IPC Conference Paper Archive

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In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this .. read more

Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. These properties include high temperature capability (>250oC),low coefficient of thermal exp .. read more

It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. At present,the .. read more

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The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated wit .. read more

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With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and .. read more

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Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of informatio .. read more

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All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stab .. read more

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A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. One solu .. read more

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Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. Lead-Free processing is rather new to the industry and the development of a successful asse .. read more

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There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB). .. read more

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The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mech .. read more

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A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. The micro .. read more

This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eute .. read more

This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does not depend on modifying the chemistry or physical environment of the platin .. read more

The technology for embedding components in PWBs will change the process how PWB are fabricated over the next few years. At the present time,polymer thick film is the most frequently used materi .. read more

Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting .. read more

According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. Yet it seems from a technical .. read more

Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any new board surface finish to be accepted for general use,it must be approved b .. read more

This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a bottleneck in many PCB companies,and how a dedicated software system breaks the i .. read more

Electronic components are being used in increasingly more severe shock environments. This combined with an industry trend of increased component reliability to help reduce electronic system dow .. read more

With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure mechanism is gaining a lot of attention. Smaller geometries make the printed circuit bo .. read more

As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local .. read more

The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor chip design evolves into increasingly finer lines. First,it was studied how fine th .. read more

Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its .. read more

Utilizing continuous lamination techniques,new materials are being developed to meet demanding market requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effectiv .. read more

Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for a particular product. Many programs simply default to a standard test without .. read more

The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. For .. read more

This paper presents a comparison of several resin systems on different support reinforcements including on Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems co .. read more

The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter screening) is a major technological leap. Legend marking on printed circuit b .. read more

The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. T .. read more

The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern plating,because the plated metal height depends on the current density,which .. read more

Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be sev .. read more

This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional chemical mediation of plating processes,this process is electrically medi .. read more

Various requirements have developed for printed wiring boards regarding the minimum spacing between features. Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out .. read more

Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit boards are presented and discussed. Evolution of design guidelines and processing .. read more

A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and implemented by Motorola in partnership with its PWB supply chain. The technology is bas .. read more

The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical fiber into PCBs. .. read more

Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed wiring boards. This paper describes the technology and presents a case study demon .. read more

This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing or observed during manufacturing. Finite element models have been developed .. read more