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Delivering effective and efficient training is a challenge for every organization. Electronics manufacturers need a workforce with a fundamental understanding of the assembly processes, ESD, product handling, PCA/PCB Defects and IPC standards.

IPC's Electronics Assembly for Operators provides trainers with a comprehensive program of nine modules and another nine modules for customization to company-specific roles. Trainees engage with the content and apply what they learned in real-world contexts. The video presentations, detailed illustrations, interactive activities, and practice quizzes are all formulated to make even the most complex topics easy to understand and master.

Explore the Syllabus for Electronics Assembly for Operators.

PROGRAM DESCRIPTION

The Electronics Assembly for Operators course introduces the key tools, materials, and processes for operators working in electronics assembly. This course is designed to encompass the entire assembly process, including a customizable selection of learning modules to address the current needs and future goals of operators and organizations. Download the Instructor Guide.

COURSE OBJECTIVE

After completing this course, you will be able to employ the key tools, materials, and processes required to assemble Printed Circuit Board Assemblies (PCAs) within an electronics manufacturing facility.

MODULE 1: INTRODUCTION TO THE ELECTRONICS INDUSTRY
  • Recognize the role of IPC standards
  • Distinguish Class 1, 2, and 3 electronics products
  • Identify IPC standards training levels
  • Recognize topics covered by common IPC standards
MODULE 2: INTRODUCTION TO PRINTED CIRCUIT ASSEMBLY (PCA)
  • Define the common features of a Printed Circuit Board (PCB)
  • Identify the common components of a Printed Circuit Assembly (PCA)
  • Describe the different attachment methods used in printed circuit assembly
MODULE 3: OVERVIEW OF ASSEMBLY AND SOLDERING PROCESSES
  • Describe the assembly process of Surface Mount Technology (SMT)
  • Describe the assembly process of Through Hole (TH) Technology
  • Distinguish processes used in Surface Mount Technology (SMT) and Through-Hole (TH) Technology
  • Identify the different post-processes within the electronics assembly process
MODULE 4: SAFETY
  • Identify standard safety signs and symbols relevant to assembly operators
  • Describe standard safety procedures for protecting assembly operators, equipment, and products
  • Identify potential risks and hazards of standard materials used by assembly operators
  • Describe safety concerns of using standard assembly equipment
MODULE 5: ESD & PRODUCT HANDLING
  • Identify the cause and concerns of electrostatic discharge (ESD) in electronics assembly
  • Demonstrate the function of personal grounding and static control devices
  • Demonstrate proper handling procedures for PCBs and PCAs
  • Describe cause and prevention of foreign object debris (FOD)
MODULE 6: COMPONENT IDENTIFICATION
  • Identify types of components used in electronic assemblies
  • Distinguish between component polarity and orientation
  • Differentiate between wires, cables, and harnesses
  • Identify types of terminals used in electronic assemblies
  • Identify types of hardware used in electronic assemblies
MODULE 7: DRAWINGS, SPECIFICATIONS & MEASUREMENTS
  • Explain how the Bill of Materials (BOM) is used in the assembly process
  • Explain how assembly drawings are used in the assembly process
  • Identify common measurement tools and symbols used in the assembly process
     
MODULE 8: BASIC PCB/PCA DEFECTS
  • Define quality in electronics manufacturing
  • Recall different quality conditions specified in IPC-A-610 and IPC-A-600
  • Identify PCB and PCA defects according to IPC standards
  • Use quality condition criteria to determine component acceptability
     
MODULE 9: IPC STANDARDS
  • Define IPC standards in reference to the electronic manufacturing industry
  • Identify the most common IPC standards relevant to assembly operators
  • Compare IPC Certification programs with IPC Certificate programs
     
FINAL EXAM FOR MANDATORY MODULES 1-9

Participants must complete the Final Exam for Modules 1 through 9 with a passing score of 80% to access and download their Qualified IPC Assembly Operator Certificate. Students may attempt the exam up to three (3) times. Please note that a third and final attempt is permitted after 24 hours of the second attempt.
Make sure to re-download your updated certificate if you complete optional modules at a later date.

MODULES 10-18 (OPTIONAL)

MODULE 10: INTRODUCTION TO HAND SOLDERING (OPTIONAL)

  • Explain the function of common hand soldering tools, equipment, and materials
  • Identify best practices and methods for hand soldering
  • Identify common hand soldering defects and soldering anomalies

MODULE 11: SURFACE MOUNT TECHNOLOGY (OPTIONAL)

  • Identify tools and materials used in surface mount technology (SMT) assembly process
  • Describe steps in surface mount technology (SMT) assembly process
  • Define the reflow soldering process for SMT assemblies
  • Identify the cause and types of SMT defects within the soldering process

MODULE 12: THROUGH-HOLE TECHNOLOGY (OPTIONAL)

  • Describe the process and properties of through-hole (TH) technology
  • Identify common through-hole insertion methods, tools, and machines
  • Identify common through-hole assembly defects

MODULE 13: WIRE AND CABLE PREPARATION (OPTIONAL)

  • Identify characteristics of wire and cables used in electronics industry
  • Recognize steps in wire preparation
  • Identify inspection criteria for cutting, stripping, and tinning wire

MODULE 14: WIRES & TERMINALS TECHNOLOGY (OPTIONAL)

  • Identify types of wire terminations
  • Differentiate between methods of connecting wires to terminals
  • Differentiate between acceptable and defect soldered and crimped terminations

MODULE 15: CABLES AND HARNESS TECHNOLOGY (OPTIONAL)

  • Identify types of connectors used in wire harness technology
  • Distinguish methods of connectorization
  • Distinguish methods for making and evaluating wire splices
  • Describe the wire harness assembly process

MODULE 16: HARDWARE (OPTIONAL)

  • Identify tools used in electronics assembly
  • Recognize hardware and other materials used in electronics assembly
  • Differentiate between acceptable and defect conditions of installed hardware and materials

MODULE 17: CONFORMAL COATING (OPTIONAL)

  • Identify equipment, tools, and materials used in conformal coating
  • Explain steps in conformal coating process
  • Classify causes and characteristics of conformal coating defects

MODULE 18: PRESS FIT (OPTIONAL)

  • Identify tools, equipment, and materials used in press-fit insertion
  • Describe steps in the press-fit insertion process
  • Identify common press-fit insertion defects

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An In-Depth View of Electronics Assembly for Operators

This webinar outlines the industry needs that led IPC to develop this training course. It provides fundamental information about the industry and introduces operators to the key tools, materials and processes required to produce quality boards consistently and effectively. EAO delivers skills training that prepares operators for the job.

But it's not just for new hires. It works well for cross-training existing employees to make your workforce more flexible. The nine mandatory modules are supplemented with nine optional, job-specific training to meet the training needs specific to your organization.

Get your new hires started right and explore the flexibility this course offers. Take a look at this webinar and explore how your training program can implement this powerful training tool.