Description As Conductive Anodic Filament (CAF) testing on Printed Circuit Boards (PCBs) approaches 50 years of industry attention, the chemistry of formation in the lab environment is well documented, significant resources have been expended in passing the lab test, and new efforts are in progress to make t ... read more

Description As the manufacturing sector is under constant pressure to satisfy customers’ demands in a competitive market by applying complex processes to meet manufacturing cost and schedule goals, the need to identify quality variables within processes is occurring at a faster rate. ... read more

Description To ensure the highest possible quality standards in automotive electronics production, an extensive implementation of testing and inspection systems throughout production is mandatory. ... read more

Description The key challenge for industry in adopting AI into their manufacturing processes surrounds the accessibility of their data. Many manufacturing industries, especially electronics manufacturing, suffer from a lack of standard data protocols often due to the use of legacy equipment. ... read more

Description Neural network based deep learning models increasingly demonstrates high accuracy in object detection and image classification in digital image processing. The manufacturing industry is adapting this advanced technology to assist in automated quality assurance. ... read more

Description Photonic soldering utilizes high intensity flashes of visible light to achieve wide area heating with exceptional uniformity. Solder paste is heated to its liquidus temperature using radiative energy transfer, and light is converted to heat through optical absorption. ... read more

Description IPC-HERMES-9852 as the smart replacement for the long-used IPC-SMEMA-9851 provides machine-to-machine (M2M) communication that ensures consistency of each PCB and its individual data while traveling down an SMT Line in production.  Thus, Hermes enables machines to consistently transfer a PCB toge ... read more

Description With the advancement of emerging technologies such as AI, Cloud and Block Chain, the electronics manufacturing industry is entering a new era of smart manufacturing. ... read more

Description The Factory of the Future or a Lights out Factory will require significant automation, including many functions that are challenging and are still performed manually due to the complexity and human dexterity needed. ... read more

Description The IPC Connected Factory Exchange (IPC-CFX) standard provides genuine plug-and-play IIoT data exchange between machines and supervisory systems across the shop floor. ... read more

Description With the Industry 4.0 transformation going full steam ahead, analytics have transformed the industry from being process-driven to now data-driven, where data speaks for itself. Conventionally, only failed measurement data are logged for repair and troubleshooting purposes. ... read more

Description This case analysis evaluates the thermal profile of 10 FETs rated at 48V, 250A under 100 secs soak time with all the thermally enhanced mechanical attachments installed. ... read more

Description Liquid metal alloys (LMAs), GaIn, and Galinstan, have been paid considerable attention as thermal interface materials (TIM) for usage of thermal management in microprocessor packages, including CPU, GPU and HPC, in PCs and super computers. ... read more

Description Modern electronics are prone to experience electromagnetic interference (EMI) which hinders proper functioning of the devices due to the increasing number of wireless devices and the miniaturization. ... read more

Description Thermal interface materials (TIMs) are ubiquitous in electronics cooling in a wide variety of applications in industrial, automotive and consumer electronics [1]. These materials are typically comprised of a soft polymeric matrix with thermally conductive fillers. ... read more

Description In a previous paper [8], solid liquid hybrids (SLHs) were presented as a combination of metals that are solid at room temperature with ones that are liquid at room temperature. ... read more

Description In the present research, we have studied the influence of Ag additives on wettability, adhesion, oxidation, viscosity and modulus of liquid metal on two alloys – Liquid Metal 1 (“LM1”) (62.5Ga, 21.5In, 13Sn) and Liquid Metal 2 (“LM2”) (78.6Ga, 21.4In)– to develop new thermal interface materials f ... read more

Description Light weight, conformal and portable standalone power solutions are becoming increasingly important for powering wearable electronics including fabric embedded sensors, to monitor the physi ... read more

Description Wearable devices for biomedical applications have become more popular due to the increasing demand on health monitoring for both consumer and medical fields. ... read more

Description SINTEC is the project name for a Liquid metal alloy technology with the goal of creating flexible and stretchable electronics.  These stretchable electronics are applicable to wearable sensors that collect motion data of humans.   The stretching allows direct application of wearable electronics t ... read more

Description Textile-based touch sensing offers a novel solution towards creating flexible and robust tactile interfaces that fit within an existing manufacturing ecosystem.  Current fabric-based touch sensors can measure distributed and nuanced touch while maintaining textile qualities such as stretching and ... read more

Description ... read more

Description The research presented in this slide show utilizes E-Textiles.  The applications include: ... read more

Description The DoD conducted a survey of PCB companies and the effects of COVID19.  The survey results showed that: ... read more

Description Indiana Integrated Circuits has developed "Quilted" modular PCBs.  They consist of multiple small "boardlets" with traces or pads on rough edges of the boards.  These rough edges fit together with other boards like a jigsaw puzzle.  This type of in board encoding ensures high security from tamper ... read more

