IPC Conference Paper Archive

x .. weiterlesen

Last spring at EXPO,embedded passives came into its own by being escalated from a sub-committee with 4 task groups to a general committee with 4 sub-committees. Dave McGregor of Dupont now chai .. weiterlesen

Pure and doped barium titanate thin films have been prepared by chemical solution deposition on 18 µm thick,industry standard copper foils. Films are approximately 0.6 µm thickness and exhibit .. weiterlesen

This work initially started with some research into ink jet technology materials for legend printing. Our company in Hong Kong was working at the time with a Japanese company with the end goal .. weiterlesen

This paper is the second concerning the use of existing electrical test equipment being programmed to first measure the values of plated additive resistors manufactured on circuit board inner l .. weiterlesen

The number of applications using Embedded capacitor technology on Printed Wiring Boards (PWBs) is increasing. One of the increasing applications using embedded capacitor is high-speed digital a .. weiterlesen

x .. weiterlesen

Over the past six years Motorola has shipped over 47 million phones incorporating Embedded Passives (EP) technology. The EP modules shipped in phones have included small modules such as voltage .. weiterlesen

Embedded passive components are resistors,capacitors and inductors buried within a multilayer PCB. Embedded components pass standard reliability test methods,however,the higher temperatures req .. weiterlesen

x .. weiterlesen

Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. As an exa .. weiterlesen

This paper presents the qualification of a new,very thin,printed circuit board (“PCB”) dielectric substrate (“core”) to meet Teradyne’s performance and reliability design goals for a power supp .. weiterlesen

While silicon density doubles approximately every 18 months,following Moore’s law,PWB electrical technology advances much more slowly,Up until now trace impedance has been a sufficient high spe .. weiterlesen

x .. weiterlesen

The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) fini .. weiterlesen

The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservativ .. weiterlesen

When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact signal integrity at high data rates including: inconsistencies in dielectri .. weiterlesen

The dramatic economic downturn of the PWB industry starting in the forth quarter of 2000,which resulted in a reduction of 1/3 of the demand and corresponding supply chain within one year,has ch .. weiterlesen

The number of PCB manufacturers in Europe declined from 700 in the nineties to 400 early this decade and is forecasted to shrink to the range of 100 by 2010. A share of these companies will not .. weiterlesen

In order to cope with a rapid increase in information processing speed,additional technical developments of an optical-electrical composite board are required. Generally speaking,it is more dif .. weiterlesen

The concept revealed is a simple architecture for an optical printed circuit board,which permits manufacturing with the materials normally used in printed circuit board fabrication. This concep .. weiterlesen

This paper summarizes research performed by the NEMI (National Electronics Manufacturing Initiative) Fiber Optic Signal Performance Project team. The project focused on the development of a cle .. weiterlesen

The 2002 International Electronics Manufacturing Initiative (iNEMI) Optoelectronics roadmap anticipated a cross-over in cost-performance whereby a system using optical transmission of high spee .. weiterlesen

Metal-base printed circuit boards (PCBs),multilayer PCBs and embedded PCBs are constructed with a thin insulation layer. In these PCBs,particularly those used for Power Electronics,the insulati .. weiterlesen

The paper will address issues that will impact defect levels and defect spectrum during the transition to lead-free manufacturing. Since there are exemptions of which product types are mandated .. weiterlesen

In this report,the group activity of developing and proposing standard EMC models for numerical EMC simulation is presented. Our group has developed some basic and standard EMC models which con .. weiterlesen

A previously developed ball grid array (BGA) solder joint vibration fatigue life prediction model,which was experimentally validated by Test Vehicle One (TV1) test data for the BGAs with and wi .. weiterlesen

We have developed the copper high density wiring formation technology with Cu/photosensitive Benzocyclobutene (BCB) as a dielectric material,and interconnect technology with Silicon through-hol .. weiterlesen

With the progress of miniaturizing electronic equipment with higher performance,packaging substrates for semiconductor devices are required to cope with finer patterning and higher wiring densi .. weiterlesen

A series of electrical plating processes to build various kinds of micro bump arrays on the organic substrates has been developed for non-permanent connections. Copper bump arrays with nickel/h .. weiterlesen

It has been reported by several laboratories that the time to delamination or decomposition of a printed circuit board specimen at 260°C decreases with the specimen thickness. A temperature gra .. weiterlesen

We report test results of bending characteristics of flexible printed circuit board,which contributes to the development of higher density and more sophisticated function of mobile devices and .. weiterlesen

It is effective to use the stack-via-holes method (via-on-via structure),which stacks micro via-holes (MVH),in the development of higher density circuits on build-up printed wiring boards. When .. weiterlesen

The world market is changing for the OEM,CEM,and electronic manufacturers. This changing market dictates that as a global industry more focus is placed on reducing the time to market for “New P .. weiterlesen

After the world electronic circuit industry finally turned out from the unprecedented recession,the business management of today’s printed circuit industry may possibly have a chance to take a .. weiterlesen

This paper describes part of a research effort currently under way in the field of print defect detection. The techniques described have proven to be robust and particularly well suited for det .. weiterlesen

The comparison of the thermal pattern and the deformation pattern both are obtained on the surface of Printed Circuit Board (PCB) was done to understand how both patterns correspond to each oth .. weiterlesen

Small form factor and high density of printed circuit boards (PCB) have been already realized by flip chip (FC) bonding technology. However,the requirement for finer pitch PCB is still increasi .. weiterlesen

In today’s complex manufacturing test environments,it is becoming increasingly difficult to detect and diagnose structural faults within highly complex multi-layer PCB designs that offer extrem .. weiterlesen

The design and evaluation of a wide bandwidth (3 dB attenuation bandwidth > 20 GHz),50 S,coaxial probe for the electrical characterization of printed wiring board (PWB) transmission lines is de .. weiterlesen

Design for test rules (DFT) for in circuit test (ICT) test pads are well known and have served the industry well for nearly two decades. However,increasing PCB densities continually put pressur .. weiterlesen

Nanotechnology is receiving a lot of attention from companies,universities and governments. The US $3.8million National Nanotechnology Initiative is matched by initiatives in Europe and Asia. B .. weiterlesen

Polymer-ceramic nanocomposites based on new concepts were developed for embedded capacitor applications. The dielectric constant was above 80 at 1 MHz and the specific capacitance was successfu .. weiterlesen

The trend towards tighter pitch,smaller features,and shrinking pad sizes have put a strain on the standard photolithographic processes for soldermask patterning on substrate packaging and rigid .. weiterlesen

As PCB computing bus frequencies climb above 1GHz,measurement of the high-frequency properties of PCB materials becomes critical for design modeling. Understanding these properties and their de .. weiterlesen

Information Technology has come a long way from the humble payroll accounting system to integrated suite of business applications,ostensibly to assist corporations to manage their businesses mo .. weiterlesen

Fluctuating demand for electronic equipment has led to repetitive “boom and bust” business cycles throughout the electronics “food chain.” Double ordering,inventory building and component outag .. weiterlesen

New Chip Packages for advanced electronics are striving for higher density of the printed wiring boards. However,in the supply chain,the PWB fabricator is often the last link that will learn wh .. weiterlesen

The emerging technology known as ‘flipchips’ is poised to take over the world of the portable device. In an age when more and more power and functionality is being offered in ever smaller packa .. weiterlesen

Interest in the adhesive strength of PCBs has recently come to the forefront of the industry. This has been driven by the advent of lead free soldering processes that severely stress the mechan .. weiterlesen