IPC's Validation Services Program has awarded an IPC J-STD-001, IPC-A-610 and IPC/WHMA-A-620 Qualified Manufacturers Listing (QML) Class 3, to the Lockheed Martin Rotary and Mission Systems (RMS) business area. Following an initial audit by IPC, Lockheed Martin RMS becomes one of the OEM trusted sources and suppliers meeting the stringent requirements of the Qualified Manufacturing Listing (QML) based on three of IPC's foremost standards: IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies, IPC-A-610, Acceptability of Electronic Assemblies and IPC/WHMA-A-620, Requirements and Acceptance for Cable and Wire Harness Assemblies.

Lockheed Martin RMS initially contacted IPC to review its manufacturing processes using the IPC Standard Gap Analysis (SGA). Through the SGA program, the global security and aerospace company looked to improve its production methods before moving to the IPC Validation Services QML recognition program.

During the IPC Validation Services QML four-day audit, Lockheed Martin RMS met or exceeded the requirements for the electronics industry’s most rigorous classification, Class 3, which is intended for high-performance electronics assemblies. The company is now listed and recognized as an IPC trusted source capable of manufacturing in accordance with industry best practices.

IPC's Validations Services QPL/QML Program was developed to promote supply chain verification and recognition. It also provides auditing and certification of electronics companies' products, and identifies processes which conform to IPC standards.

"Different from other audit programs, IPC's Validation Services Programs uniquely provides technical and in-depth assessments of products and processes in accordance with IPC standards," said Randy Cherry, IPC director of Validation Services. "We are pleased to especially recognize Lockheed Martin for becoming a member of IPC's network of trusted QML suppliers for three of IPC’s foremost standards."

For more information about IPC's Validation Services QPL/QML Program, visit www.ipcvalidation.org or contact Randy Cherry at RandyCherry@ipc.org or +1 847-597-2806.

IPC's Study of Quality Benchmarks for Electronics Assembly 2018 is now available. The global study provides valuable benchmarking data to electronics assembly companies interested in comparing their quality measurements to those of the industry worldwide.

The quality control measurements covered by the study include yields for various test methods as well as the percentages of products subjected to these tests. Yields and defect rates at first pass and final inspection, internal yields of key processes, defect rates, and DPMO and yield targets, and the average cost of poor quality as percentages of sales for rework and scrap are also covered. The study reports on the use of various quality control methods.

Customer satisfaction and supplier performance measurements are covered in the study, including rates of customer returns and returns due to product failure, and rates of on-time delivery. The industry's adoption of major quality certifications is also reported.

The data — in averages, medians and percentiles — are segmented by company size tier, by region, and by type of production including rigid PCBs, flexible circuits, finished end products, mechanical assembly, cable and harness, and discrete wiring terminal and connectors.

The aggregate data represent 63 electronics assembly companies of all sizes – both OEMs and contract electronics manufacturers – in all regions of the world.

The 152-page report is available for sale to IPC members for $675 and to nonmembers for $1,350. For more information or to purchase the report, visit www.ipc.org/AssemblyBenchmark2018 or contact IPC's market research department at marketresearch@ipc.org. For information on other IPC market research programs, visit www.ipc.org/IndustryData.

High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.

Designers wanting to learn more are invited to attend IPC’s technical education course, “Designing Boards with HDI Technology” on November 6 in Raleigh, N.C. The course will be held in conjunction with PCB Carolina.

Instructor and senior PCB designer with Design Science, Suzy Webb, will provide instruction on HDI technology and cover: the structure of the HDI traces and vias; options and effects of cost and electronics; options for stack up types; how to get signals and powers from layer to layer in the board; patterns and grids such as via in pad, offset or swing vias to maximize fanout and routing opportunities; and routing return, power distribution, and layer paired routing. In addition, Webb will lead a discussion on the benefits HDI technology provides to other parts on the board, along with the unique manufacturing needs of these types of boards.

IPC’s technical education course registration includes access to PCB Carolina including exhibition, keynote address, and morning and afternoon technical sessions on November 7. Attendees who want to learn more about IPC and its services are invited to join IPC staff for a free networking event, IPC Day, the evening of November 6, immediately following IPC’s course.

For more information or to register for “Designing Boards with HDI Technology,” visit www.ipc.org/TechEd-Raleigh. Separate registration is required for IPC Day. Visit www.ipc.org/IPC-Day for more info.

