IPC Conference Paper Archive

PCB (Printed Circuit Board) and CCL (Copper Clad Laminates) industries are facing environmental issues and cost reduction challenges. Consumable release sheets are an important aid for many .. weiterlesen

Wireless wearable devices can continuously assess and communicate the condition of patients and are crucial components of digital mobile health platforms. General societal trends across the .. weiterlesen

To demonstrate the benefits of flexible hybrid technology (FHE) and printed electronics the team of Lockheed Martin Rotary Missions Systems Owego (LMO), Lockheed Martin Space Systems Billeri .. weiterlesen

Real-time and in-situ monitoring of the air-quality of confined spaces is a life-saving technology for commercial and government maintenance workers and is conspicuously absent from the comm .. weiterlesen

The Connected Factory Exchange initiative enables the use of tools, machines, and computer software to monitor, improve, and produce reliable hardware. The concept of the Digital Twin is to .. weiterlesen

Technical Cleanliness, i.e., the quantification, control and mitigation of deleterious effects of foreign object debris (FOD), is a common challenge in engineering. In the context of electro .. weiterlesen

Resistance of Solvent Extract (ROSE) testing has been grandfathered not only into the modern IPC standards without validation on modern materials, but it has also become grandfathered into t .. weiterlesen

The industry is moving toward using exotic dielectric materials with a very low loss tangent to improve insertion loss performance. This leads to the result that the signal loss attenuation .. weiterlesen

The euphoria associated with the biggest technological step in the field of telecommunications in recent history, the new 5G mobile communications standard, not only made it necessary for OE .. weiterlesen

The results of a NextFlex project addressing barriers that are preventing inkjet printing from being adopted for prototyping and volume manufacturing of printed circuits, are presented. Thes .. weiterlesen

The emergence of a variety of flexible portable electronics applications has led to increased attention to flexible power sources. Flexible electronics may be subjected to static and dynamic .. weiterlesen

Printed conductors and interconnects on compatible flexible or stretchable substrates are the foundation of flexible hybrid electronic systems that may include conventional silicon-based dev .. weiterlesen

This paper summarizes recent progress on utilizing liquid metals (LMs) consisting of gallium and gallium alloys for the electronics industry. While gallium is a component of existing electro .. weiterlesen

Via-in-Pad Plated Over (VIPPO) designs enable better signal quality and speed, but also cause unintended consequences. At VIPPO locations, with or without a solid copper-filled hole, the coe .. weiterlesen

There is increasing environmental awareness within society, affecting legislation, commerce, and industry. Nature offers an abundance of macromolecules and smaller molecular weight compounds .. weiterlesen

The cost of test has always been a main concern in the electronics manufacturing business. The recent proliferation of 5G, Internet of Things (IoTs) is driving the industry with smart device .. weiterlesen

Instead of using a dedicated test platform, we are presenting methods of using modular and highly scalable components to perform functional testing on a printed circuit board assembly (PCBA) .. weiterlesen

Today, more than 40% of cyber-attacks target IoT devices, and where attacks themselves are commercialized, it is becoming essential to take countermeasures against cyber-attacks, not only fo .. weiterlesen

For many years, the focus of the exchange of design and manufacturing data has been related to the reduction of lead-time in getting products to market, with the reduction of design-turns, e .. weiterlesen

What went wrong, when did it happen and what have we learned? How often have we been confronted with these simple and direct words describing a situation where the outcome is undesirable! To .. weiterlesen

Per- and polyfluoroalkyl substances (PFAS) is a class of fluoro-organic materials that is both ubiquitous and essential to the semiconductor manufacturing process as well as the downstream c .. weiterlesen

In this paper, we highlight the best practices for eco-design in electronics as presented during a multi-part learning series. The learning series was established as an interactive webinar-b .. weiterlesen

Low Temperature Solder (LTS) is increasingly being used as a replacement for SAC305 solder alloy. Processing with LTS can reduce energy costs and impact on the environment while also reducin .. weiterlesen

The 2017 International Electronics Manufacturing Initiatives (iNEMI) Board and Assembly Roadmap had forecast a 20% adoption rate of low-temperature solders (LTS) for board assembly by 2027. .. weiterlesen

