IPC Conference Paper Archive

Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and r .. read more

The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,includ .. read more

PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on productio .. read more

PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are great .. read more

Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. The reliability of .. read more

With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing signific .. read more

It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide .. read more

A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive d .. read more

Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. However,variability in the mec .. read more

Work instructions are time consuming to generate for engineers,often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail,with .. read more

While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation a .. read more

The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the r .. read more

Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free .. read more

Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df .. read more

As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. The interactions of VIPPO wit .. read more

Choosing an outsourced manufacturing partner that is perfect for a new product and close to your design team is quite different to choosing a partner that can manufacture that same product in v .. read more

Automating electronics assembly is complex because many devices are not manufactured on a scale that justifies the cost of setting up robotic systems,which need frequent readjustments as models .. read more

Rising customer demands in the field of PCB repair are a daily occurrence as the rapid electronic industry follows new trends in a blink of an eye. New strategies and technologies are required .. read more

There are times when a PCB prototype needs to be built quickly to test out a design. In such cases where it is known early on that there will be multiple iterations or that a “one and done” ass .. read more

More and more people and things are using electronic devices to communicate. Subsequently,many electronic products,in particular mobile base stations and core network nodes,need to handle enorm .. read more

The electronics industry trend continues to be to continually increase capability and performance within an existing or smaller footprint. Shoehorning all of the required components onto the ex .. read more

Security has become a vital part of electronic products as they handle sensitive data in uncontrolled environments and as they face more and more content protection issues. The paper will intro .. read more

A new hybrid ALD/CVD protective coating is being considered as a low-cost alternative to poly-para-xylylene and traditional liquid conformal coatings. All of the typical conformal coatings prot .. read more

Very low viscosity formulations are often required for very thin conformal coating applications. Solvents are used to reduce viscosity of the formulations and accommodate dispensing needs. Solv .. read more

High reliability process automation devices require serious protection from harsh environments which can be a combination of moisture,corrosive gases and liquids,salt sprays,large temperature v .. read more

Solder paste has been used in the surface mount technology for many years. However,a complete understanding of the effect of key powder characteristics on the paste properties is still not achi .. read more

Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. When assembling components with solder p .. read more

It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too th .. read more

Pockets of gas,or voids,trapped in the solder interface between discrete power management devices and circuit assemblies are,unfortunately,excellent insulators,or barriers to thermal conductivi .. read more

The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin sys .. read more

IPC J-STD-001Fand IPC-A-610F require a minimum Heel Fillet Height (F) for Flat Gull Wing Leads of solder thickness (G) plus lead thickness (T) for Class 3 products.[1]It is shown in this work t .. read more

The July 2006 implementation of ROHS exempted automotive applications from converting to lead free technology. Nine years later,all major OEM and Tier 1 automotive manufacturers have converted .. read more

This experiment considers the reliability of a variety of different electronic components under isothermal aging and subsequent thermal cycling (TC) testing. The components are evaluated on 0.2 .. read more

From photo film to digital camera,from letters to emails,from books to e-readers,from vinyl to MP3: the whole world is turning digital. Yet,ironically,the core compound driving the digitization .. read more

The rules of the game in PCB production are changing with new disruptive technologies. At the company there has been the implementation of a “primary image inkjet-resist” printer for both inner .. read more

With increasing popularity and momentum for wearable and printed electronics,stretchable printed ink has become a hot subject for study and application. Circuitry printed from stretchable ink r .. read more

In 2012,The European Directive on Reduction of Hazardous Substances was recast. The new version of the directive now requires products to be adequately validated as RoHS compliant in order to b .. read more

One of the biggest challenges a corporate environmental compliance team faces is to collect complete and accurate material and substance data in a timely manner from suppliers. This paper will .. read more

Growing material regulations compel electronics manufacturers to rethink product compliance. Can a company state with confidence every substance in the final product has been identified,and fro .. read more

Pb-free Ball Grid Arrays (BGA) present unacceptable reliability risks for defense and space programs,but what are the options when SnPb devices are no longer available? BGA manufacturers expres .. read more

As electronic assemblies continue to shrink in size,component population densities are increasing. Design engineers are forced to utilize all available board real estate and continuously push t .. read more

Water soluble lead-free solder paste is widely used in today’s SMT processes,but the industry is slowly moving away from water soluble solder pastes in favor of no-clean solder pastes. This shi .. read more

In the electronics industry,consumer demand drives a large portion of product innovations. Consumers want greater functionality and power,while maintaining a small footprint. Due to this demand .. read more

From the Apple Watch and body cameras for law enforcement to virtual reality hardware and autonomous transportation,the opportunities for electronics to improve our lives are limited only by ou .. read more

Most of today’s printed circuit board base materials are anisotropic and it is not possible to use a simple method to measure thermal conductivity along the different axis,especially when a goo .. read more

Two new electroless copper baths have been developed to cope with upcoming miniaturization challenges in the high-end IC substrate segment as well as in the evolving HDI board market. The main .. read more

Using modern laser systems for the depanelization of circuit boards can create some challenges for the production engineer when it is compared to traditional mechanical singulation methods. Und .. read more

Ceramics packages are being used in the electronics industry to operate the devices in harsh environments. In this paper we report a study on acoustic imaging technology for nondestructively in .. read more

C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “a .. read more

High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitation .. read more