IPC – Association Connecting Electronics Industries, the global industry association representing the $2 trillion global electronics industry, applauds a U.S. Senate committee for its work in advancing a workforce education and training bill.

In a letter to the chairman and ranking minority member of the Senate Health, Education, Labor, and Pensions Committee – Senators Lamar Alexander (R-TN) and Patty Murray (D-WA), respectively – IPC President and CEO John Mitchell praised the pair for their bipartisan leadership on the Strengthening Career and Technical Education for the 21st Century Act.

“As a training and certification leader, one of IPC’s top priorities is to promote workforce development initiatives, educate and train workers to fill manufacturing jobs, and be innovative in finding ways to close the skills gap,” wrote Mitchell. “Our members, who employ two million individuals throughout the United States, are highly dependent on workers with technical skills with many jobs not requiring an advanced degree in STEM. We appreciate your leadership to address these workforce challenges.”

The electronics industry has been hit particularly hard by a shortage of skilled workers in the United States, with most companies indicating it is constraining their growth and, in some cases, their long-term viability.

“This piece of legislation is hugely important to our industry and the next generation of workers as it will ensure that students have access to critical technical programs that will advance their ability to develop in-demand skills that are essential to 21st century manufacturing,” said IPC’s Senior Director of Education Programs, Colette Buscemi.

To address the workforce shortage, IPC is making unprecedented investments in its education programs, including:

• IPC EDGE Online Platform – IPC is moving toward delivering more of its traditional training and certification programs online and in ways that are more likely to ensure long-term knowledge and skills acquisition.
• Jobs Task Analysis - IPC is undertaking an analysis of the critical job roles in the electronics industry to map the knowledge, skills, and abilities required to perform job functions. The outcome of this project will re-shape IPC’s future certification and education programs.
• Earn and Learn – IPC is partnering with academic institutions to develop apprenticeship, internship, and related opportunities that offer valuable skills in concert with academic programs.
• STEM Programming – IPC is working with schools and nonprofits on a variety of programs to get kids excited about STEM subjects and to give them a familiarity with the electronics industry.
• Veterans/Transitioning Military: IPC is supporting activities and programs that seek to recruit veterans into the electronics manufacturing industry.

To learn more about IPC’s workforce development initiatives, contact Buscemi at 847-597-2841 or ColetteBuscemi@ipc.org.

IPC reports that 85 percent of exhibit floor space has been sold for IPC APEX EXPO® 2019. Three hundred twenty-seven exhibitors have been assigned to 134,200 net square feet of exhibit space, marking a 5 percent increase in square footage compared to 2018’s booth space selection event. The premier technical conference and exhibition for the electronics manufacturing industry will take place January 29–31, 2019, at the San Diego Convention Center in San Diego, Calif.

“Our exhibitors recognize that IPC APEX EXPO is the event to help them achieve their business goals and that IPC brings buyers and sellers together under one roof,” said Alicia Balonek, senior director of trade shows and events.  

The largest event of its kind in North America, IPC APEX EXPO sold out of exhibitor space last year and 2019 is promising to sell out as well. “Our number one priority is to give our exhibitors and attendees the best return on their investments, giving them an opportunity to grow their businesses and increase revenue,” said Balonek.

IPC APEX EXPO attracts a global audience of industry executives and decision makers in the ever-evolving electronics manufacturing and assembly market. IPC APEX EXPO 2018 post-show surveys from participants reflected that of those attending, 80 percent recommend, influence, or have key purchasing power and 50 percent make the final decisions. 

One of the top objectives for attendees is to see new products. “This event is an excellent opportunity to meet new customers, promote your business, network with existing customers and sell products and services,” Balonek added.

Post-show survey respondents have affirmed the buzz that rang throughout the 2018 show: attendees and exhibitors alike met their goals for networking, technical exchange, education and sales leads.

“IPC APEX EXPO 2018 was the most successful for my company and perhaps of all the years we have been exhibiting. The booth traffic was strong as were the leads -- we’re looking forward to coming back again next year for IPC APEX EXPO 2019,” said Jason Spera, CEO, Aegis Software.

Companies interested in exhibiting should visit www.IPCAPEXEXPO.org, or contact Balonek at AliciaBalonek@ipc.org or Kim DiCianni, exhibits manager and membership representative, at KimDiCianni@ipc.org.

IPC launched a global survey of printed circuit board (PCB) manufacturers in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for PCB fabricator survey responses is July 13.

