IPC Conference Paper Archive

The mobile communication devices such as cell phones require high speed transmission of large volume data as well as reduction in size and weight. When signal is transmitted in high speed and f .. weiterlesen

In 2006 we conducted two formal detailed experiments on the 01005-component assembly process. Two of the most significant findings from those experiments were that a 0.003” thick stencil is req .. weiterlesen

The trend towards ever smaller components and more function density continues unabated in the SMT field. Manufacturers and users must increasingly coordinate their activities to develop usable .. weiterlesen

When trying to achieve 40 microns of placement spacing,bridges and tombstones may occur due to the variation of the component dimensions,equipment accuracy and pickup position variations. Hawse .. weiterlesen

The change to lead-free solders has forced the electronics industry to consider more than it ever has before what properties are important in a solder. When the tin-lead eutectic was the only s .. weiterlesen

In general,new lead-free solder alloys with the following characteristics are desired in order to enable the continuation of miniaturization trend: (1) alloy with a reduced melting temperature, .. weiterlesen

With the increased use of lead-free alloys there has been interest in understanding the applications and limitations of final finish coatings for lead-free assembly processes. The higher temper .. weiterlesen

Advancements and evolutions in printed circuit board manufacturing,design,and electronics assembly have driven new research on high temperature organic solderability preservative (HT OSP) surfa .. weiterlesen

Organic Solderability Preservative (OSP) coatings feature among the leading surface finish options in the printed circuit board (PCB) industry because of their excellent solderability,lead-free .. weiterlesen

Choosing a Thermal Interface Material adhesive can have an impact on the reliability of the microelectronic package in harsh thermal environments where thermal cycling temperature ranges are mo .. weiterlesen

CSP underfill commonly acts to protect solder bumps of fine pitch CSP and enhances the reliability. This paper presents four snap curing underfills (=2min@150?or=5min@120?),tested on SnPb assem .. weiterlesen

As new generations of electronic products emerge they often surpass the capability of existing packaging and interconnection technology and the infrastructure needed to support newer technologi .. weiterlesen

In this study,thermal cycling tests for samples of different hole-fill percentages and voiding were conducted,and cross sections of the PTH solder joints were performed to evaluate the solder m .. weiterlesen

As the electronics industry prepares for the possibility of Pb-free Printed Circuit Board Assembly (PCBA) processing without the EU RoHS server Pb solder exemption,many studies continue to focu .. weiterlesen

To better evaluate CAF (Conductive Anodic Filament) growth we have developed a Test Printed circuit board (PCB) with narrow pitch through holes. (THs) This test PCB can evaluate anti-CAF proper .. weiterlesen

Designers of high performance electronics continue to have system requirements that necessitate the implementation of embedded resistors in microelectronic package and multilayer printed circui .. weiterlesen

When planning a trip for the first time there is usually a significant amount of planning and preparation involved. First,the destination is chosen that meets the objective (e.g. Las Vegas for .. weiterlesen

The increase in board routing density,decrease the hole-to-hole spacing and lower to 0.30mm. High aspect ration PTH reliability is not the major issue since the plating copper has at least 20% .. weiterlesen

This paper discusses laser micromachining of thin films. In particular,recent developments on high capacitance,large area,thin,flexible/rollable embedded capacitors are highlighted. A variety o .. weiterlesen

The continued drive for more compact and lightweight handheld mobile devices has forcibly pushed the electronics assembly industry to look for novel packaging and assembly technologies. One of .. weiterlesen

The motivation for developing higher density IC packaging continues to be the personal entertainment and the portable handset markets. Consumers? expectations are that each new generation of pr .. weiterlesen

Increased functionality and smaller devices are significant drivers in innovative packaging designs. One of the newer package types to be introduced into the market place in the past few years .. weiterlesen

New packaging technologies are making higher demands on components and also jointing techniques. The application of polymer electronics as well as the integration of optical components into the .. weiterlesen

Mixed leaded and lead-free processing requires that reflow ovens change temperature. Cooling a modern oven can take a long time,even longer than an older oven because modern ovens are more insu .. weiterlesen

The flux management system for a reflow oven is highly critical to the quality,cost,and yield of a reflow process. Flux accumulation and dripping inside the oven not only requires frequent main .. weiterlesen

