Description WECC Global PCB Production Report is an annual report published by the World Electronic Circuits Council (WECC), including IPC. The members of WECC include the printed circuit associations of the major PCB-producing countries and regions. ... read more

Description This paper introduces line confocal technology that was recently developed to characterize 3D features of various surface and material types at sub-micron resolution. ... read more

Description Both the number and the variants of Ball Grid Array packages (BGAs) are tending to increase on network Printed Board Assemblies (PBAs)with sizes ranging from a few mm die size Wafer Level Packages (WLPs) with low ball count up to large multi-die System-in-Package (SiP) BGAs with 60-70 mm side len ... read more

Description Voiding in bottom termination components (BTCs) like QFNs and LGAs have become quote the hot topic in the SMT industry. Surprisingly,one type of BTC component that is observed to have excessive amounts of voiding is the D-PAK. ... read more

Description The demand to produce smaller electronic devices and products to meet the needs of consumer electronic applications has resulted in thinner ball grid array (BGA) packages with finer pitches. ... read more

Description In this era of electronics miniaturization,high yield and low cost integrated circuit (IC) substrates play a crucial role by providing a reliable method of high density interconnection of chip to board. ... read more

Description The electronics industry is further progressing in terms of smaller,faster,smarter and more efficient electronic devices. This continuous evolving environment caused the development on various electrolytic copper processes for different applications over the past several decades. ... read more

Description In this study,the question was how to perform statistically reliable robust- ness tests for the non-contact drop-on-demand printing of functional fluids,such as solder paste and conductive adhesives. ... read more

Description Shielding electronic systems against electromagnetic interference (EMI) has become a hot topic. ... read more

Description The use of high performance electronic assemblies in harsh environments subject solder interconnects to complex loading conditions that are primarily driven by the behavior of circuit card assembly and mounting constraints. ... read more

Description When it comes to reliability assessment of an electronic system,consisting of several components,such as an assembled printed circuit board (PCBA),this often turns out to be a challenging task. ... read more

Description Plasma is considered to be the 4th state of matter. Decomposed molecules interact with all exposed surfaces of the material,even the inner surfaces of open cell structures. ... read more

Description Conformal coating formulators are developing two-component solutions that improve protection,adhesion,and cure speed. Multi-component coatings are not new to the industry. Some of the oldest conformal coating formulations available are of the two-component variety. ... read more

Description Solder paste is one of the most common materials used in surface mount technology (SMT) processes. Typical methods for applying solder paste to devices are needle dispensing or screen printing,each one has specific benefits and drawbacks. ... read more

Description Components are still shrinking in the SMT world and the next evolution of the passive components are the m03015 (009005) and m0201 (008004). Today it is seen that the 01005 component is still relatively unused in most of today’s printed circuit board assemblies. ... read more

Description In Power Electronics,increasing attention are drawn to silver sinter materials as an attractive interconnect material for its properties and also as a lead replacement solution. ... read more

Description A production process free from defects,with every production step being reproducible and traceable,is the target of quality assurance in electronics production worldwide. In many cases manual rework processes are not allowed,due to quality related reasons and cost issues. ... read more

Description Aerospace Defense High Performance (ADHP) electronics products primarily use tin-lead solders,but electrical and electronic component finishes (i.e.,platings) increasingly are designed for lead-free solders. ... read more

Description Printed circuit assemblies have become more susceptible to a failure mode known as “pad cratering” due to the implementation of several material restrictions. Pad cratering is defined as mechanically-induced fracture between the copper pad/trace and printed circuit board (PCB)laminate. ... read more

Description Printed Circuit Board (PCB) weave texture and weave exposure are conditions that may appear similar if appropriate inspection techniques are not applied in a manner that can differentiate between the two. ... read more

Description Reliable operation of electronics at higher temperatures requires a combination of performance improvements in components,interconnects and substrates. Ceramic based substrate options can be costly,heavy and prone to mechanical damage. ... read more

Description The electronics industry could benefit greatly from low cost,easy to apply coatings that can be applied to almost any PCBA surface in order to provide effective and practical water (damage) resistance. ... read more

Description In restricted-space applications,flexible PCBs must be able to fold with especially small bend radii. This in turn requires the return planes associated with microstrip and stripline transmission lines be cross-hatched. ... read more

Description Ultra-fine flexible circuitry has been more and more applied in electronic devices due to their fast innovation and the increasing demand on miniaturization,light weight and flexibility in some cases. ... read more

Description Any company that designs PCBAs that has gone through the throws of an acquisition,CAD tool change or even an EMS company with a varied customer base has to deal with more than one EDA tool and library. Many questions arise. ... read more

