Ionic Analysis of Common Beverages Spilled on Electronics
Electronics,especially mobile electronic items,are subjected to unintentional abuse by having various beverages spilled onto or into them. Ion Chromatography and emission spectroscopy were used
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Event
IPC APEX EXPO 2008
The Path to Robust Electronics - Preventing Corrosion of PCB Assemblies
All things corrode,and the rate of corrosion among electronics devices is accelerating. Electronic devices are being used in more places than ever before. They are finding more uses,they're mor
.. weiterlesen
Event
IPC APEX EXPO 2008
Contamination of Hydrocarbon Ceramic Dielectric
Various forms of contamination on the surface of hydrocarbon ceramic dielectric PWBs have been observed following component population. Although contamination is occasionally observed on PWBs f
.. weiterlesen
Event
IPC APEX EXPO 2008
Using IPC/JEDEC-9704 & 9702 Standards for Strain Gage Testing of Printed Wiring Boards
(not available)
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Event
IPC Midwest 2007
JCAA/JGPP Consortia Lead Free Solder Project: High Performance Use Environment Testing Program
(not available)
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Event
IPC Midwest 2007
An OEM's View of Lead Free Assembly Reliability
(not available)
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Event
IPC Midwest 2007
Printed Circuit Board Reliability and Integrity Characterization Using MAJIC
The recent need to develop lead-free electrical and electronic products has resulted in an increased demand to characterize
solder joint integrity. Many standards exist to evaluate the long ter
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Event
IPC Midwest 2007
Atmospheric Plasma – A New Surface Treatment Technology for Cleaning PCBs
Low-pressure plasmas have been used for many years to surface clean and functionalize substrates prior to downstream
converting operations; therefore,the benefits of plasma treatment are well r
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Event
IPC Midwest 2007
Engineered Cleaning Fluid and Mechanical Impingement Optimization Innovations
The complexity of the electronic assembly manufacturing environment increases with the miniaturization,low standoff components,and solder alloy advancements. Past history suggests that the clea
.. weiterlesen
Event
IPC Midwest 2007
Cleaning a No-Clean Flux on Contaminated Hardware as a Recovery Plan
There is a growing problem in the industry with no-clean flux technology and the after effects it can have on reliability. If the
fluxes are not fully complexed (not fully heat activated) there
.. weiterlesen
Event
IPC Midwest 2007
Defluxing of Eutectic and Lead-Free PCBs in a Single Cleaning Application
As the entire electronic manufacturing industry braced for the July 1,2006 deadline,it has been reevaluating the entire production process. Likewise,the precision cleaning industry must also
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Event
IPC Midwest 2007
Cleanliness Related Efforts in IPC Standards-Determining How Clean is Clean
(not available)
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Event
IPC Midwest 2007
Solving the Metric Pitch BGA & Micro BGA Dilemma
Solving "Fine Pitch" Metric Pitch BGA routing is becoming increasingly challenging for PCB design layout. There are solutions but they are very hard to find. This presentation will cover common
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Event
IPC Midwest 2007
Case Study on the Validation of SAC305 and SnCu Based Solders in SMT,Wave and Hand-soldering at the Contract Assembler Level
insure the same quality a customer has been accustomed to with a Sn63Pb37 process is achieved. The reflow,wave soldering
and hand assembly processes must all be optimized carefully to insure go
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Event
IPC Midwest 2007
Impact Evaluation of Solder Transfer Peak Temperatures on C4NP Lead Free Solder Bumps
C4NP (Controlled Collapsed Chip Connection-New Process) is a novel solder bumping technology developed by IBM and
commercialized by Suss MicroTec. C4NP is a solder transfer technology where mol
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Event
IPC Midwest 2007
Productivity and Cost Efficiency of Lead-Free Selective Soldering
With the advent of widespread lead-free soldering,the issue of copper erosion has surfaced as a major quality concern when
soldering RoHS compliant through-hole devices. Many contract electroni
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Event
IPC Midwest 2007
0.3mm W.L CSP Assembly
Due to the ever-aggressive
miniaturization program that is rolling
through the electronics industry,the
next component that is fast approaching
this horizon is the 0.3mm CSP
• This paper will r
.. weiterlesen
Event
IPC Midwest 2007
Mechanical Vibrations: Its Effect on Assembly Equipment and Methods of Characterization
As electronic packages keep shrinking in size,high-speed high-accuracy package assembly equipment are becoming more
sensitive to mechanical vibrations. Alignment,positional and pick & place acc
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Event
IPC Midwest 2007
A Unique Process that Eliminates Solder Drossand Improves QualityP. KAY’s MS2
(not available)
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Event
IPC Midwest 2007
Thermal Expansion of Silicones in Electronic Reliability
CTE mismatches during temperature cycling can cause significant movement of components and materials relative to one
another,which in turn stresses solder joints and wirebonds. Silicones are of
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Event
IPC Midwest 2007
Testing the Lead Free Compatibility of Circuit Board Materials
(not available)
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Event
IPC Midwest 2007
Low Dielectric Fabrics
While glass fibers are commonly used to reinforce circuit board substrates,they have a high dielectric constant and loss.
