Improving Productivity with Automated Component Delivery

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Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sorting to helping pack packages. How can the electronics assembly industry benefit from Automation when nearly the entire SMT line is already made of automated machines?

The biggest automation holdout in a typical SMT factory is the warehousing and delivery of materials. Every factory has some kind of warehouse and nearly all of them are manually staffed by workers. As the effects of Covid wear on and fewer people are willing to take lower paid, repetitive work, the demand for automating warehouses and material delivery is growing rapidly.

In the past ten years, there has been a growing focus on automating warehousing in electronic manufacturing through automatic storage towers as a replacement for “dumb” shelving. Not only do the towers reduce labor and required floor space, they also improve inventory accuracy, control and efficiency. The next logical step is to take the materials from the storage to the production line automatically. Autonomous mobile robots (AMRs) are the key to this process. Through integrated communications, the pick and place machines inform the storage towers of a shortage or a new work order, the tower delivers the needed components to the AMR and the AMR delivers them to the line. All without any human intervention.

This paper will focus on the benefits of using flexible automated component handling in conjunction with AMRs to reduce the manpower required for warehousing and delivery and increase efficiency, improve traceability and reduce errors by delivering components to the line just in time.

Author(s)
Gerry Padnos, Christoph Wimmer
Resource Type
Technical Paper
Event
IPC APEX EXPO 2022

Empowering Digital Supply Chain Transformation by Utilizing Industry 4.0, Smart Factories, Standards, Smart Contracts and Blockchains

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Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a diverse set of stakeholders, requiring a multitude of different data reporting needs to be identified and requested from suppliers, ranging from: the identification of raw materials; number of products in WIP state within facilities; finished stock levels in storage; demand needs from customers; numerous what-if scenarios; exposure analysis; safe use and disposal instructions; through to obligatory reporting data under chemical regulation to identify the presence of any hazardous chemicals on finished products; through to the emerging Environmental, Social, and Governance data reporting needs in order to gain access to future sources of funding.

Blockchains are often mistakenly viewed as being solely related to recording transactional data related to some form of electronic payment mechanism. Smart contracts enable contracts between buyers and suppliers to create contract terms in an electronic manner and processed in an efficient and automated manner.

This paper contributes to existing literature by identifying a research gap in transforming the currently diverse manually intensive data collection tasks, via digital technologies such as supply chain collection of reporting tasks embedded into smart contracts, with digital data flows supporting IPC-CFX and IPC technical standards, recording data collection requests and responses in real-time within a blockchain, which is then verified by applicable supply chain actors, to ensure data consistency, accuracy and verification.
The proposed design enables companies to address existing state supply chain data collection tasks using as structured framework, enabling appropriate risks to be identified and managed accordingly in a more timely and consistent manner. The design may then be expanded in a consistent manner as new supply chain reporting needs arise.

Keywords: AI, Automation, Blockchain, Supply Chain Data Collection, Supply Chain Management, Smart Contract, Smart Ledger, IoT, Internet of Record, IPC-CFX, IPC-2591, IPC-175x.

Author(s)
Raj Takhar
Resource Type
Technical Paper
Event
IPC APEX EXPO 2022

Strategic Sourcing within an Evolving Aerospace & Defense Industry

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Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. This presentation will explain the six alternative solutions to a sourcing decision; make, partner, contract, outsource, license or acquire/invest (Solomon 2017). Each of these alternatives will have specific benefits or risks that a given team must assess.

An effective committee is essential in determining a sourcing decision. The development of a cross functional committee including various roles from engineering, supply chain, manufacturing, quality and business development will enable a forward-looking strategic approach. This committee will make decisions based on company investment strategies and help to inform how technologies address capability and capacity of both internal and external manufacturing sites.

The ultimate objective of an effective sourcing decision is to balance a company’s internal research & development funds and those of its partners to maximize its return on investment (ROI). When companies provide transparency to their partners, it enables a faster time to market solution at the preferred price.

Author(s)
Kevin McGrath, Jim Becker, and Martin Goetz
Resource Type
Technical Paper
Event
IPC APEX EXPO 2022

Evaluation of Compatibility of EnvironMentally Friendly PCB Manufacturing Processes: Additive Inkjet Coating & Surface Finishes

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The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change rate requires resources in R&D. Equipment and material supplier contribute to the challenge by introducing novelties. Two commercially available technologies are additive inkjet coating and sustainable surface finishes (plating chemistry). These two technologies have already demonstrated independently their compatibility with established traditional PCB technologies and their ability to deliver economical saving, less environmental impact and solve existing common issues (residual ink in vias or black pads) [1,2,3,4]. A PCB manufacturing which integrated both technology as a single change would benefit from a strategically high change rate. An Inkjet tool coats one material on a set of printed boards with test patterns (Copper on FR4) with a test design. The same solder mask material, thanks to different printing strategy, presents itself in two cosmetic finishing (matte and gloss). Four sustainable plating chemistry finish the boards with a post-treatment. The reliability test performed on the boards for visual and mechanical test are satisfactory according to screening test devised to highlight early failure modes. The PCB manufacturing environment benefits from this confirmation as a proof of increased change rate.

