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Contribute to the IPC Standards Your Company, Competitors, Customers and Suppliers Depend On

Wondering how the standards you rely on get developed? Do you want to help make those standards better? Have you always wanted to find out why a certain criterion was included?

Use your technical expertise to improve IPC standards. Committee participation can take place in meetings, by teleconference, or by e-mail. Distance shouldn’t deter you and, indeed, IPC welcomes global input.

Committee members sharpen their negotiation and presentation skills. You’ll personally benefit from developing a network of experts with similar interests. In addition, committee participation can help build your resume and show potential employers that you’re keeping up with technological changes in the industry.

Find out more about IPC committees on our committee home pages and about the documents currently in development by clicking on a document link below (Final Draft, Proposed Standard or Working Draft sections). IPC members in China and Asia are invited to participate through TGAsia Forum, our e-mail forum for discussion of standards development. Find out more about TGAsia Forum by contacting Leesha Peng or Sandy Xiao in our Shanghai office.

If you’re ready to help out, please send an e-mail to Answers@ipc.org. Please reference the committee or technology that interests you and provide your complete contact information, including your address, phone, and fax number. We’ll get in touch on the best way to get involved. Committee communications are conducted through e-mail, so it is mandatory to furnish a working e-mail address.

IMPORTANT INFORMATION
IPC committees are beginning the transition to using the Kavi website for committee collaboration. To help our committee members with this transition, a Basic User Training video has been made available.

Kavi Training Video

1-10 Printed Board Design Committee
2-10 Electronic Product Data Description Committee
2-30 Terms and Definitions Committee
2-30cn China Terms and Definition Committee
2-40 Electronic Documentation Technology Committee
3-10 Printed Board Base Materials Committee
4-10 Fabrication Processes Committee
4-30 Environment, Health & Safety Steering Committee
5-20 Assembly & Joining Committee
5-21 Component Mounting Subcommittee
5-21jnd Solder Paste Printing Task Group
5-22 Soldering Subcommittee
5-23 Solderability Subcommittee
5-24 Assembly & Joining Materials
5-20cn China Assembly & Joining Processes Committee
5-30 Cleaning and Coating Committee
5-40 Assembly Equipment Committee
6-10 Product Reliability Committee
7-10 Testing Committee
7-20 Process Control Management Committee
7-30 Product Assurance Committee
7-31 Acceptability Subcommittee
7-32 Automatic Inspection Technologies Subcommittee
7-33 Quality Assurance Subcommittee
7-34 Repairability Subcommittee
7-35 Assembly and Joining Handbook Subcommittee
7-30cn China Product Assurance Committee
7-30nd Nordic Product Assurance Committee
8-40 Roadmap Executive Committee
8-50 Jisso North America Council (JNAC) Executive Committee
8-60 Printed Electronics Technology Roadmap Executive Committee
9-80 OEM Management Council Steering Committee
9-90 IPC Designers Council Executive Board
B-10 Packaged Electronic Components Committee
D-10 Flexible Circuits Committee
D-20 High Speed/High Frequency Committee
D-30 Rigid Printed Board Committee
D-50 Embedded Components Committee
D-60 Printed Electronics Committee
E-10 IPC PV Module Technical Standards Committee
E-20 Intellectual Property Standard Committee