Description Rosin-based no-clean solder pastes are the most widely used solder pastes in the world and dominate consumer electronics assembly. The most common rosin-based no-clean solder paste reflow environment is air,which has some obvious advantages such as no-cost and tombstoning mitigation. ... read more

Description Prior to any conformal or chemically vapor deposited coating process,specific areas and components-often called “keep out zones”-on the printed circuit board (PCB) assembly are generally masked to shield them from exposure to coating materials. ... read more

Description Since the introduction of lead-free soldering technology,voids in solder joints have been a topic of intensive investigations and discussions. One issue of detailed investigations is the formation mechanism of voids in solder joints. ... read more

Description Voids are a plague to our electronics and must be eliminated! Over the last few years we have studied voiding in solder joints and published three technical papers on methods to “Fill the Void.” This paper is part four of this series. ... read more

Description Silicone thermal interface materials (TIM) are used to bond heatsinks on many critical components in server card assemblies in typical industry systems. Silicone TIMs have excellent high temperature mechanical stability and resilience. ... read more

Description Knowing how package warpage changes over temperature is a critical variable in order to assemble reliable surface mount attached technology. ... read more

Description This paper focuses on three different coating material groups which were formulated to operate under high thermal stress and are applied at printed circuit board manufacturing level. ... read more

Description The symbiotic relationship between solder masks and selective finishes is not new. The soldermask application is one of the key considerations to ensure a successful application of a selective finish. ... read more

Description There are numerous techniques to singulate printed circuit boards after assembly including break-out,routing,wheel cutting and now laser cutting. ... read more

Description This paper explores the process of identifying and evaluatingpotential counterfeit parts. ... read more

Description This paper explores the process of identifying and evaluatingpotential counterfeit parts. ... read more

Description With the dramatic increase in connected devices in the IoT era,it is becoming imperative to do much more to ensure the quality of all electronic components,especially for devices in mission-critical applications. ... read more

Description Since the European Directives,RoHS (Restriction of Hazardous Substances) and REACH (Registration,Evaluation,Authorization and Restriction of Chemicals),entered into force in 2006-7,the number of regulated substances continues to grow. ... read more

Description The Augmented Reality and Virtual Reality market is expected to cross $44 billion by the year 2025 according to various industry experts. ... read more

Description E-textiles,also known as electronic textiles,smart textiles,smart clothing,smart garments,or smart fabrics,are fabrics with electronic components and sensors embedded in them. ... read more

Description Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. ... read more

Description Cleanliness is a product of design,including component density,standoff height and the cleaning equipment’s ability to deliver the cleaning agent to the source of residue. ... read more

Description The requirement to reconsider traditional soldering methods is becoming more relevant as the demand for bottom terminated components (QFN/BTC) increases. ... read more

Description Leadless semiconductor plastic packages (QFN) is a growing package category in terms of market share and diversity. This is also valid for low pin count semiconductors (e.g.: transistors and diodes). Several semiconductor companies offer a wide variety of leadless packages for such products. ... read more

Description The increased demand for electronic devices in recent years has led to an extensive research in the field to meet the requirements of the industry. Electrolytic copper has been an important technology in the fabrication of PCBs and semiconductors. ... read more

Description Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturability and quality. One primary aspect in the overall board function is the acid copper plating process. ... read more

Description Advances in the printed wire board industry toward miniaturization,finer traces and HDI technology,smaller through-holes and microvias have placed higher demands on board design,manufacturability and quality. One primary aspect in the overall board function is the acid copper plating process. ... read more

Description The introduction of lead-free solders resulted in a selection of different chemistries for solder pastes. The higher melting points of lead-free alloys required thermal heat resistant rosin systems and activators that are active at elevated temperatures. ... read more

Description Pockets of gas,or voids,trapped in the solder interface between discrete power management devices and circuit assemblies are,unfortunately,excellent insulators,or barriers to thermal conductivity. ... read more

Description It is well known that during service the layer of Cu6Sn5 intermetallic at the interface between the solder and a Cu substrate grows but the usual concern has been that if this layer gets too thick it will be the brittleness of this intermetallic that will compromise the reliability of the joint,p ... read more

Description Voiding is a key concern for components with thermal planes because interruptions in Z-axis continuity of the solder joint will hinder thermal transfer. ... read more

