IPC Conference Paper Archive

As the electronics industry prepares to meet the requirements of the European Community’s RoHS directive on lead in electrical and electronic equipment an issue about which concern is frequentl .. weiterlesen

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The process challenges of lead free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl .. weiterlesen

The IPC's Lead Free program addresses one of the 6 Hazardous Substances regulated by the RoHs directive. Certification to the QC 080000,the IECQ HSPM Specification, addresses the other 5 Haza .. weiterlesen

Companies are refining their processes to better ensure their compliance with environmental regulations evolving around the world. These processes reflect internal use models and collaborative .. weiterlesen

The Restriction of Hazardous Substances (RoHS) directive is requires companies to change the way they design, manufacture,track,and bring new products into the market. In order to provide the n .. weiterlesen

Since the issue of the European Union directive [1] on the restriction of the use of certain hazardous substances in electrical and electronic equipment (RoHS) and its predecessor WEEE directiv .. weiterlesen

In order to meet the growing requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled solder (Sn/Pb) to lead free compatible al .. weiterlesen

New ROHS standards are forcing the electronics industry to find a replacement for leaded surface finishes. Even more rapidly than the legislative decision to move away from lead,electronics wer .. weiterlesen

A designed experiment evaluated the influence of several variables on visual appearance and strength of Pb-free solder joints. Components,with leads finished with nickel-palladium-gold (NiPdAu) .. weiterlesen

There are various C4 (Controlled Collapse Chip Connection) solder bumping technologies used in volume production. These include electroplating,solder paste printing,evaporation and the direct a .. weiterlesen

Although in Europe and North America wave soldering is widely regarded as a process that is being rendered obsolete by reflow processes the proliferation of electronic circuitry has more than c .. weiterlesen

The industry is in full transition towards lead-free assembly. Due to the different physical,mechanical and chemical properties of lead-free solder alloys,transitioning lead-free soldering with .. weiterlesen

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Nitrogen inerting has been widely reported to reduce defects in lead-free reflow soldering. However,many solder pastes available claim that they either do not need nitrogen or work equally well .. weiterlesen

The debate on the effect of voiding on BGA reliability has continued for years. Many PWB assemblers strive to minimize voiding,particularly with the advent of lead-free processing and in fine f .. weiterlesen

Many existing and some new laminate material test methods that are being proven useful for determining a laminate material's suitability for use in higher temperature lead-free assembly process .. weiterlesen

A comparison study was carried out with Sn3.5Ag and Sn3.8Ag0.7Cu solder balls on Ball Grid Array (BGA) components with Cu/Ni/Au pad finishing. This study shows that Sn3.5Ag C5 solder system per .. weiterlesen

The implementation of both RoHS and WEEE Directives by the European Union (EU) mandate that electrical and electronic products put on the market within the EU shall contain restrictive amounts .. weiterlesen

With the transition to high tin solders,and 100% tin finishes,some concerns have been raised about the possible occurrence of “Tin Pest”. This paper reviews the historical and recent data colle .. weiterlesen

This paper had as an aim to correlate the degree of voiding with reliability. Here the a purpose designed test vehicle was used,in which seven different solder pastes from three manufacturers w .. weiterlesen

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Companies not only need to understand the reliability issues with environmental compliance,but also the process of documenting the product’s compliance. Examples will be made – but whose proces .. weiterlesen

The many challenges with 0201 passive component assembly can be attributed to the solder paste volume,pad design, aperture design,board finish,type of solder paste,pick-and-place,and reflow pro .. weiterlesen

The continuing demand for smaller,lighter multifunctional portable electronic products has driven the use of miniature components. To satisfy this demand,01005 chip components are now commercia .. weiterlesen

Part miniaturization is inevitable in surface mount assembly. With each shift to smaller component types,new critical process parameters emerge and old process parameters become significantly m .. weiterlesen

As an increasing amount of functionality is crammed into today's mobile phones,designers must find ways to save board area. Two common solutions are the use of embedded passives and the use of .. weiterlesen

Currently there is not a specification within the IPC for the DK and DF of E-Glass reinforcements and there is no requirement to report the DK and DF of the glass formulation used to produce E- .. weiterlesen

New substrates for ultrathin multilayer boards consist of ultrathin glass fabric and a novel low elastic modulus thermosetting resin system. They are composed of various lineups with the same r .. weiterlesen

The proposed revision of IPC 4101 - Specification for Base Materials for Rigid and Multilayer Printed Boards contains new slash sheets describing FR-4 base materials compatible with lead-free a .. weiterlesen

Laminated woven glass reinforced polymer matrix composites (PMC) are commonly used in the electronics industry as a robust and effective substrate for circuit boards. In such applications,relia .. weiterlesen

The trend of increasing complication in the rework arena continues. Sources of today’s rework challenges include the development of smaller and smaller components and the continued difficulty o .. weiterlesen

The use of the Area Array Package and in particular,Ball Grid Array (BGA) technology in the electronics industry continues to increase due to the fact that this package type allows for a greate .. weiterlesen

PCB assemblies with numerous BGAs often go through multiple BGA reworks but there is not much data to suggest its effect on the long term solder joint reliability of the BGAs. This study is foc .. weiterlesen

As the electronic industry shifts to lead-free manufacturing,Sn whisker remains a key reliability concern. Several whisker mitigation strategies have been adopted by the component manufactures, .. weiterlesen

This document is intended to help manufacturers minimize the risk of failures from tin whiskers. It is the consensus of the iNEMI User Group that pure tin electroplating presents a risk in high .. weiterlesen

One manufacturing process used to attach RFI shields for medical applications/cellular phone circuit board assemblies consists of “snapping” the shell-like shields onto solder spheres that are .. weiterlesen

As wireless products use higher frequencies and demand higher density packaging solutions,the roles of electrical interconnects and substrate technologies become increasingly important. Flip ch .. weiterlesen

Thermoplastics have started to gain acceptance in some of the more challenging areas of advanced packaging,including MEMS,where lower cost,cavity style packages are required. Thermoplastics,lik .. weiterlesen

Rarely does a day pass by without a discussion centered on lead free manufacturing and it’s future impact on global electronics assembly. The WEEE and RoHS directives drafted in January 2003 wi .. weiterlesen

Regulatory restrictions and environmental needs are moving the electronics industry towards lead-free solders and other environmentally friendly materials. This massive effort has resulted in n .. weiterlesen

Different legislations or draft directives target the restriction or the ban of the use of lead in the world. The law banning lead-bearing electronic products (with a few exemptions) in the Eur .. weiterlesen

A new organophosphorus curing agent,Fyrol PMP,specially designed for electronic thermoset resins was recently introduced to the market. This paper describes the chemical structure and physical .. weiterlesen

Cleaning prior to conformal coating ensures optimal adhesion. In fact,a number of contaminations that are created during the soldering steps significantly impair the cross linkage and can be sa .. weiterlesen

As the electronics industry moves toward the implementation of Pb-free soldering,the impact on the assembly process must be considered. One process that is often over looked is the cleaning of .. weiterlesen

The enactment of the Restriction of Hazardous Substances (RoHS) Directive is prompting significant changes in solder paste formulations and their process conditions as manufacturers move to Lea .. weiterlesen

Portable electronic device circuit packs were ground up to more than meet EPA sieving criteria and were then subjected to the well known EPA Method 1311 leaching protocol. Based on work from th .. weiterlesen

Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) a .. weiterlesen