First Pan-European Electronics Design Conference (PEDC) in Vienna Inspires Participants from 20 Countries

The first Pan-European Electronics Design Conference (PEDC) in Vienna was a great success The new international conference, organized by Fachverband Elektronikdesign und -fertigung e. V. (FED) and IPC, brought together experts and industry representatives from 20 countries and four continents. The aim of the PEDC was to create a new European platform for the exchange of information on current developments and trends in electronics design.

Opening and technical program at the highest level

Dieter Müller, chairman of FED, and Matt Kelly, IPC CTO and vice president, technology solutions, opened the event and emphasized the relevance of the conference for the European electronics industry. “PEDC offers a unique opportunity to discuss current topics such as the role of artificial intelligence in electronics design, as well as the challenges and opportunities in the area of sustainability. We are proud to establish PEDC as a platform for the international exchange of knowledge in the electronics industry – and especially for designers,” said Müller. 

“With all of the rapid changes occurring in semiconductor chiplet architectures and component level packaging, it’s extremely important to drive a chip-to-package-to-system co-design approach to enable next generation electronic systems and products. The PEDC conference, with its focus on AI integration, new design flows, and tools was an important step to bring together OEMs, suppliers, and academia to collaborate and share their knowledge. The platform helped the supply chain to drive next generation design practices and expertise within Europe and across the globe,” summarized Kelly.

Exciting technical program and lively discussions

The keynotes from Prof. Thomas Ebel from the University of Southern Denmark and Lukas Henkel, OV Technologies, provided important impetus: while Ebel highlighted the use of artificial intelligence (AI) in the development of passive components, Henkel presented the development of an open-source smartwatch. Afterwards, a panel discussion moderated by Alexander Gerfer, Würth Elektronik, addressed the topic of AI in electronics design. A second panel – moderated by Didrik Bech, Altium, – had a lively discussion about how the life cycle of electronic products can be made sustainable.

Accompanying exhibition and networking

At the accompanying exhibition, 13 companies presented their products related to electronics design. Participants made intensive use of the breaks to exchange ideas about new technologies and make valuable contacts. At a networking reception, participants were able to make new contacts and deepen existing ones in a relaxed atmosphere.

Strong momentum for the future

After two intensive days full of discussions and high-level presentations, the PEDC draws a positive conclusion. The conference has shown that AI has the potential to revolutionize electronics design and that sustainability in the electronics industry will become increasingly important to us. The first PEDC has impressively demonstrated that there is a need for a pan-European exchange format in Europe. The collaboration between IPC and FED proved to be a complete success.

“Without the commitment of our speakers, the organizing team, the program committee members and our sponsors, this success would not have been possible,” concluded Peter Tranitz, senior director of solutions, IPC. 

View conference photos

 

Electronics Industry Demand Reaches Neutral Ground

IPC releases January 2025 Global Sentiment of the Electronics Manufacturing Supply Chain report

Demand in the electronics industry recovered to 100 in December, marking the threshold between contraction and expansion after four consecutive months below this level according to IPC’s January Sentiment of the Global Electronics Manufacturing Supply Chain Report. Of the four demand components, the Backlog Index remained below 100 and was the only component unchanged over the past month. The New Orders Index rose by four points to 102, moving marginally into expansion territory. Similarly, the Shipment Index increased by four points, reflecting broader improvements in volume indicators.

 

Cost pressures continue to challenge operations. The Labor Costs Index held steady this month, while the Material Costs Index climbed three points, recovering slightly from its all-time low. However, aggregated cost indicators reached a four-month high, signaling persistent cost pressures on operations.

 

In response to special questions regarding companies’ current work from home practices, minimal changes are expected in 2025 work arrangements. Factory floor policies remain rooted in traditional on-site requirements, reflecting the operational challenges and technical demands of these roles. Europe stands out with the largest flexibility increase, as hybrid arrangements are projected to grow by 5 percent.

 

“While 2025 work-from-home policies suggest incremental shifts toward flexibility, particularly in APAC and Europe, these changes are more pronounced for non-factory employees,” said Shawn DuBravac, Ph.D., IPC chief economist and report author. “For factory floor employees, minor increases in hybrid work are anticipated, but on-site roles remain the overwhelming standard, underscoring the rigidity of these positions,” Dr. DuBravac added. 

 

Additional survey data show:

  • Half of electronics manufacturers are currently experiencing rising labor (52 percent) and material (51 percent) costs.
  • European electronics manufacturers, along with those operating globally, anticipate a decline in material costs over the next six months more so when compared to North American electronics manufacturers.
  • Over the next six months, electronics manufacturers expect labor and material costs to remain high, with ease of recruitment likely to remain challenging. 

These results are based upon the findings of IPC’s Current State of Electronics Manufacturing Survey, fielded between December 11 and December 31, 2024.

Read the full report.

The AI Advantage in PCB Design: Techniques and Trends

Date
-

BACK BY POPULAR DEMAND -- John Watson explores how artificial intelligence (AI) is revolutionizing printed circuit board (PCB) design in this must-attend webinar, "The AI Advantage in PCB Design: Tools and Trends." This session will provide a deep dive into the transformative impact of AI on the PCB design process, helping engineers and designers tackle challenges with greater efficiency and innovation. 

