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Artificial Intelligence - Opportunities, Challenges, Possibilities

The course provides working knowledge and an integrated overview to help make informed decisions about how to navigate into the future of AI, suitable to all who are interested in staying knowledgeable for professional fulfillment including designers, researchers, managers, production, quality and reliability professionals, executives, and business decision-makers; also designed for those who desire broad-based information with holistic perspectives on AI.

Scope 3 Greenhouse Gas Disclosure in the Electronics Industry

Join IPC and Anthesis Group as we explore key insights from recent Carbon Disclosure Project (CDP) research on Scope 3 greenhouse gas emissions reporting in the electronics manufacturing industry.

Changes Coming to IPC Membership

IPC President and CEO John Mitchell details exciting new changes coming to IPC membership, making the process easier for you and your company, and enabling all your employees, no matter where they are located, to enjoy IPC membership benefits.

B2B Meeting Registration, Penang ( MALAYSIA )

IPC has developed an annual international networking forum in India RegionIntegrated Electronics Manufacturing & Interconnections (IEMI). The two-day, two-city event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services

IPC Builds-Standards Development Committee Meetings

Contribute to the industry standards and guidelines that your company, customers, suppliers and competitors rely on by attending IPC standards development meetings. Newcomers and industry veterans are welcome. Participate and learn more about these critical industry documents.

Omnibus Package on Sustainability Reporting - What Should the Electronics Industry Expect

To help mitigate associated risks and facilitate planning, for this webinar, IPC (as the global trade association for electronics) is partnering with the Anthesis group (as subject matter experts on the omnibus package) and the Incap Corporation (as industry representative) to discuss the impact of the proposal on the global electronics industry, with a focus on CSRD, CS3D, and Taxonomy and on the measures that the electronics industry needs to take to prepare for the next steps.

Advanced Packaging to System Integration – Trends and Challenges

Advanced Packaging to System Integration – Trends and Challenges

Components to Systems: Integration Needs, Gaps, Challenges, and Solutions

HIR Session with Joint Participation by IPC at 75th Electronic Components and Technology Conference (ECTC)

B2B Meeting Registration, India (Bengaluru)

IPC has developed an annual international networking forum in India Region Integrated Electronics Manufacturing & Interconnections (IEMI). Event will bring together designers, manufacturers, traders, suppliers, service providers, and technical experts to explore new business partnerships, gain technical knowledge, and source products & services

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