A group of industry experts will discuss the evidence of the root causes of creep corrosion, relevant testing, and effective mitigation strategies available to prevent creep corrosion failures in electronics. Fundamentally, creep corrosion is the product of the reaction of copper with sulfur, which may be mitigated with manufacturing processes, such as the printed circuit board solder mask and surface finish, conformal coating, and enclosure levels, as well as during end use operation, such as filtration. Several types of harsh environmental test methods that are used to evaluate for product susceptibility to creep corrosion will also be reviewed.

Panelists include:
• Prabjit (PJ) Singh, Ph.D., IBM, Senior Technical Staff Member
• Randy Schueller, Ph.D., Dell, Director, Client Reliability & Durability
• Christopher Genthe, Rockwell Automation, Senior Principal Engineer
• Paul Leone, Rockwell Automation, Principal Engineer

Join IPC on June 24 at 10:00 am EDT for a special virtual event, "Bold Breakthroughs: Women Reshaping the Engineering Landscape," as we celebrate International Women in Engineering Day (INWED). Our lineup of panelists features nine extraordinary women from nine different countries, each a leader in her own right within the electronics industry.

My colleague Happy Holden famously stated that only about 10% of design packages received by PCB fabricators are complete and accurate out of the gate. This means unnecessary time and cost are going into the other 90% of jobs. What it also means is that design success and product reliability are in jeopardy if these issues are not identified and addressed. 

Early engagement between a PCB fabricator and a PCB designer is essential to avoid common design issues that will impact the success of any PCB design. Getting the PCB fabricator's engineers together with the PCB designers to understand manufacturing capabilities and collaborate on the optimum design solution for a particular application is mission-critical to the success of the project. This webinar will cover: 
•    Customer service representatives are not engineers; why all technical questions cannot be addressed during the quoting stage.
•    What happens when the customer's netlist does not match the customer's Gerber/3d data.
•    Customer impedance requirements don't match the drawings/data. 
•    Picking the appropriate material set for a given design application.
•    Customized CAM adjustments for manufacturability. 
•    The impact of a PCB designer not understanding fabricator capabilities.
•    Unmanufacturable designs.
•    Inheriting designs from another PCB fabricator.
•    Overdesigning a project from a complexity and cost standpoint. 
•    Early and often engagement; it's all about time and cost.

Join experts from the U.S. State Department and the environmental law firm Beveridge and Diamond for a discussion of new and anticipated international rules governing plastics use and management in the electronics value chain.

This webinar will describe available apprenticeship funding opportunities to support your workforce development costs. We aim to demystify these funding opportunities and make them more accessible. We understand that navigating the labyrinth of government funding can be overwhelming, which is how IPC can help.

Implementation of a new process, machine, or material triggers a qualification event for that change under the new H revision of IPC J-STD-001.

When a change in specific materials is being considered, one must determine and provide objective evidence that the improvement does not increase the quality or functionality risk of the product. In order to quantify the risk, the CM and/or OEM are required to acquire quantitative data before implementing the process change. The methodology developed in this webinar is designed to assist the user in incorporating specific tools and analytical measurements to ensure the product’s reliability via objective evidence and controls. This webinar illustrates the challenges of a real-life implementation of a new material change and the subsequent qualification.

Electronics manufacturers aim to minimize the amount of flux residues. Solder flux residues constitute a significant source of ionic contamination on the manufactured PCBAs, and the activator type in the flux determines their corrosiveness. The risk occurs on low standoff components, such as the QFN, due to blocked flux outgassing channels. The second risk is the number of soldering process steps used to build the assembly. Selective soldering, wave soldering, manual, and rework soldering can spread flux residues across the assembly. Pockets of active residue can be present when the flux is not fully heat-activated. For high reliability, the best practice is to clean the assembly.

This webinar will teach best practices for qualifying and validating acceptable electrical hardware performance. The methods taught during this presentation can be used to meet the requirements of IPC J-STD-001H ~ Section 8: Cleanliness.

This webinar will provide an overview of the new one-time EPA reporting rule on PFAS under the Toxic Substances Control Act. The new rule will have a significant impact on electronics producers and importers, because of (a) the widespread use of PFAS within the electronics supply chain; (b) the very expansive definition of PFAS in the rule, which includes commonly used polymers; and (c) EPA’s decision to include imported articles within the scope of the rule.

We are delighted to welcome Dr. Frank Richter of Greenectra to lead a discussion on Li-ion battery technologies and test methods for EV applications.

This webinar is designed to provide non-professional cybersecurity specialists with the facts and awareness they need. No extensive knowledge of cybersecurity is required. Topics include:
•    The possibility you may be the target of a cyber attack.
•    Why attack countermeasures and manufacturing members of the production floor seem so far away.
•    The efforts and limitations of IT engineers.
•    The essence of Zero Trust Architecture.
•    The role of manufacturing members on the shop floor.
•    Balancing the cost of countermeasures versus profits within the manufacturing industry.
•    Discussion of IPC-1792