Description The Dod Executive Agent For Printed Circuit Board and Interconnect Technology (PrCB EA) has a vested interest in the state of the electronics industrial base and its ability to sustain and improve national defense systems.  By using a two-year cycle, the PrCB EA creates both a report and a supple ... read more

Description This paper describes a new design approach to improve the cost efficiency of the “Flexible Printed Circuit” board (FPC also known as FPCB, “FPC” hereafter) by analyzing the impact of the board outline shape to the FPC manufacturing panel utilization during the early design phase. ... read more

Description To magnify data transmission efficiency, high electrical performance of PCB boards is required for 112Gbps. The required operation frequency tends to increase, and target loss tends to decrease. ... read more

Description This slide show discusses the different categories of SMT components including, BTCs, dual and quad leaded packages, and passives.  The component use cases and typical challenges are exemplified with charts and images. ... read more

Description The lack of material provenance in today’s supply-chain allows the undetected ingress of counterfeit materials to increase at alarming levels. Chemicals, components, including critical ICs, as well as simple passive components, assemblies and finished goods are all subjected to this threat. ... read more

Description One of the most important aspects of the IPC Digital Twin standard, is the enablement of interoperability between many digital twin-based solutions across many facets of the holistic manufacturing technical and business process. ... read more

Description The purpose of conformal coatings is to protect printed circuit boards and components mounted on them from the deleterious effects of moisture, particulate matter and corrosive gases. ... read more

Description DurafuseTM LT paste was designed as an alternative low temperature solder targeting at enabling hierarchy design for portable devices with good temperature cycling and superior drop-shock performance. ... read more

Description Historically, evaluations of solder joint failures and solder joint reliability have been done with direct current (DC) methods, using event detectors or data loggers for high-frequency circuits. ... read more

Description Rework of assembled boards is often a necessary but difficult proposition. The complexity of the rework increases with the number of components to be reworked. A specific case involves where many passives must be removed and replaced without damaging or de-soldering adjacent components. ... read more

Description This paper compares the thermal cycling performance of a quad flat no-lead (QFN) component and three different ball grid array (BGA) components assembled onto printed circuit board test vehicles of 4 different thicknesses from .040 to .125 inch thick that are otherwise identical for IPC 9701 test ... read more

Description This Slide Show Utilizes the Cover Paper from the session.   ... read more

Description This slide show discusses inverters and power electronics for Heavy Machinery.  There is discussion of Wide Band Gap Powered Devices.  The purpose is increased efficiency gains.  A new material, silicone carbide, is discussed.  The capabilities of this material is presented.    ... read more

Description This Paper utilizes the introduction from the session as its paper then discusses Wide Bandgap Power Electronics    ... read more

Description All electronics products need a power source. Thereby power electronics has a fundamental impact on their design and integration, from materials and device up to systems and the applications they serve. ... read more

Description Driven by the demand for advanced electronic devices where massive wireless data transfer is required, a new generation of communication system, so called 5G has been developed. This new technology isnow fully introduced to the market and will continue to rapidly expand due to very high demand. ... read more

Description The electronic packaging industry is undergoing a revolutionary convergence between the printed circuit board segment and the semiconductor packaging segment. ... read more

Description In many aerospace and defense systems, there are increasing demands for multi-functional adhesive solutions that not only fulfill the traditional role of component and assembly bonding, but also offer additional features to address electrical and thermal requirements to improve device reliability ... read more

Description Power electronics based on silicon devices must operate below 125 C and IGBTs under 150 C - WBG devices could extend this to 200 C. ... read more

Description For many years, metals have been used as thermal interface materials (TIMs) in the electronics industry. With high reliability and high thermal conductivity, metals have been a great solution, especially for challenging applications. ... read more

Description Despite its introduction over three decades ago, designing, manufacturing and testing of high-density interconnect printed circuit boards remains a topic of discussion. ... read more

Description The ENIG finish is one of the most common final finishes finding broad acceptance in the market for decades. ENIG is the abbreviation for “electroless nickel – immersion gold” where it is the nature of the gold plating step to include an immersion reaction. ... read more

Description Field Programmable Gate Arrays (FPGA) allow customers the flexibility to configure devices after they have been manufactured. The demand for higher speed requires higher pin counts to provide greater functionality of the different I/O blocks in optimized FPGA devices. ... read more

Description Emerging Supply Chain Cybersecurity requirements, government acronyms, and actual security. Learn about the current state of mandates such as Cybersecurity Maturity Model Certification (CMMC) and its impending impact on Supply Chain Security. ... read more

Description This paper presents the concerns on trustworthiness for printed circuit board (PrCB) design, fabrication, and assembly sources for national defense systems, specifically products on the United States Munitions List (USML) that are vulnerable to theft, tampering, and supply disruption. ... read more