Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.

When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.

This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.

This webinar will provide an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act. The new rule will have a significant impact on electronics producers and importers, because of (a) the widespread use of PFAS within the electronics supply chain; (b) the very expansive definition of PFAS in the rule, which includes commonly used polymers; and (c) EPA’s decision to include imported articles within the scope of the rule.

We are delighted to welcome Dr. Frank Richter of Greenectra to lead a discussion on Li-ion battery technologies and test methods for EV applications.

This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include:
•    The possibility you may be the target of a cyber attack.
•    Why attack countermeasures and manufacturing members of the production floor seem so far away.
•    The efforts and limitations of IT engineers.
•    The essence of Zero Trust Architecture.
•    The role of manufacturing members on the shop floor.
•    Balancing the cost of countermeasures versus profits within the manufacturing industry.
•    Discussion of IPC-1792

Additively Manufactured Electronics (AME) adds another dimension to 3D printing – the ability to generate working circuit boards and high-performance electronic devices. Bring yourself up to speed with an overview of this emerging field:

What AME is and how does it differ from PE.
Present the inkjet manufacturing process.
Discuss materials.
Touch on embedded components.
Applications including formed components and design techniques.
Present D-67 committee task groups and standards activity 

This webinar is for anyone giving or even contemplating giving a verbal presentation with associated slides. Specific topics will include: personal aspects, the venue, preparing the presentation, giving the presentation and dealing with questions.

Michael Carano, IPC’s technical consultant, will present some of the key findings from IPC’s latest PCB Technology Trends study, published this past October.

We are delighted to announce that Milos Lazic from Indium will lead a discussion on thermal management materials for EV applications.

Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the bottom, therefore relying on solder paste to make the component to board connection. This means that the height of the solder is primarily determined by the volume of solder paste and the finished assembly might not have visible solder joints to inspect. As you can imagine, this makes BTCs very challenging to inspect, often leading to X-ray analysis for process control.

Are you using BTCs on your assembly? 
Looking to understand the inspection process of BTCs?
Having trouble inspecting your BTC? 

In this webinar we will take a deep dive into the inspection of Bottom Termination Components utilizing visual, X-ray and cross section analysis.