Description Solder paste has been used in the surface mount technology for many years. However,a complete understanding of the effect of key powder characteristics on the paste properties is still not achieved. ... read more

Description High reliability process automation devices require serious protection from harsh environments which can be a combination of moisture,corrosive gases and liquids,salt sprays,large temperature variations,mechanical vibration and fungus. ... read more

Description Very low viscosity formulations are often required for very thin conformal coating applications. Solvents are used to reduce viscosity of the formulations and accommodate dispensing needs. ... read more

Description A new hybrid ALD/CVD protective coating is being considered as a low-cost alternative to poly-para-xylylene and traditional liquid conformal coatings. All of the typical conformal coatings protect the printed circuit boards. ... read more

Description Security has become a vital part of electronic products as they handle sensitive data in uncontrolled environments and as they face more and more content protection issues. ... read more

Description The electronics industry trend continues to be to continually increase capability and performance within an existing or smaller footprint. Shoehorning all of the required components onto the exterior surface of the PCB has become an increasingly difficult puzzle. ... read more

Description More and more people and things are using electronic devices to communicate. Subsequently,many electronic products,in particular mobile base stations and core network nodes,need to handle enormous amounts of data per second. ... read more

Description There are times when a PCB prototype needs to be built quickly to test out a design. ... read more

Description Rising customer demands in the field of PCB repair are a daily occurrence as the rapid electronic industry follows new trends in a blink of an eye. New strategies and technologies are required to fulfill those demands. ... read more

Description Automating electronics assembly is complex because many devices are not manufactured on a scale that justifies the cost of setting up robotic systems,which need frequent readjustments as models change. ... read more

Description Choosing an outsourced manufacturing partner that is perfect for a new product and close to your design team is quite different to choosing a partner that can manufacture that same product in volume in lower cost locations and fulfil globally. This is where the Gateway model comes into its own. ... read more

Description As the demand for higher routing density and transfer speed increases,Via-In-Pad Plated Over (VIPPO)has become more common on high-end telecommunications products. ... read more

Description Cold ball pull testing is used to validate the resistance of PCB pad cratering for the different ultra-low loss dielectrics materials (Dk=3~4.2 and Df <= 0.005 @ 1GHz) in the study. ... read more

Description Electroless nickel electroless palladium immersion gold (ENEPIG) surface finish for printed circuit board (PCB) has now become a key surface finish that is used for both tin-lead and lead-free solder assemblies. ... read more

Description The stimulating impact of the automotive industry has sharpened focus on immersion tin (i-Sn) more than ever before. Immersion tin with its associated attributes,is well placed to fulfill the requirements of such a demanding application. ... read more

Description While there have been quite dramatic and evident improvements in almost every facet of manufacturing over the last several decades owing to the advent and mass adoption of computer automation and networking,there is one aspect of production that remains stubbornly unaffected. ... read more

Description Work instructions are time consuming to generate for engineers,often requiring regeneration from scratch to address very minor changes. They need to be produced in varying levels of detail,with varying guidelines,for multiple stations,operators and lines. ... read more

Description Electronic assemblies use a large variety of polymer materials with different mechanical and thermal properties to provide protection in harsh usage environments. ... read more

Description A study was performed to investigate,evaluate and qualify new reworkable underfill materials to be used primarily with ball grid arrays (BGAs),Leadless SMT devices,QFNs,connectors and passive devices to improve reliability. ... read more

Description It is well documented that Nano coatings on SMT stencils offer many benefits to those assembling PWBs. With reduced standard deviation and improved transfer efficiency nano coatings can provide,there is also a cost. ... read more

Description With each new generation,the complexity in the design of flip chip devices,as exemplified by thinner package stack-ups,larger device sizes,and multiple die configurations,is increasing significantly. ... read more

Description Cleanliness level of PCBs is becoming more and more critical given component miniaturization,component density,and manufacturing practices that include no-clean solder flux. ... read more

Description PCB design has evolved greatly in recent years becoming ever more complex. Board density is increasing,component standoff heights are decreasing and long term reliability requirements are greater than ever,particularly for Class III products. ... read more

Description PCB board manufacturers engage in a number of wet processes. Water is used ubiquitously in many of these processes for rinsing as well as bath make-up. The impacts of water quality on production processes and product quality are many times ignored. ... read more