Join IPC on November 19 at 4:00 pm EST for a free live event, Economic Outlook 2025, led by IPC Chief Economist Shawn DuBravac. This session is an opportunity to stay informed about the latest economic trends and prepare for the coming year with expert insights.
Discover how to optimize your PCB design process with rigorous constraint management. Join this webinar to learn about the power of model-based PCB design and the importance of digital twins in creating high-quality, manufacturable boards.
Key Topics:
• Model-based PCB design engineering: Understand the benefits and techniques of using models to drive your design process.
• The need for digital twins: Learn how digital twins can provide a comprehensive representation of your PCB, enabling better decision-making and risk mitigation.
• Winning design constraints: Discover effective strategies for defining and implementing design constraints that ensure manufacturability and yield.
• Putting it all together: See how to integrate model-based design, digital twins, and constraint management to achieve optimal results.
Leave this webinar with a clear understanding of how to:
• Create stable and manufacturable PCBs
• Improve design efficiency and reduce errors
• Maximize yield and minimize costs
Don't miss this opportunity to gain valuable insights into the future of PCB design.
In this webinar, we will dive into the Ecodesign for Sustainable Products Regulation (ESPR) and Digital Product Passports (DPPs), providing a clear explanation of what they are and how they work.
Join white paper contributors in a webinar “Next-Generation Electronics Design” on October 14, 2024, at 12:00 pm EDT as they take a deep dive into the subject of design rules and “design for manufacturability.”
When a cyber break-in occurs, the IT team alone will not be able to respond to the attack. The detection is limited to what is available from the IT and network equipment, as opposed to the normal day-to-day behavior that is available to the IT team. Differences from the normal behavior of the production line can only be detected on the production line. No matter how good the IT system is, if the initial response of the people on the production line is slow, the impact of a cyber incident will be much greater. Today, the electronics manufacturing industry is shifting from China, Europe, and the United States to Southeast Asia, including Vietnam, India, and Thailand. Local education and onsite practice is essential.
In this webinar, participants will learn about exercises and best practices for Business Continuity Disaster Recovery (BCDR). This knowledge will help understand what needs to be accomplished at their local factories.
The weakest link in the supply chain can be a target, as demonstrated by the Japanese auto plant that was forced to shut down due to an attack on a single supplier. By applying the lessons from this webinar, participants will be well-prepared for potential cyber attacks, minimizing the risk to their entire, interconnected supply network and the broader electronics manufacturing industry. It is an action that will not be specified in the requirements of the IPC standard for cybersecurity (IPC-1792), but will be mandatory for implementation. The following topics will be covered:
-Practice Demands
-Recognition of current and goal setting
-Preparation (awareness creation)
-Business Continuity Disaster Recovery (BCDR)
-Characteristics of the factory
-Criteria for detection and judgment (risk extraction method)
-Differentiation between failure and attack
-Process of early recovery
-Guidance for BCDR measures policy (BCDR viewpoints, characteristics of factories, requirements for BCDR)
-Overview of BCDR measures
-Conduct incident response practice
-IPC-1792 and practice
Ball Grid Array (BGA) defects pose significant challenges in circuit board assembly. The IPC guidelines provide a foundational framework for inspection, yet they may not encompass all scenarios effectively. Leveraging the latest advancements in 3D Computed Tomography (CT) technology allows for a detailed examination of each solder ball, facilitating a precise identification of common defects such as voiding, non-wetting, and head-in-pillow phenomena. Through this approach, engineers can conduct a thorough root cause analysis, enhancing the reliability of electronic assemblies.
The Corporate Sustainability Due Diligence Directive (CSDDD) is a European Union directive that introduces legal obligations on businesses to respect human rights and the environment.
We are delighted to welcome expert panelists to discuss what automakers, startups, and T1s are demanding from their supply chains in terms of sustainability. Panelists will weigh in the top 3 challenge areas beyond current regulatory reporting and what may be coming next.
We are delighted to welcome Brian O'Leary of Indium to discuss the impact of the Software Defined Vehicle on hardware design and manufacture.
We are delighted to welcome Dr. Habib Mustain of Hereaus to discuss power electronic substrate types, requirements, and challenges for today's EV applications.