In recent years,various studies have been issued on cleaning under low standoff components; most however,with incomplete information. It is essential to revisit and describe the latest challeng .. weiterlesen

One of the most popular pieces of equipment in the PCB fabrication industry is the inline processor. These machines are used for a variety of tasks including resist removal,etching and cleaning .. weiterlesen

Highly dense circuit assemblies increase the cleaning challenge. Batch cleaning equipment designs provide a small footprint,low cleaning fluid consumption,and low cost of ownership. Batch clean .. weiterlesen

This paper will discuss the technical challenges associated with the selection of chemical additive for the printed circuit board assembly (PCBA) and stencil cleaning processes. The removal of .. weiterlesen

Addition of Al into SAC alloys reduces the number of hard Ag3Sn and Cu6Sn5 IMC particles,and forms larger,softer non-stoichiometric AlAg and AlCu particles. This results in a significant reduct .. weiterlesen

Some Ball Grid Array suppliers are migrating their sphere alloys from SAC305 (3% Ag) or 405 (4% Ag) to alloys with lower silver contents. There are a numerous perceived benefits to this move in .. weiterlesen

Embedded resistors and capacitors provide high-density high-performance solutions,freeing up the surface for other components and enabling tailored interconnect topology. This technology needs .. weiterlesen

This paper discusses micro-filled epoxy-based conducting adhesives modified with nanoparticles for z-axis interconnections, especially as it relates to package level fabrication,integration,and .. weiterlesen

SN100C (Sn99Cu0.7 with Ni- and Ge-micro-additions) is a lead-free solder alloy that is finding increased acceptance globally and holds promise as a mainstream solution in terms of long-term sol .. weiterlesen

The recent use of lead free alloys has made the wave solder process more challenging in terms of achieving acceptable solder joints for both SMT and PTH components. It has been found that the D .. weiterlesen

Flexible electronics is the future trend of the worldwide electronic industry. The RFID tag is one of the main applications in flexible electronics currently. This paper presents a flexible HF .. weiterlesen

The peel test will be reviewed,with special attention given to deposited adhesiveless copperclads. Details of the specification are reviewed The relevance of the title subject will be addressed .. weiterlesen

A series of advanced screen-printing processes have been developed to build functional high density flexible electronic circuits. Not only do the single layer circuits have fine conductor trace .. weiterlesen

Solder joints tend to crack after extended thermal cycling,if the component and the circuit board are CTE mis-matched. Predicting t-cycle lifetime is a crucial first step in optimizing product .. weiterlesen

As the use of area array connectors has become more widespread in electronic assemblies,the need to evaluate their reliability has increased. There is,however,limited information on how best to .. weiterlesen

Failure analysis was performed on fourteen thermally cycled or vibration tested PDIP components from the JCAA-JG-PP Lead-Free Joint Test Project. The components differed in component finish,sol .. weiterlesen

Typical PCB materials have inherent properties (the “Fiberweave Effect”) which can be detrimental to the Signal Integrity of the physical link. This presentation describes the effect and a mean .. weiterlesen

More and more circuit board designs require signals paths that can handle multi-gigahertz frequencies. The challenges for organic circuit boards,in meeting these electrical requirements,include .. weiterlesen

As designers strive to extract ever more performance from high speed transmission lines on FR4 substrates and their high speed derivatives,a requirement has arisen for a practical and robust “G .. weiterlesen

Recent industry trends have focused around alternatives for the commonly used SAC305 or SAC405 alloys for wave soldering and solder fountain rework processes. Industry consortia are currently f .. weiterlesen

Copper erosion from plated through holes (PTH) barrels in printed circuit boards (PCB) during both wave soldering and mini-pot rework can increase the risk of PTH reliability failures during fi .. weiterlesen

The increasing use of lead-free solder has introduced a new set of process parameters when setting up wave solder equipment for effective soldering. Determining the proper flow characteristics .. weiterlesen

Printed Circuit Boards (PCB) and IC Substrates are the essential building blocks of electronics. As the technology moves rapidly into the future,the electronics industry faces issues with hot s .. weiterlesen

Following the implementation of WEEE legislation,there will be an increasing interest in adopting more sustainable manufacturing processes and materials as targets are increased,and must be ach .. weiterlesen

Printing technologies provide a simple solution to build electronic circuits on low cost flexible substrates. Nanocomposites will play important role for developing advanced printable technolog .. weiterlesen