requirements for certification and QML listing to IPC-1791 includes product and quality system, supply chain risk management system (SCRM), security system including compliance to NIST SP 800-171, Export Control Laws (ITAR and EAR), and a chain of custody system (ChoC) review.

Shane Whiteside, president and CEO of Summit Interconnect commented on the accomplishment, “Summit is committed to secure and trusted printed circuit board manufacturing for our customers. We fully recognize that our work is critical to the defense of our country. Obtaining IPC-1791 certification at multiple Summit locations underscores our commitment to being the trusted PCB supplier of choice for military systems and platforms.”

IPC's Validation Services QPL/QML Program was developed to promote supply chain verification and recognition. It also provides auditing and qualification of electronics companies' products and identifies processes which conform to IPC standards. The IPC-1791 QML verifies security systems and recognizes companies for either trusted electronic designer, fabricator, or assembler ensuring a high level of integrity.

"IPC's Validation Services Audit Programs uniquely provide technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Summit Interconnect three facilities in Anaheim, Orange and Santa Clara, California on becoming members of IPC's network of trusted QML suppliers." 

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.   

IPC APEX EXPO 2022 Attendees Can Achieve Digital Transcendence at Show Networking Events

IPC APEX EXPO 2022 attendees can meet with electronics industry innovators and connect with peers all in one place at the San Diego Convention Center, January 22–27, 2022.

From the exhibit floor to the classroom and everywhere in between, including the International, Newcomers Networking, Show Floor and Women in Electronics at IPC APEX EXPO Receptions; Ice Cream Social; Ribbon Cutting Ceremony; Keynote Sessions; New Products Corridor; Trivia Networking Night; and more, attendees can connect and collaborate.

Among the highly anticipated special events is the opening keynote by New York Times Columnist, Emmy-Winning CBS Sunday Morning Contributor and NOVA Host, David Pogue. On Tuesday, January 25, Pogue will present, “Disruptive Tech & How it Will Affect Your Business: What’s Coming by 2026,” taking attendees on a wild ride through the cutting-edge science and technology that is powering a next wave of technological innovation.

On Wednesday, January 26, John Mitchell, IPC president and CEO, will assess the state of electronics manufacturing and identify the trends that will define the industry’s financial growth and technological progress in 2022 and beyond. Touching on topics that are the focus of board rooms and shop floors: factory modernization, supply chain resiliency, workforce demands, and environmental stewardship, Mitchell will cover ways to navigate your organization to succeed in today’s dynamic global marketplace in his dynamic keynote, “State of the Industry: Electronics Manufacturing Embraces Digital.”

“Special events at IPC APEX EXPO add tremendous value for attendees,” said Alicia Balonek, IPC senior director of trade shows and events. “Networking in person makes a difference; and attendees have an optimal opportunity to network with thousands of their electronics industry colleagues at IPC APEX EXPO 2022,” Balonek added. “Improving your company's performance and furthering your own personal success, making new connections and strengthening existing relationships—it's what makes the IPC APEX EXPO experience priceless.”

Event essentials as well as access to the exhibit hall are only $20 to those who register in advance, a savings of $20 on-site. Attendees who register by December 17 will save 20 percent off registration fees. In addition, attendees who register for the All-Access Package will receive a significant percentage off a la carte options. Schedule and registration details are available at www.IPCAPEXEXPO.org.