The goal of the survey is to measure current technical capabilities of the PCB industry and the potential for expanded capabilities over the next five years. The survey covers technical capabilities, including board types, layer counts, thickness, line width and spacing, aspect ratios, I/O pitch, thermal properties, frequency, reliability, materials and finishes. Respondents may answer the questions that relate to their type of product, focusing on one specific end-use application: automotive, communications, computers and business equipment, consumer, defense and aerospace, industrial, or medical and instrumentation.

PCB fabricator participation is crucial to the success of this project, which will provide valuable guidance to the electronics supply chain to meet the current and future needs of PCB fabricators and electronics OEMs.

A global survey of OEMs was launched earlier this month to collect data on their current technical requirements, product planning involving emerging technologies, and forecasts of PCB specifications over the next five years. Together the data on PCB capabilities and OEM specifications will produce detailed aggregate data on the current and future state of circuit board technology and technical requirements, and the outlook for future PCB technology developments through 2023.

Survey participants will receive a complimentary copy of the 2018 PCB Technology Trends report. PCB engineers, designers or technologists interested in participating are invited to contact IPC’s market research staff at marketresearch@ipc.org or +1 847-597-2868 for access to the surveys. Both surveys are also available in Mandarin Chinese.

IPC — Association Connecting Electronics Industries® has extended the deadline of their invitation for engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2019 to be held at the San Diego Convention Center. The technical conference will take place January 29–31, 2019. The extended deadline for technical conference abstracts is June 29, 2018.

The industry’s premier conference and exhibition for the electronics industry, IPC APEX EXPO provides presenters and their companies with a notable and cost-effective opportunity to promote their expertise and gain visibility with key engineers, managers and executives from all segments of the industry worldwide. Staff from companies such as Ericsson, Flex, IBM, Indium, MacDermid-Enthone, Northrop Grumman, Oracle and Robert Bosch have presented papers at past technical conference sessions at IPC APEX EXPO. To recognize exceptional achievement, awards will be presented for “Best Paper.”

Expert papers and presentations are being sought on design, materials, assembly, processes, test, reliability and equipment in the following areas:

An approximate 300-word technical conference abstract summarizing original and previously unpublished work covering case histories, research and discoveries must be submitted. The submission should describe significant results from experiments and case studies, emphasize new techniques, discuss trends of interest and contain appropriate technical test results.

Technical conference paper abstracts are due June 29, 2018; to submit an abstract visit www.IPCAPEXEXPO.org/CFP.

IPC launched a global survey of original equipment manufacturers (OEMs) in the electronics industry this week. This confidential survey is part of a global data collection effort for the development of IPC’s 2018 PCB Technology Trends study. The deadline for OEM survey responses is July 6.

The OEM survey covers technical requirements that support the development of products using the Internet of Things, artificial intelligence, sensor inputs and neural networks, and key technical issues including frequency and reliability. Technical requirements for PCBs are covered, including such properties as thickness, layers, line width and spaces, aspect ratios, I/O pitch, thermal properties, materials and finishes.

Respondents may answer the questions that relate to their type of operations, focusing on one specific end-use application such as automotive, communications, computers, consumer, defense and aerospace, industrial, or medical and instrumentation. OEM participation is crucial to the success of this project, which will provide valuable guidance to the electronics supply chain to meet the current and future needs of OEMs.

A global survey of PCB fabricators will also be launched later this month to collect data from PCB fabricators on their current technical capabilities and the potential for expanded capabilities over the next five years. Together the data on OEM specifications and PCB capabilities will produce detailed aggregate data on the current and future state of circuit board technology and OEMs’ technical requirements, and the outlook for future technology developments through 2023.

Survey participants will receive a complimentary copy of the 2018 PCB Technology Trends report. Electronics manufacturers interested in participating are invited to contact IPC’s market research staff at marketresearch@ipc.org or +1 847-597-2868 for access to the surveys. 

The competition was fierce as 27 competitors went soldering iron to soldering iron in IPC’s Hand Soldering Regional Qualification Competition at SMT Hybrid Packaging 2018 in Nuremberg, Germany. Of the 27 boards submitted by the competitors only four of the electronic assemblies were functional. Taking first place and a cash prize of €300 was Catherine Cardinal-Simoan, Thales International, who earned 422 points out of a possible 445.