The webinar begins with an introduction to AI's fundamental role in modern PCB design. Participants will learn how AI enhances traditional workflows, offering capabilities beyond human limitations. From circuit optimization to error reduction, AI enables faster, smarter, and more precise design outcomes.
Through real-world examples, the session will highlight how AI is being used to solve common PCB design challenges, such as managing complex routing patterns, improving thermal performance, and reducing the time spent on iterative design revisions. These case studies will show how companies have integrated AI to address bottlenecks, reduce costs, and accelerate product development timelines.

Additionally, this webinar will explore the potential hurdles of adopting AI technologies in PCB design. Topics will include data preparation, the need for effective collaboration between engineers and AI systems, and the importance of validating AI-driven recommendations. Attendees will also get a glimpse into the future of AI in PCB design, including its role in fully autonomous design systems and its integration with next-generation technologies like augmented reality (AR) and virtual reality (VR).

What Participants Will Learn
1.    How AI is transforming the design process in general.
2.    The benefits of using AI are in improving efficiency and accuracy.
3.    Key features and capabilities of AI-powered tools.
4.    Real-world examples of AI solving design challenges.
5.    Common challenges when adopting AI technologies.
6.    Exciting future possibilities for AI in design and engineering.
 

Speaker Bios

John Watson

John Watson brings over 44 years of experience in the electronics industry, with 24 of those dedicated to PCB design and engineering. Throughout his distinguished career, John has worked with leading companies such as Teledyne API, Emerson Computer Power, and Legrand Corporation. He also served honorably in the U.S. Army’s Military Intelligence field. John is a technical expert in using various PCB Design ECAD Software. 
A significant undertaking is honing the next generation of PCB Designers, enhancing proficiency in PCB Design, and improving the overall quality of PCB design workflows for industry-leading companies.

In addition to his industry role, John is a professor at Palomar College in San Marcos and the University of California San Diego, teaching foundational and advanced PCB design courses. He is also a highly regarded author, contributing regularly to blogs and white papers and as a monthly columnist for I-Connect007. John is the author of two books on Library and Data Management and is a sought-after international speaker, having delivered lectures across the United States, Europe, and Asia.

As a member of the IPC Designer Leadership Council, John is deeply committed to shaping the future of PCB design education and resources. Being part of an organization that has influenced the industry for decades remains one of the most rewarding aspects of his career.

 

 

The Engineering Webinar Series will provides FREE, live, monthly educational experiences and videos discussing key design issues surrounding aspects of quality, defect detection & remediation, and design finalization & fabrication. All sessions are recorded and registered attendees will receive a link to the video to watch on-demand. 
 

North American PCB Industry Sales Up 59.6 Percent in December

IPC releases PCB industry results for December 2024

IPC announced today the December 2024 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.19.

Total North American PCB shipments in December 2024 were down 0.3 percent compared to the same month last year. Compared to the preceding month, December shipments were down 3.9 percent.

PCB bookings in December were up 59.6 percent compared to the same month last year. December bookings were up 6.2 percent compared to the preceding month.

"PCB orders jumped in December, landing in the top one percent of orders relative to shipments. This uptick is largely due to orders being pulled forward amidst ongoing tariff uncertainties,” said Shawn DuBravac, Ph.D., IPC’s chief economist. 

December 2024 PCB book to bill ratio chart 1
December 2024 PCB book to bill ratio chart 1

Detailed Data Available

Companies that participate in IPC’s North American PCB Statistical Program have access to detailed findings on rigid PCB and flexible circuit sales and orders, including separate rigid and flex book-to-bill ratios, growth trends by product types and company size tiers, demand for prototypes, sales growth to military and medical markets, and other timely data.

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly PCB industry statistics are based on data provided by a representative sample of both rigid PCB and flexible circuit manufacturers selling in the USA and Canada. IPC publishes the PCB book-to-bill ratio by the end of each month.

North American EMS Industry Down 7.8 Percent in December

IPC releases EMS industry results for December 2024

IPC announced today the December 2024 findings from its North American Electronics Manufacturing Services (EMS) Statistical Program. The book-to-bill ratio stands at 1.26.

Total North American EMS shipments in December 2024 were down 7.8 percent compared to the same month last year. Compared to the preceding month, December shipments were down 8.3 percent.

EMS bookings in December increased 28 percent year-over-year and increased 16.9 percent from the previous month.

“Strong bookings in December elevated the North American EMS book-to-bill ratio. While shipments are expected to catch up, this surge in orders was likely influenced by tariff uncertainties,” said Shawn DuBravac, Ph.D., IPC’s chief economist. 

December 2024 EMS book to bill ratio chart

Detailed Data Available

Companies that participate in IPC’s North American EMS Statistical Program have access to detailed findings on EMS sales growth by type of production and company size tier, order growth and backlogs by company size tier, vertical market growth, the EMS book-to-bill ratio, 3-month and 12-month sales outlooks, and other timely data.

