IPC Conference Paper Archive

As the electronic industry is moving to lead-free PWB final finishes and high density circuit boards,the widely used PWB finish,SnPb HASL,has to be replaced with a lead-free and coplanar PWB fi .. weiterlesen

A new low cost,simple and repeatable production test method for measuring signal loss of printed wiring board (PWB) interconnects is discussed. The method uses Time Domain Reflectometry (TDR) t .. weiterlesen

As technology progresses,electronic components that do bigger and better things are hitting the market. At the same time,the size of the PCB is shrinking. While circuit board designers could re .. weiterlesen

With the introduction of lead free electronics assembly worldwide,greater concerns are raised over factory control of materials and processes. Due to the mix of both leaded and lead free produc .. weiterlesen

There are many issues to be considered in the manufacturing of state-of-the-art electronic products. Today's electronic devices,whether based on flexible (FPC) or rigid (PCB) printed circuit bo .. weiterlesen

Work on assisting China's Ministry of Information Industry (MII) to assess the performance of a solder paste using the China alloy Sn3.0Ag0.5Cu0.019Ce (SACCe) was completed. Two Indium fluxes w .. weiterlesen

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. weiterlesen

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued,despite the challenges of higher cost lead-free production. In many cases assemblers .. weiterlesen

During the solder reflow processes many reactions occur. There is the reduction of oxides on the metal surfaces,metal dissolution,wetting to different surfaces,and intermetallic compound format .. weiterlesen

The purpose of this program was to evaluate the solder joint reliability,using the IPC-9701 standard as a guideline,of PCBAs that were assembled with conventional leaded and ROHS compliant lead .. weiterlesen

The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi .. weiterlesen

The reliability of aged and repaired lead-free and mixed lead-free/lead-based solder interconnects is an important issue for electronic equipment manufacturers. As a result of the global transi .. weiterlesen

New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators .. weiterlesen

New interconnect technologies continue to shrink feature size,increase routing complexity and component density in multilayer rigid and rigid-flex printed circuits. Printed circuit fabricators .. weiterlesen

The global electronics industry is exhibiting a widespread and growing interest in the technology of embedded passives. This interest can be attributed to three primary benefits. First,embedded .. weiterlesen

Many techniques have been developed to embed capacitors in printed wiring boards (PWBs) these days. The simplest way may be embedding chip capacitors in PWBs. However,since their thickness is o .. weiterlesen

It has been the conventional wisdom of the industry that the predominate board parameter associated with through hole plating is the aspect ratio of the through hole. While this is intuitively .. weiterlesen

The immersion silver process has become the first choice of final finishing for many original equipment manufacturers (OEM) because of its shortened process flow,good conductivity,even depositi .. weiterlesen

Jobs are becoming more difficult to complete to specifications as the complexity of parts increases. With electronic power components getting more advanced everyday reverse pulse technology is .. weiterlesen

In manufacturing flexible and rigid-flex boards,the metallization step using electroless copper poses a major challenge,namely the leaching of polyimide base material into the plating bath. Lea .. weiterlesen

This paper describes a new lead-free SMT rework process which avoids component overheating,reduces board warpage and cratering,and prevents adjacent components from thermal damage. In the repla .. weiterlesen

The use of tacky fluxes is common throughout the industry in applications such as ball attach,BGA repair and hand soldering. These applications employ different heating profiles,meaning that th .. weiterlesen

As companies transition over to lead-free assembly a certain amount of hand-soldering and rework will be performed. An article from Tech Search International last year did state that in Asia wh .. weiterlesen

BGA component removal and replacement are required during product development and repair operations. In general,a single rework on specific location is permitted without causing excessive damag .. weiterlesen

A family of SACX alloys has been developed with significant improvement in drop test performance on NiAu surface finish. Dopants such as Mn,Bi,Ti,Ce,and to a less extent Y for SAC105 have been .. weiterlesen

Wafer bumping using thin electroformed nickel stencils with ultra fine powder solder paste continues to gain popularity as a cost effective alternative to ball drop and electroplated technologi .. weiterlesen