Hand Soldering Competition at productronica 2021

Date
-

IPC HAND SOLDERING COMPETITION 2021
At productronica, Messe Muenchen, Munich, Germany, 
16-19 November 2021

IPC would like to invite you to join the Germany Contest of the IPC Hand Soldering Competition (HSC) to be held at productronica – Messe Muenchen, Hall #A2 – Stand# A2.300 from 16 au 19 November 2021. Skilled soldering experts (F/M) will be competing for 60 minutes on a complex circuit board assembly to win the 2021’ National title and earn a cash prize

The professional competitors will be judged by IPC Master Instructors (MIT) on soldering a complex printed circuit board with a maximum time of 60 minutes in accordance with IPC-A-610 Class 3 criteria. Additional criteria will include the quality of the results achieved and of the assembly process, the overall electrical functionality of the assembly as well as the speed at which the assembly was produced.

productronica

am messesee
81829 Munich
Germany

productronica

productronica
am messesee
Munich , 81829
Germany

IPC Skills Challenge Competitions Return to India Region

To commemorate IPC India’s decade of service to the electronics manufacturing industry, the IPC India team will hold skills challenge competitions and member networking events starting this November across different parts of the country. Winners of regional competitions will gather in Bengaluru and New Delhi in August 2022 to compete in PCB design, hand soldering and wire harness assembly championships.  

The skills challenge semi-final competition will take place on August 2 (Bengaluru) with championship taking place on August 4 (New Delhi) at Integrated Electronics Manufacturing Interconnections (IEMI) 2022. In addition to the skills championships, panel discussions and technical conference program sessions will focus on information communication technology on August 2 and on August 4, topics and discussions will focus on the defense and aerospace technology.

IPC Skills Challenge Phases:

November 2021 – March 2022

  • Competitors from electronics companies send registration form to IPC India
  • As per IPC competition guidelines, companies organize hand soldering/wire harness assembly/PCB design challenges at their company premises using own tools/equipment
  • Companies can nominate observers/judges from own company if IPC certified individuals available, otherwise IPC will provide IPC certified observers/judges
  • IPC present certificates to winner and runner up at each company location

April 2022 – July 2022: IPC India will organize semi-final competition round with the winners of the first rounds at networking events at Hyderabad, Chennai, Pune, Bengaluru, Colombo (TBC) and New Delhi (August 2, 2022)

August 4, 2022: Final Round to be played in Bengaluru.

For More information:

IPC India Skills Challenge Program: https://www.ipcindia.org.in/ipc-india-skill-challenge/

IPC India Skill Challenge Program Guidelines:

Hand Soldering: Click here

Wire Harness: Click here

PCB Design: Click here

Registration:

Participation form for companies in first round: Click here

For inquiries, contact Saurabh K Saxena, IPC India Standards and  Certification Head, at SaurabhSaxena@ipc.org or standardsindia@ipc.org.

Second Stop of IPC E-Textiles 2021 Virtual World ‘Lands’ in Philadelphia on October 27

Attendees to get first glimpse into Drexel’s Soft Systems Design Kit – SSDK

The second stop on IPC’s E-Textiles 2021 Virtual World Tour will be Philadelphia, Pa. on October 27, 2021. The IPC E-Textiles 2021 Virtual World Tour is a series of educational events bringing the latest e-textiles technologies and virtual demonstrations from innovators around the world -- all at no cost to registrants.

Attendees of the October 27 stop on the tour will gain unique insights into the Soft Systems Design Kit (SSDK) under development at Drexel University’s Center for Functional Fabrics. Their SSDK is a set of tools and guidance seeking to bring design methodologies from the semiconductor industry into the e-textiles space to speed product development and de-risk projects. Drexel’s speakers will provide a detailed view into their SSDK as well as a proof of concept demonstration.

Drexel will also provide virtual demonstrations of the Center for Functional Fabrics, providing a unique opportunity for the global e-textiles industry to gain access to one of the leading e-textiles centers in North America. Registrants who are not able to attend the live event will receive on-demand access to the presentations and demonstration recording following the event.

Remaining dates on the IPC E-Textiles 2021 Virtual World Tour include Germany on November 17, and Japan on December 1. Registration includes automatic access to the remaining events and on-demand recordings for all events, including the September 2 event hosted by Taiwan Textile Research Institute.

For more information or to register, visit: www.ipc.org/ipc-e-textiles-2021-virtual-world-tour.