Cyclic olefin copolymer fibers have a lower dielectric constant and los
.. weiterlesen
Event
IPC Midwest 2007
Low Temperature Characteristics of Silicones
Silicones are often used to protect electronic applications designed for cold environments. The low temperature flexibility
of silicones is well recognized,but not as well understood. While the
.. weiterlesen
Event
IPC Midwest 2007
Resin Options for Lead-Free Printed Circuit Boards
The regulation requiring lead-free solders for printed circuit boards (PCBs) has presented a number of challenges to our industry at virtually every stage of the process. For the brominated epo
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Event
IPC Midwest 2007
More Robust Base Materials for Electronic Assemblies
The proposed revision of IPC-4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new
slash sheets describing FR-4 base materials compatible with lead free a
.. weiterlesen
Event
IPC Midwest 2007
China RoHS-An Updated Roadmap to Achieving Compliance and Assessing Risks
(not available)
.. weiterlesen
Event
IPC Midwest 2007
A Comparison of Materials Testing Methods
Recent global environmental regulations affecting consumer electronics and electrical equipment,such as the European Union’s RoHS Directive,China ‘RoHS’ and others,have driven electronics manuf
.. weiterlesen
Event
IPC Midwest 2007
OEM Guideline to Selecting PCB Suppliers
Many large Original Equipment Manufacturers (OEMs) have a detailed procedure and a significant capital investment in
place for the selection of printed circuit board suppliers. This approval pr
.. weiterlesen
Event
IPC Midwest 2007
XRF Measurement of Residual Materials in Electronics Studio
(not available)
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Event
IPC Midwest 2007
Utilization of Buried Capacitance™:A Case Study
Embedding capacitive layers inside the Printed Circuit Board (PCB) have demonstrated the ability to reduce the number of
Surface Mount Technology (SMT) chip decoupling capacitors on the PCB sur
.. weiterlesen
Event
IPC Midwest 2007
An Integrated Registration System for High Technology Multilayer PCBs
(not available)
.. weiterlesen
Event
IPC Midwest 2007
SnCu Based Alloy Design for Lower Copper Dissolution and Better Process Control
(not available)
.. weiterlesen
Event
IPC Midwest 2007
An OEM’s perspective on copper dissolution in lead free assembly and rework
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Copper Removal from Plated thru Hole Barrels During Lead Free Minipot Rework
(not available)
.. weiterlesen
Event
IPC Midwest 2007
THE INFLUENCE OF THE PWB FABRICATION/ELECTRODEPOSITION PROCESS ON COPPER EROSION DURING WAVE SOLDERING
(not available)
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Event
IPC Midwest 2007
North American Environmental Compliance Attitudes Towards Electronics
More and more countries are beginning eco-compliance legislation for electronics products. Where does the USA stand? The
rest of North America? This paper will discuss the following areas and a
.. weiterlesen
Event
IPC Midwest 2007
Material Declaration Reporting - Going Proactive
Focus: Benefits of switching from a reactive to proactive ECR system Even with the RoHS deadline come and gone,most the ECR systems employed by suppliers follow the “reactive” model. Many suppl
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Event
IPC Midwest 2007
Designing a Data Storage System for Environmental Compliance (Focusing on RoHS-type Legislation)
As more governments pass,implement,and enforce environmental compliance initiatives covering electronics,small to
medium sized businesses continue to struggle with what data should be tracked,h
.. weiterlesen
Event
IPC Midwest 2007
Voluntary Emmisions Control Action Program VECAP
(not available)
.. weiterlesen
Event
IPC Midwest 2007
QFN Rework Challenges in a Lead Free World IPC Midwest - Sept. 2007
It is clear that the future belongs to the ever shrinking component. Micro Lead Frame (MLF) components,and specifically the Quad Flat No-lead (QFN) packages have gained wide scale acceptance.
.. weiterlesen
Event
IPC Midwest 2007
Effects of BGA Rework Cycles on PCB Assembly Reliability
(not available)
.. weiterlesen
Event
IPC Midwest 2007
Efficient Thermal Transfer for Lead-free Hand Soldering
(not available)
.. weiterlesen
Event
IPC Midwest 2007