The widespread use of SAC-based (SnAgCu) lead-free solder paste drives the industry toward a smaller process window. This is due to higher reflow temperatures as well as the limited thermal res .. weiterlesen

Our industry is slowly coming to the realization that many fluxes containing low molecular weight carboxylic acids cannot be adequately tested for surface insulation resistance and electrochemi .. weiterlesen

With the implementation of RoHS directives,pure tin plating is replacing lead in the tin-alloy used in the printed circuit boards and other worldwide electronics. Although use of tin provides a .. weiterlesen

This paper continues work by Sun Microsystems and the University of Maryland,CALCE[1] to predict plated through via life using laminate material properties,plated copper material properties,and .. weiterlesen

During the development of a new medical imaging system,via quality was identified as a potentially source of infantile failures. Premature via failures were precipitated in a critical 14 layer .. weiterlesen

For some years now,an area ratio of 0.66 or greater has been the criterion for stencil apertures to achieve acceptable volume control in the printed solder paste “brick,” for small apertures Me .. weiterlesen

As the electronics assembly industry adjusts to building boards with 0201 components,the next level of shrinkage for chip components is just around the corner with the emergence of 01005s. A ke .. weiterlesen

This paper will present seven different materials used for the production of both wave solder and reflow solder pallets. The goal of this study will be for the purpose of depicting machining ca .. weiterlesen

Corrosion of solder pots and solder pot components in wave soldering equipment has been reduced with the introduction of corrosion resistant coatings and improved lead free solder alloys. The l .. weiterlesen

This paper provides a high-level overview of many of the key lessons learned thus far in working with PCB fabricators in qualifying laminate/fabrication processes that will yield fundamental pr .. weiterlesen

Soldering with lead-free solders has become an international standard. A study conducted by the Dresden Technical University and rehm Anlagenbau examines which influences various parameters hav .. weiterlesen

This paper will present the testing performed to date by Lockheed Martin Missiles and Fire Control on Tin Whisker test coupons. Coupons are representative lead materials and are half coated wit .. weiterlesen

Tin whiskers are needle-like crystals of tin growing from pure tin or high-tin alloy surfaces,which may grow long enough to cause electrical shorts. Conformal coatings provide some protection a .. weiterlesen

The continued fast pace towards miniaturization is leading circuit board designers to push the envelope on integration density. This trend is driving fabricators to closely look at methods and .. weiterlesen

The migration to lead free reflow is bringing many challenges for the PCB industry. High Tg laminates,stability of materials thru 2X reflows,rework,moisture sensitivity etc. This requires caref .. weiterlesen

Mechanically drilled through holes in PWBs form interconnects between copper layers through the use of copper pads. These pads are larger than the drill diameter to account for such factors as .. weiterlesen

Stencil design is one of the key factors in determining how well any particular stencil will print solder paste. Today’s high volume,24 hour a day,seven days a week manufacturing operations req .. weiterlesen

The consumer’s interest for smaller,lighter and higher performance electronics products has increased the use of ultra fine pitch packages,such as Flip Chips and Chip Scale Packages,in printed .. weiterlesen

fast approaching this horizon is the 0.3mm CSP. This device represents a major assembly revolution within the Surface mount assembly (SMT) arena. The implementation of this device will require .. weiterlesen

This paper presents the results of our study on the development and optimization of lead-free wave soldering process for large and thick printed circuit boards (PCB),through multiple designs of .. weiterlesen

Increased electronic functionality can be achieved through the development of more complex silicon integration but that course generally requires a great deal of capital resources and an excess .. weiterlesen

Since the beginning of the digital printing era,methods have been sought to employ this knowledge for use in an elegant approach for producing circuitry. As long ago as the early 80s,companies .. weiterlesen

The process challenges of lead-free wave soldering often require the use of new flux chemistries when compared with the relatively tolerant tin-lead wave soldering process. In some cases,the fl .. weiterlesen

Lead-free wave soldering requires tighter process control than soldering with lead based alloys. A key area of the machine that impacts the ability to solder lead-free alloys without defects is .. weiterlesen