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Description A growing need is developing in the high-speed digital arena (backpanels,motherboards,line cards etc) for materials offering sufficient signal integrity for applications up to 10 Gbps. ... read more

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Description All-aromatic polyester,one of the super engineering plastics,is highly regarded as a base material of electronic circuit for its environmental compatibility,moisture resistance,dimensional stability and heat resistance. ... read more

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Description Advances in information/communications technology are transforming the Internet from a medium for searching for information into a medium for providing and receiving various types of information and services. ... read more

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Description With the advent of digitisation,networking,broadband telecommunication,and miniaturization in electronic set products,electronic devices are essentially required to deliver high electrical and mechanical performance that correspond with this trend. ... read more

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Description The growing use of high density interconnect (HDI) substrates in the microelectronics packaging industry has brought along a broad range of yield issues. Many of these issues are associated with surface defects in the interconnect terminals and solder mask areas of the finished substrates. ... read more

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Description It is becoming impossible to realize the latest mobile phones and other mobile equipment without Chip Size Packages (CSP) and other high-density semiconductor package technology. ... read more

Description Liquid crystalline polymer (LCP) substrates offer a number of advantages for high-density packaging. ... read more

Description In today's world of electronics the keywords are smaller,faster and cheaper. With more and more circuitry going onto existing circuit boards,the designers are searching for ways to contain this additional functionality in the same,or smaller,space envelope. ... read more

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Description With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the user. ... read more

Description The multiple die chip-scale package technology (identified as the ?Z™) is a truly innovative,folded-flex stacked packaging technology. The concept has already been proven in a collaborative development effort between Tessera and two customer companies. ... read more

Description With the advent of more flexible versions of pulse-reverse plating technologies,and with the ability to program more of the waveform parameters,comes an increased number of options facing the user. ... read more

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Description Laser-drilled microvias are being added to the list of approved technologies for printed wiring boards destined for use in a rapidly increasing number of application types and environments. ... read more

Description Despite the strong increase in demand for high-density circuit boards,very few manufacturers are offering microvia architectures in high volume. Current microvia technologies require significant changes in multilayer manufacturing methods as well as new materials and new chemistries. ... read more

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Description The evolution of interconnection systems for Printed Circuit Boards has been extremely interesting. The first connections were those generated in a copper foil on the surface of a single sided insulating substrate. ... read more

Description The need for the high density provided by Build-up PWB installed in the mobile communication products requires the general trend towards a gradually smaller hole diameter. ... read more

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Description For faster,smaller,and high performance integrated circuits the new concept of buried bump interconnect substrates is required. We have developed B2itTM (buried bump interconnection technology) for this technical trend. ... read more

Description The last 10 years have seen the rise of lasers used in the interconnect industry to a point where their use is almost becoming ‘main stream’. As line width and spacing requirements become smaller,lasers will play an ever increasing role in the manufacture of interconnect devices. ... read more

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Description As CPUs increase in performance,the number of passive components on the surface of the boards are increasing dramatically. To reduce the number of components,as well as improve the electrical performance (i.e. reduce inductance),designers are increasingly embedding capacitive layers in the PCB. ... read more

Description Increasing component density and the requirements of higher performance electronic devices are driving the development of embedded passive devices in the printed circuit board (PCB). ... read more

Description The current technology includes transmission of between optical units (typically modulated laser sender and receiver units) and fiber optic cables or flexible kapton fiber optic cables with which we are all relatively familiar. ... read more

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Description Several factors are driving the need for buried passive components in printed circuit boards and chip carriers. Increasing frequency increases the difficulty in quieting noise by the use of surface mounted discrete capacitors and resistors. ... read more

Description The increased need for smaller,faster,and cheaper electronics has led the microelectronics industry to explore a number of new enabling technologies. ... read more

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Description There are many board finishes in use today and the EMS provider must learn to use many,if not all of them. However,all board finishes do not perform the same during assembly and test operations,which can impact assembly yield and solder joint reliability. ... read more

Description Over the last five to eight years the use of HASL alternatives by the OEM’s and CM’s has increased dramatically,particularly in response to increasing board density and the need for a solderable planar surface that increases their yields at assembly. ... read more