IPC Conference Paper Archive

Plasma is considered to be the 4th state of matter. Decomposed molecules interact with all exposed surfaces of the material,even the inner surfaces of open cell structures. In low pressure plas .. read more

When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task. .. read more

The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card asse .. read more

Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled,defects can be produced,which may no .. read more

This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited d .. read more

One of the major concerns with screen printing of low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the overwhelming spread of the paste bey .. read more

Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known .. read more

Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. In order to achieve .. read more

Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. When designing a PC .. read more

Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. The iNEMI test is based on a ch .. read more

Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance d .. read more

Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may .. read more

The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electr .. read more

Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-l .. read more

For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. Sn-Ag-Bi-In solder all .. read more

Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields .. read more

The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices h .. read more

To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and m .. read more

Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repa .. read more

This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly .. read more

With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essenti .. read more

As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. Although the epoxy resin defines the ther .. read more

Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. In these FPCs the ex .. read more

No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. Some have observed tha .. read more

It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in t .. read more

In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable. .. read more

As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past th .. read more

Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. This pa .. read more

Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? We have good news for you,there are many excellent ways to “Fill the Void.” This paper is a continu .. read more

Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. The combination of leadless terminations .. read more

Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is o .. read more

One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with el .. read more

Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many app .. read more

Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manu .. read more

Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric co .. read more

Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these ar .. read more

Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there i .. read more

There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the t .. read more

Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series produ .. read more

The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. The MLCC technologies have gone through a number of .. read more

Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. This paper presents a reliability evaluation of a particular package- .. read more

Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a sin .. read more

With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such .. read more

The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding .. read more

Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or .. read more

The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated so .. read more

The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density .. read more

Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the speci .. read more

Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. Specifically,the d .. read more

The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequenc .. read more