Two challenges that advanced packaging suppliers are faced with during IC substrate fabrication are meeting the copper plating performance requirements and reducing manufacturing process cos .. weiterlesen

For many years, the electroless copper process has been widely used by the PCB and package substrate industries, where a wide process window and proven product reliability has led to it bein .. weiterlesen

The High Density Packaging (HDP) user group has completed a project to evaluate dielectric conditions impacting the reliability of backdrilling escape vias under BGA via arrays. Large BGA si .. weiterlesen

The number of components and functionality on a printed circuit board increases continuously. Surface mount device (SMD) components become smaller, pitch dimensions shrink, but there are sti .. weiterlesen

Rapid incorporation of low cost, small footprint, and high efficiency BTC components with a large thermal plane and leadless terminations presents numerous challenges to the PCB manufacturer .. weiterlesen

Many leading solder paste manufacturers are currently developing solder alloys for high reliability applications. These solder alloys are doped with elements such as bismuth (Bi), indium (In .. weiterlesen

The soldering (wave, reflow, and selective) along with flux removal (cleaning) processes have for years been optimized to yield the best result possible. Today more than ever these processes .. weiterlesen

Flip-chip technology has become increasingly prevalent within the electronics industry due to its lower cost, increased package density, improved performance while maintaining or improving c .. weiterlesen

Recently new semi-aqueous in-line cleaning machines (CM) were installed; however, the associated increased volumes of circuit card assemblies (CCAs) being cleaned after SMT surface mount tec .. weiterlesen

Traditional Subtractive Etch (SE) processes used to manufacture Printed Circuit Boards (PCBs) are adequate for many of today’s circuit designs. However, certain parts of PCBs, and more gener .. weiterlesen

This paper will discuss the evolution of the printed board design to date, how process improvements and new manufacturing technologies and chemistry have enabled the new step down in miniatu .. weiterlesen

This paper will discuss the difference between traditional advanced any layer HDI PCB with subtractive process and Ultra High-Density Interconnect (Ultra HDI) or substrate-like-PCB (SLP) wit .. weiterlesen

Complex geometries, customized parts and new processes; these are characteristics that are readily associated with additive manufacturing (AM). At the same time, they are often associated wi .. weiterlesen

Multilevel Additively Manufactured (AME) circuits and devices have been enabling circuit design and implementation that is not possible or is very expensive using traditional methods such as .. weiterlesen

Surface mounted passive electrical components are beginning to reach hard limits for further reduction in size of their packages. Performance of the raw materials used have set capabilities .. weiterlesen

Thermal management must advance with the military’s requirements for increased performance, lower costs, and rapid technology changes. Combining multiphysics analysis and additive manufactur .. weiterlesen

Structural electronics enables design innovation by adding electronic functions to smart surfaces with 3-dimensional form factors. This paper describes the making of a structural electronics .. weiterlesen

Stretchable electronics is a new innovation and becoming popular in various fields, especially in the health care sector. Since stretchable electronics use less Printed Circuit Boards (PCBs) .. weiterlesen

The journey to creating a connected factory can be a scary and arduous task, with some not even knowing where to start. Our roles as engineers supporting the factories have historically been .. weiterlesen

Specialists in IIoT and Industry 4.0 at the Manufacturing Technology Centre have developed the first stage of Europe's first smart factory demonstrator for the manufacture of electronic asse .. weiterlesen

Automation is growing in nearly every sector. Self-driving cars, touchless soft-drink dispensing machines that deliver over 100 different drinks, and robots doing everything from food sortin .. weiterlesen

Companies that place products onto the marketplace, whether they are internally manufactured or sourced from a supply chain, are often faced with ever increasing demands for data from a dive .. weiterlesen

Traditionally sourcing strategies are resolved by a “make or buy” process where companies evaluate if it is more cost effective to make or buy a product. This presentation will explain the s .. weiterlesen

The challenge of decrease PCB manufacturing environmental impact is here to stay. The rate at which a company can process change is key to strategical advantage. Any increase of the change r .. weiterlesen

The electronics industry is seeing more data being computed through printed circuit boards (PCBs). For example, to support 5G communications, most electronics will need to increase their pro .. weiterlesen

Electroless palladium plating has been present in the PCB industry for over 20 years providing highly reliable finishes for high end applications in combination with nickel and gold plating. .. weiterlesen