Author(s)
Kunal Shah, Luca Gautero
Resource Type
Technical Paper
Event
IPC APEX EXPO 2022

Thermally Conductive Polymeric Material (TCPM)

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The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their processing speed compared to the previous system (4G) in order to support data transfer rates. In addition to the communication transfer rates, PCBs are becoming smaller and contain higher layer counts and power requirements. As a result, newer PCBs (such those used in communication devices, MicroLEDs, and Electronic Vehicles), generate more energy and create more heat. Traditional methods for dissipating the heat (such as metal heat sinks, cooling fans, and copper pipes) are becoming less functional since they add weight to devices and can take up valuable real estate. As a result, PCB designs need a practical way of dissipating heat without increasing the device weight and / or size.

PCB designs need unique ways to improve the heat transfer efficiency while maintaining the flexibility to continue miniaturization and enhance data transfer. One solution to this problem is to use a thermally conductive polymeric coating. This coating could be applied in areas where heat dissipation is needed. In theory, this coating could be used under or near components (IC packaging) on the PCB, under or near MicroLEDs, and / or in vias in order to remove heat. For use in these applications, the thermal conductivity of the coating would have to be greater than 6 W/mK and use traditional methods for application. The coating would not add weight to the PCB or take up valuable real estate since it would be applied as a thinfilm and / or be filled in vias which are already part of the PCB design.

Author(s)
Jesse W. Session
Resource Type
Technical Paper
Event
IPC APEX EXPO 2022

Electroless Palladium Plating – Correlating Plating Solution and Deposit Properties

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Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating. In addition to the well-established electroless nickel/electroless palladium/immersion gold (Ni/Pd/Au) the palladium/gold finish plated directly on copper has been introduced a couple of years ago (1). As a new alternative finish, it tackles the needs and requirements connected with miniaturization, solder joint reliability and signal transmission. Due to its low overall finish thickness, it is capable to plate fine structures without the risk for excessive plating or short circuits and as a nickel free finish, it offers the additional benefit of being applicable for high frequency applications with low signal loss. The properties of the finial finish itself are defined by the chemical plating process and the reactions taking place during the deposition.

The scope of this paper is the comparison of different palladium electrolytes and their impact on the characteristics of the final finish. In this study, it can be shown that the chemical properties of the plating solution define the material properties of the final deposit and that by adjustment of pretreatment conditions and palladium plating solution, it becomes possible to provide plating solutions which are capable of plating on copper as well as on nickel. Comparison studies for three palladium electrolytes are presented with the focus on solder joint reliability and bonding performance of the plated layer. This includes one electrolyte specifically designed for plating on copper (Pd/Au), one electrolyte specifically developed for plating on nickel (Ni/Pd/Au) and one more universal electrolyte which is capable to plate on nickel and copper. The reliability data are collected in as received conditions as well as after thermal aging. The performance after thermal aging is of particular interest for the palladium/gold finish because of its low deposit thickness and nickel free character, copper migration is suspected as a potential risk to affect the reliability in solder joint formation and wire bonding. In studies of different modifications of palladium/gold deposits, the impact of the layer structure on the barrier properties is investigated.

All data on solder joint reliability, solder wetting and solder bonding performance are correlated to compare the properties of the different finish types and highlight the limitations and benefits of the different solutions.

Key Words

Electroless Palladium

High Frequency

5G

Fine Pitch

Solder Joint reliability

Author(s)
Britta Schafsteller
Resource Type
Technical Paper
Event
IPC APEX EXPO 2022

Behind Closed Doors – What You Don’t Know About Your CVD Chamber

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Purpose

One of the challenges of larger parylene chemical vapor deposition (CVD) chambers is what seems to be unpredictable material behavior throughout the working volume. The tight parameters on the state of the substrates, adhesion promoter, and parylene deposition process require informed engineering, even when industry best practices produce problematic distributions of materials.

Results

Transient electrical failures, among other unexpected behavior, that recover over time can be influenced by the method of adhesion promoter introduction, the volume of adhesion promoter used the state of cleanliness of the substrates, the total volume of substrate outgassing, circuit design as well as other factors. Related case studies on the effects of the state of the substrate and conditions before and after coating will be addressed. With very similar products, the same process has worked without issue, countless times.

Outcome

Controlled experiments that vary each of the critical factors have shown how they affect the coating process and product performance. Cross-sectional analysis, FTIR spectroscopy, adhesion tests, process modifications, and substrate concerns will be discussed to illustrate how high-reliability products can be produced in a high-volume manufacturing process using parylene conformal coatings.

Author(s)
Sean Clancy
Resource Type
Technical Paper
Event
IPC APEX EXPO 2022