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PCB Design I

Taught by an IPC-certified industry expert with more than 25 years of experience in the field, this 6-week online program introduces participants to the concepts and skills required to create real-world designs that comply with IPC standards.

PCB Design for Radio Frequency Boards

This course provides the theoretical knowledge and practical skills required to create IPC-compliant PCB designs for high-speed analog, radio (RF), and microwave frequencies.

PCB Design for Signal Integrity

This course is intended for those individuals who have completed or possess the equivalent skills and experience of Introduction to PCB Design 1 & 2 and who need further experience with design, manufacturing, packaging and routing challenges involved with designs for high-speed digital designs.

Intro to Wire Harness Design I

This course is designed for designers and operators who are new to or will soon start working on wire harness design. Participants are expected to be familiar with the IPC/WHMA-A-620 Standard.

PCB Design for Rigid-Flex Boards

This course provides the skills necessary to effectively implement designs requiring flex and rigidflex circuits in accordance with product requirements. The class also focuses on the impact of these designs on manufacturing and assembly techniques, documentation, and manufacturing file generation. Taught by an IPC-certified industry expert with 25+ years of experience in the field, the six-week program utilizes interactive webinars, on-demand recorded class sessions, job-specific exercises, and team projects to facilitate mastery of the key concepts required to design flex and rigid-flex boards.

IPC SummerCom

Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by attending IPC standards development meetings. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.

IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem

IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem. This compact 2-day event is dedicated to in-depth discussions on strengthening the IC-Substrate and Package Assembly Ecosystem in North America and Europe.

Critical Environmental Requirements for Electronics

Join the world’s leading environmental regulatory experts at IPC and ITI’s virtual 2021 Critical Environmental Requirements for Electronics Conference for updates on the latest environmental requirements that could impact your product’s design, manufacturing, supply chain management, and technology innovation.

IPC Events: Critical Environmental Requirements for Electronics Conference 2023

Join the world’s leading environmental regulatory experts at IPC and ITI’s virtual 2022 Critical Environmental Requirements for Electronics Conference for updates on the latest environmental requirements that could impact your product’s design, manufacturing, supply chain management, and technology innovation.

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