Interpreting the Data

 

The book-to-bill ratios are calculated by dividing the value of orders booked over the past three months by the value of sales billed during the same period from companies in IPC’s survey sample. A ratio of more than 1.00 suggests that current demand is ahead of supply, which is a positive indicator for sales growth over the next three to twelve months. A ratio of less than 1.00 indicates the reverse.

 

Year-on-year and year-to-date growth rates provide the most meaningful view of industry growth. Month-to-month comparisons should be made with caution as they reflect seasonal effects and short-term volatility. Because bookings tend to be more volatile than shipments, changes in the book-to-bill ratios from month to month might not be significant unless a trend of more than three consecutive months is apparent. It is also important to consider changes in both bookings and shipments to understand what is driving changes in the book-to-bill ratio.

 

IPC’s monthly EMS industry statistics are based on data provided by a representative sample of assembly equipment manufacturers selling in the USA and Canada. IPC publishes the EMS book-to-bill ratio by the end of each month.

IPC Masters 2025

Date
- (Mar 25, 2025 | 8:00pm - Mar 28, 2025 | 4:00am CDT)

To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event – IPC Masters 2025 in Shanghai, China. IPC Masters will include Hand Soldering Competition (HSC), Cable and Wire Harness Assembly Competition (CWAC), BGA/BTC (Ball Grid Array/Bottom Termination Components) Rework Competition and IPC Standard Knowledge Competition.

IPC Masters aims to provide a valuable platform for operators in the electronics industry across China to enhance their skills and showcase their talents. Through this competition, contestants will have the opportunity to learn and apply their skills, contributing to the promotion of quality and technical standards in China's electronic manufacturing industry. The event also plays a pivotal role in talent development, enabling participants to step onto the international stage and demonstrate the strength and charm of China's skilled craftsmen.

Premium Sponsor

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Supporting Sponsor

Shanghai New International Expo Centre

No.2345 Longyang Road
Pudong Xinqu
Shanghai Shi, 201204
China

Shanghai New International Expo Centre

Shanghai New International Expo Centre
No.2345 Longyang Road
Pudong Xinqu, SH 201204
China

IPC CEMAC 2025

Date
- (Sep 24, 2025 | 8:00pm - Sep 26, 2025 | 7:00am CDT)

The IPC CEMAC (China Electronics Manufacturing Annual Conference), an exclusive event for IPC members, is dedicated to advancing the development and collaboration of the electronics industry. The conference focuses on promoting the adoption and dissemination of quality and technical standards in electronics manufacturing while serving as a high-value, professional, and efficient platform for international exchange built around IPC’s global industry standards.

To enhance international collaboration and drive sustainable development in electronics manufacturing, IPC CEMAC 2025 will center on the theme "Shaping a Sustainable Future." The event invites participants to explore ways to achieve sustainability through technological innovation, efficient resource utilization, and improved production processes. It seeks to promote green, smart manufacturing and effective supply chain management while embedding sustainability into all aspects of electronics manufacturing, supporting the industry’s long-term, healthy growth.

Crowne Plaza Shanghai Jinxiu

No.399 Jinzun Road
Pudong Xinqu
Shanghai Shi, 200125
China

Crowne Plaza Shanghai Jinxiu

Crowne Plaza Shanghai Jinxiu
No.399 Jinzun Road
Pudong Xinqu, SH 200125
China

Marcy LaRont Named Executive Director of I-Connect007 Group

Marcy LaRont, a printed circuit board (PCB) industry veteran who has been working as the managing editor for PCB007 magazine this past year, has been named executive director of the I-Connect007 group of publications, which was purchased by IPC in 2022. She succeeds Barry Matties, publisher and original founder of the I-Connect007 publications, who will continue on in an advisor capacity.

As executive director, LaRont will oversee the operations of all I-Connect007 publications and events. 

LaRont began her career in PCB fabrication in the 1990s shortly upon graduating from college, learning the business organically from working in small and mid-sized manufacturing companies and plants. She previously worked for the I-Connect007 team as part of the sales group from 2007-2011. 

LaRont describes coming back to the team and the industry as coming home. “I am thrilled to have the opportunity to lead this group and am excited about the future. As is true with the electronics manufacturing industry, media has also undergone continuous change over the past several years. Barry’s insight and vision have always allowed I-Connect007 to adapt and thrive with those changes. I look forward to continuing in that tradition as we examine all that our media and marketing outlets must be for our industry and our customers.”

Adds Brian Knier, IPC vice president of marketing and member success, “This is truly the end of an era. With the I-Connect007 group of publications, and CircuitTree magazine before that, Barry Matties succeeded in creating the go-to, best media source for news and information related to the electronics manufacturing supply chain worldwide. But with the end of every era, comes a new one. Marcy’s expertise in electronics manufacturing, communication, marketing and management enable her to be a strong voice for global electronics manufacturing. IPC is thrilled to welcome her to the role of executive director.”

LaRont can be reached at MarcyLaRont@ipc.org or Marcy@iconnect007.com.