Taking second place and a cash prize of €200 this year was Alexander Akpatrov, from Russia with 407 points. Eliane Chesnais, Thales International, took third place and a cash prize of €100. Elaine is not new to the IPC Hand Soldering Competition at SMT Hybrid Packaging Exhibition as she was the first-place winner in 2017. Taking fourth place this year was Ekatarina Stahlmann, Grundig Business Systems. Ekatarina was the first-place winner in 2015 and 2016.          

Participants in the hand soldering competition were tasked with building a newly designed functional electronics assembly this year, within a 60-minute time limit. Master Instructor Trainers Rob and Stefan Walls, PIEK, served as independent judges and evaluated each assembly based on workmanship, overall functionality, compliance with IPC-A-610G Class 3 criteria and speed to complete the PCB.

“The best-of-the-best hand soldering talent in Europe came to compete at this event,” said David Bergman, IPC vice president of international relations. “The competition was tough, but each competitor rose to the challenge to build a functional board within the allocated time limit. We look forward to hosting more hand soldering competition across the globe.”

Bergman added, “IPC would like to thank hand soldering competition gold sponsors: JBC Tools and Weller; silver sponsors: Almit, Balver Zinn, and NCAB Group; bronze sponsor: PIEK and MicroCare; contest contributor: Mircosolder, for their support.”

IPC is planning to hold additional hand soldering competitions in Europe. Watch for announcements from IPC with locations and times. For more information on IPC events visit, www.ipc.org/events.

The U.S. defense industrial base – and the electronics industry in particular – would benefit from a provision in a newly released U.S. Senate bill.

IPC – Association Connecting Electronics Industries welcomes the U.S. Senate’s version of the National Defense Authorization Act (NDAA), which was released to the public this morning.

Reflecting input from IPC and its collaboration with Senator Joe Donnelly (D-IN), Section 862 of the bill calls on the Secretary of Defense, in consultation with the Executive Agent for Printed Circuit Board and Interconnect Technology (based at the Naval Surface Warfare Center in Crane, Indiana) and the Director of the Office of Management and Budget (OMB), to prepare a report to Congress by January 2019 on the health of the defense electronics industrial base.

The report would include recommended actions to address aspects of the defense industrial base deemed “deficient” or “vulnerable,” and a plan to provide long-term budget resources and policy direction to the Executive Agent.

“I am pleased that the Senate national defense bill includes my amendment that would require a renewed focus on the defense electronics industrial base, including the work of the executive agent program at Crane. This would help to both strengthen our nation’s electronics manufacturing industry and ensure the availability of the trusted, sophisticated electronics that our service members depend on,” said Donnelly. 

“Every nation has a vital interest in securing access to the technologies that underpin their defense needs,” said IPC President and CEO John Mitchell.

“We thank Senator Donnelly for working with us to address these issues,” Mitchell added. “As he has said, the U.S. military depends on the U.S. and global electronics industry to help ensure the success of troops in the field. We take that responsibility very seriously, and we look forward to working with members of Congress and the Trump administration to address issues of concern in the electronics supply chain.” 

Because electronics are at the heart of so many critical defense systems, IPC has long been engaged in policy discussions aimed at ensuring the preservation and growth of a resilient electronics supply chain.   

For example, during IPC APEX EXPO 2018, IPC members had the chance to hear from representatives of the departments of Defense and Commerce on their analyses of the domestic printed circuit board industry. 

During IMPACT 2018, IPC’s annual advocacy week in Washington, D.C. in May, member company executives discussed this subject with senior officials from the White House and the departments of Defense, Commerce and Labor, and IPC presented an award to Sen. Donnelly for his leadership on these issues.

Meanwhile, the Trump administration is expected to release a separate report soon on the U.S. defense industrial base. That report, prompted by a July 2017 executive order by President Donald Trump, reflects months of analysis by the departments of Defense, Homeland Security, Commerce, and Labor, and is expected to be released within weeks. The objective of the effort has been to determine whether there are enough U.S. manufacturers and trusted foreign suppliers of vital military equipment, and whether there are enough skilled workers to work in the field.

Mitchell added, “In the context of today’s globally connected, rapidly evolving technology industry, it is vitally important that policy makers have a clear and detailed understanding of the defense industrial base, and then strike the right balance between fostering important domestic industries and upholding the principles of free, fair and reciprocal trade. IPC welcomes all efforts to understand the role of electronics in international security, and we will continue to be actively engaged in this issue.”