Description The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. ... read more

Description Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upon frequency, circuit thickness, and design configuration. ... read more

Description Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. ... read more

Description The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular method to meet the need for lower cost circuitry is the use of aluminum on Polyester (Al-PET) substrates. ... read more

Description Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process. ... read more

Description IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).In this paperwe would like to demonstrate how to successfully use passive coaxial probes for power level and ... read more

Description There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. ... read more

Description Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch adjacent copper layers with paths that meander on the layers between the microvias. ... read more

Description The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures.  Predicting reliability must ensure that the failure mechanism is demonstrated as a wear-out failure mode because a pla ... read more

Description This paper introduces structural electronics technology enabling smart molded structures. ... read more

Description Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-precision ink printing technologies.  By integrating silicon components with printed inks and flexible substrate ... read more

Description Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from inconsistent signal quality, while requiring many rigid wires and metal electrodes on a hair cap. ... read more

Description The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. ... read more

Description Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temperature increases. ... read more

Description The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. ... read more

Description This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level Land Grid Array (eWLP-LGA), and Copper-Pillar Flip-Chip (CP-FC) die—all with daisy-chain patterns to enable ... read more

Description Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a supplier, this must be accompanied with board level reliability data to ensure assembly and field reliability. ... read more

Description In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working environments. Traditional thermal cycling tests have used 40°C to +125°C for automotive type applications. ... read more

Description Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. ... read more

Description PCB (Printed Circuit Board) and CCL (Copper Clad Laminates) industries are facing environmental issues and cost reduction challenges. Consumable release sheets are an important aid for many demanding lamination processes of those industries. ... read more

Description Wireless wearable devices can continuously assess and communicate the condition of patients and are crucial components of digital mobile health platforms. ... read more

Description To demonstrate the benefits of flexible hybrid technology (FHE) and printed electronics the team of Lockheed Martin Rotary Missions Systems Owego (LMO), Lockheed Martin Space Systems Billerica (LMB) and SUNY Binghamton University (BU) have designed and demonstrated a security RFID tag that utiliz ... read more

Description Real-time and in-situ monitoring of the air-quality of confined spaces is a life-saving technology for commercial and government maintenance workers and is conspicuously absent from the commercial market. ... read more

Description The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. ... read more

Description Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electronic assemblies, FOD can cause deleterious effects related to manufacturing (e.g. ... read more

Description Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into the industry's concept of electrochemical reliability. ... read more

Description The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation due to surface roughness of copper has become a dominant factor. ... read more

Description The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OEMs to adopt this technology to keep up with the competition, but also shaped new requirements regarding the ... read more

Description The results of a NextFlex project addressing barriers that are preventing inkjet printing from being adopted for prototyping and volume manufacturing of printed circuits, are presented. These barriers include resolution, thickness, reliability and endurance. ... read more

Description The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. ... read more

Description Printed conductors and interconnects on compatible flexible or stretchable substrates are the foundation of flexible hybrid electronic systems that may include conventional silicon-based devices, discrete components, and printed radio frequency components such as microstrip lines, coplanar wavegu ... read more

Description This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. ... read more

Description Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. ... read more

Description There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds that provide renewable sources for polymers, as opposed to crude oil. ... read more

Description The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart devices on consumer products, medical products, industrial, as well as automotive industries. ... read more

Description Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA). ... read more

Description Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only for defense but also for intrusion. ... read more

Description For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, engineering effort, and the number of inevitable mistakes associated with any manual manipulation of data. ... read more

Description What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable! ... read more

Description Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream consumer electronics that semiconductors are incorporated into. ... read more

Description In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series. ... read more

Description Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. ... read more

Description The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. BiSn solders are the leading low-temperature candidates. ... read more

Description Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process costs. ... read more

Description For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it being considered as the “industry standard” as a means of facilitating multilayer PCBs. ... read more

Description The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA sites are characterized by high density routing channels and finer pitch arrays of BGA escape vias. ... read more

Description The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are still some through-hole components used on most assemblies. ... read more

Description Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturers. ... read more

Description Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In), and antimony (Sb), which improves the fatigue life and reduces the adverse effects of thermal cycling. ... read more

Description The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes are stressed by the continued trend toward miniaturization and increased power capability. ... read more