Description During the design of printed wiring boards,our engineers exchange files between the MCAD and ECAD tools in order to synchronize boards and to validate the fulfillment of design requirements. ... read more

Description Electronic component end-of-life (EOL) and declining prices are more problematic to industrial than consumer electronic products. Industrial electronic products typically have long product lifecycles. 10 years,15 years and up to 20 years are common. ... read more

Description A new discovery of missing fundamental controls in electronic manufacturing is the cause for most Electric Overstress failures generated by PCB and cable discharge events. ... read more

Description Automated X-ray inspection post solder reflow is used to automatically analyze and detect structural defects including solder voids,opens,shorts,insufficient solder and other defects. These defects typically account for 80%to 90% of the total defects on an assembled circuit board. ... read more

Description Assemblers of printed circuit boards seek to provide their customers with high-quality products at the lowest possible cost. The total cost of production must take into account the complete product lifecycle including warranty,recalls and repairs. ... read more

Description In case of broadband technology,component packages and other devices assembled on the PCBs are ever-shrinking,yet demands for quality,precision and reliability remain the same. Thus,how can manufacturers ensure they are sufficiently clean to meet the stringent quality and reliability demands? ... read more

Description Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to black-pad defects (hyper-corrosion related failures) associated with de-wetting of solder. ENIG also suffers from brittle solder joint failures. ... read more

Description Solder joint reliability has been a key issue for electronic assemblies and microelectronic packaging for many years. ... read more

Description Storage time allowed between bare printed circuit board manufacturing and assembly is quite limited. Based on an interpretation of IPC standards,shelf-life of the surface finish is the limiting factor. A lot of boards are scrapped worldwide because they have exceeded their shelf-life. ... read more

Description Effective Roughness Dielectric (ERD) is a homogeneous lossy dielectric layer of certain thickness with effective (averaged) dielectric parameters. ... read more

Description Imbalanced weakly and strongly edge-coupled differential pairs on printed circuit boards (PCBs),both microstrip (MS) and stripline (SL),are studied under different conditions using mixed-mode S-parameters. ... read more

Description It is common for PCBs used for high frequency RF or high speed digital applications,to be tested for an impedance value prior to shipping the board. The controlled impedance board is typically specified to a nominal impedance value with a given tolerance. ... read more

Description A novel lead-free solder alloy 90.6Sn3.2Ag0.7Cu5.5Sb (SACSb),was developed targeted for high reliability with a wide service temperature capability. ... read more

Description Electronics manufacturers are searching for new lead-free solders that can improve upon SAC305 voiding performance and that exceed the current thermal cycle performance of this solder in harsh environments,all the while being processed at or near current typical SAC305 peak temperatures. ... read more

Description Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the creeping of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCBs. ... read more

Description The European Union RoHS directive took effect in 2006,and of the 6 restricted materials,the elimination of lead from electronic devices took the most development effort and had the worst degrading effect on hardware reliability. ... read more

Description Over the past few years,studies have shown that Nano-coatings can improve solder paste release and reduce underside cleaning in the print process. Many of these studies have focused on print volume and the improvement of transfer efficiency in small component printing. ... read more

Description The mobile and consumer market is the driving force of the electronics assembly sector,this sector historically has been associated with early adopters of leading edge surface mount technology (SMT). ... read more

Description Most manufacturers of electronics grade glass fiber reinforcement used in today’s laminates apply treatments to enhance the bonding strength between the inorganic e-glass and the epoxy matrix which surrounds it in the laminate structure. ... read more

Description Internet of Things (IoT) adoption pushes the boundaries of Printed Circuit Board (PCB) miniaturization and speed employing more hybrid stack-ups. ... read more

Description Printed wiring boards(PWBs) have recently been experiencing higher thermal stress in car electronics and high current equipment,etc. ... read more

Description This work presents the fabrication of embedded inductors and the experimental laser machining of gaps in the underlying ferrite structure. Design calculations are presented for a test coupon of power inductors. ... read more

Description As the IoT market demands higher data rates and processing,the PCB technology is driving for smaller form factors,higher signal densities,and advanced material solutions. Miniaturization has been a common trend. ... read more

Description Misregistration of holes is the maximum amount of variation between the centerlines of all terminal pads within one plated through hole in a printed circuit board. ... read more

Description Sixteen simple inorganic salts were separately dissolved in water to a specific concentration,applied to separate Surface Insulation Resistance (SIR) coupons,dried and then the coupons were subjected to common SIR testing. ... read more