Additively Manufactured Electronics (AME) adds another dimension to 3D printing – the ability to generate working circuit boards and high-performance electronic devices. Bring yourself up to speed with an overview of this emerging field:

What AME is and how does it differ from PE.
Present the inkjet manufacturing process.
Discuss materials.
Touch on embedded components.
Applications including formed components and design techniques.
Present D-67 committee task groups and standards activity 

In today's rapidly changing electronics manufacturing landscape, staying competitive and adaptable is essential. Our training course topics include ESD, Safety, Electronics Assembly for Operators, Electronics Assembly for Engineers, Cable and Wire Harness Assembly, and a Manufacturing Engineer series.

We'll show you how to implement these courses to address current training challenges in the industry such as onboarding, turnover and scaling. Attendees get an inside look at course content, how to onboard trainees, check progress and grades, and how to access audit information.

Bring your challenges and questions to the webinar and join the conversation.

This webinar is for anyone giving or even contemplating giving a verbal presentation with associated slides. Specific topics will include: personal aspects, the venue, preparing the presentation, giving the presentation and dealing with questions.

Michael Carano, IPC’s technical consultant, will present some of the key findings from IPC’s latest PCB Technology Trends study, published this past October.

We are delighted to announce that Milos Lazic from Indium will lead a discussion on thermal management materials for EV applications.

Bottom termination components (BTCs) are becoming increasingly common in assemblies due to their low cost and high performance. There are varying types of BTCs in the electronics industry, such as QFN, SOIC, and LGA, all of which are typical on assemblies. The defining characteristic of these components is that the terminations are flat on the bottom, therefore relying on solder paste to make the component to board connection. This means that the height of the solder is primarily determined by the volume of solder paste and the finished assembly might not have visible solder joints to inspect. As you can imagine, this makes BTCs very challenging to inspect, often leading to X-ray analysis for process control.

Are you using BTCs on your assembly? 
Looking to understand the inspection process of BTCs?
Having trouble inspecting your BTC? 

In this webinar we will take a deep dive into the inspection of Bottom Termination Components utilizing visual, X-ray and cross section analysis. 

Using the IPC APEX EXPO Technical Conference as a model, this webinar will provide an overview of best practices for preparing technical data to write a high-quality manuscript suitable for conference presentation and publication. This tutorial is designed for anyone who wants to build their technical writing skills and share their innovations and research with a technical audience, and will have a special focus on the electronics industry. The session will highlight important advanced preparations prior to submitting an abstract or paper that should be considered by the author and their management. Using the style guideline created for ECWC16/IPC APEX EXPO 2024, attendees will receive an overview of the mechanics, format, and outlines used for an effective technical paper and presentation. Also covered will be how to avoid commercialism and common pitfalls that lead to inefficiencies and reduced quality. Time will be made available at the end of the presentation for questions and answers. IPC encourages anyone interested in writing technical papers to attend this free webinar.

With higher voltages come unique challenges. Layer in highly variable operating conditions and failure modes increase exponentially which can lead to serious consequences. This episode of the Road to Reliability series will discuss how failure modes differ for high voltage systems and explore lessons learned from real-world cases.

The Road to Reliability series brings automotive, e-Mobility and electronics technical leaders to share top challenges in achieving reliability targets for new e-mobility technology. Panels will discuss high level topics like reliability drivers and impacts, applications and operating environments for technology, target lifecycles and repairability, and more, collaborating to identify options to address these challenges.

Wondering how to make the most of your IPC membership? We can help.

This free 30-minute webinar presented by Logan Smith, Member and Customer Support Team Lead, will show you how to navigate the membership website pages to access all your benefits and how to participate in all the activities that IPC membership has to offer.

On October 5 at 11:00 am EDT, IPC will host a free webinar, Economic Update and Market Outlook. IPC Chief Economist Shawn DuBravac will share the latest economic data, trends and risks for the latter half of 2023.