IPC Conference Paper Archive

SMT-flux residues are feared to be a potential risk factor for quality issues in electronic assembly and interconnect technology. This work shows how the amount of no clean flux residues can .. weiterlesen

In a lead-free reflow process, temperatures are higher, and materials use outgasses more than in a leaded reflow process. The trends toward higher density populated boards and more pin-in-pa .. weiterlesen

ENIG, electroless nickel immersion gold is now a well-regarded finish used to enhance and preserve the solder-ability of copper circuits. EPIG, electroless palladium immersion gold, is a new .. weiterlesen

The latest highest reliability requirements demand a high performance electroless nickel and immersion gold (HP ENIG). The new IPC specification 4552A has refocused the industry with referen .. weiterlesen

This paper details the realization of a multi-layered, printed, conformable hybrid circuit. The circuit was created using silver(Ag) flake ink as a conductive layer and UV acrylic-based ink .. weiterlesen

As is the case with many other markets where faster, highly capable technologies have resulted in more intelligent processes and products, the medical device sector is also undergoing a “sma .. weiterlesen

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This Presentation discusses Improvements for signal integrity.  Signal integrity is based on the copper surface roughness, the oxides on the copper, and the Dielectric constant of the D .. weiterlesen

This Slide show presents RF Cap Layers to normal FR4 Dielectric materials.  This material can be used in multiple configurations including Single sided, Double sided, and Hybrid.&n .. weiterlesen

OEMs and CMs designing and building electronic assemblies for high reliability applications are typically faced with a decision to clean or not to clean the assembly. If ionic residues remai .. weiterlesen

Electronic assembly processes range from simple to complex and involve a wide range of materials to produce. Each step in the process and each assembly material used will have some impact on .. weiterlesen

Since the 1970s, ROSE testing was used to determine “clean enough.” In 2015, the J-STD-001 committee assigned a team to develop the next generation of “cleanliness” requirements. Section 8 d .. weiterlesen

A nano-Cu pressureless sinterable paste was developed for joint formation applications. The material was further engineered in both chemistry and process for enhanced oxidation resistance. T .. weiterlesen

With the advancement in miniaturization, the die is getting thinner and the solder balls are getting smaller for BGAs. Consequently, the thermal warpage is getting more severe due to the mis .. weiterlesen

Solder powder size is a popular topic in the electronics industry due to the continuing trend of miniaturization of electronics. The question commonly asked is “when we should switch from Ty .. weiterlesen

Interconnect reliability especially in BGA solder joints and compliant pins are subjected to design parameters which are very critical to ensure product performance at pre-defined shipping c .. weiterlesen

Increased demand for radar capabilities has required increasingly more efficient thermal management techniques. Simple cold plates using tubes or channels are frequently used to cool high po .. weiterlesen

Embedded components technology has launched its implementation in volume products demanding high levels of miniaturization. Small modules with embedded dies and passive components on the top .. weiterlesen

This presentation covers Stretchable hybrid electronics.  Stretchable electronics have the most industry uses in wearable technology and for mobile sensing and response devices.  T .. weiterlesen

This presentation covers additive manufacturing and the direct deposit of multiple metals.  This additive capability is best utilized for the production of complicated circuits such as .. weiterlesen

The defense industry has realized the importance of Additive Manufacturing (AM) and how this technology can be utilized where parts can be fabricated inexpensively with reduction in lead tim .. weiterlesen

Thermally conductive adhesives are widely implemented in a variety of electronic assemblies. These adhesives combine the function of mechanical fasteners and thermal interface materials into .. weiterlesen

The trend of incorporating more and more electronic devices into our daily life is bringing challenges for the industry. The need for smaller and more powerful devices is also facing one pro .. weiterlesen

There is an increase in the number of optical sensors and cameras being integrated into electronics devices. These go beyond cell phone cameras into automotive sensors, wearables, and other .. weiterlesen

The need to minimise thermal damage to components and laminates, to reduce warpage-induced defects to BGA packages, and to save energy, is driving the electronics industry towards lower proc .. weiterlesen

The electronics industry could benefit greatly from using a reliable, manufacturable, reduced temperature, SMT solder material (alloy-composition) which is cost competitive with traditional .. weiterlesen

With the adoption of Wafer Level Packages (WLP) in the latest generation mobile handsets, the Printed Circuit Board (PCB) industry has also seen the initial steps of High Density Interconnec .. weiterlesen

The demand for miniaturization and higher density electronic products has continued steadily for years and this trend is expected to continue,  according to various semiconductor techno .. weiterlesen

Initially adopted internal specifications for acceptance of printed circuit boards (PCBs) used for wire bonding was that there were no nodules or scratches allowed on the wire bond pads when .. weiterlesen

This paper examines the development and classification of flexible and stretchable conductive pathways to carry power and data and details the technical challenges as well as the methodologi .. weiterlesen

The advent of electronic materials with the potential to undergo extreme deformation while maintaining conductivity has led to the development of advanced stretchable electronic systems. The .. weiterlesen

The paper will discuss the integration of 3D printing and inkjet printing fabrication technologies for microwave and millimeter-wave applications. With the recent advancements in 3D and inkj .. weiterlesen

Many different final plated finishes are used in the PCB industry, each with its own influence on insertion loss. The impact of an applied finish on insertion loss is generally dependent upo .. weiterlesen

Conventional Electroless Nickel/Immersion Gold (ENIG) currently available in the market is prone to brittle solder joints failures. Due to these reasons, there are field failures and reliabi .. weiterlesen

The majority of flexible circuits are made by patterning copper metal that is laminated to a flexible substrate, which is usually polyimide film of varying thickness. An increasingly popular .. weiterlesen

Constant increases in feature density of printed circuit board assemblies (PCBA) has highlighted the importance of functional circuit test (FCT) systems in a manufacturing process. Automated .. weiterlesen

IoT and 5G applications have theirchallenges when it comes to functional testing –especially for the probing part inside a functional test fixture(hereinafter referred to as “FCT” fixture).I .. weiterlesen

There is a compelling need for functional testing of high-speed input/output signals on circuit boards ranging from 1 gigabit per second(Gbps) to several hundred Gbps. While manufacturing te .. weiterlesen

Microvias connect adjacent copper layers to complete electrical paths. Copper-filled microvias can be stacked to form connections beyond adjacent copper layers. Staggered microvias stitch ad .. weiterlesen

The PWB industry needs to complete reliability testing in order to define the minimum copper wrap plating thickness requirement for confirming the reliability of PTH structures.  Predic .. weiterlesen

This paper introduces structural electronics technology enabling smart molded structures. It also presents a case for developing industry standards specific to structural electronics materia .. weiterlesen

Flexible hybrid electronics (FHE) refer to a category of flexible electronics that are made through a combination of traditional assembly process of electronic components with the high-preci .. weiterlesen

Inherent variation among human brains causes difficulty in the design of electroencephalography (EEG)-enabled universal brain-machine interfaces (BMI). Existing EEG systems suffer from incon .. weiterlesen

The technical and economic benefits derived from lowering the reflow temperatures have motivated the evaluation of new Sn-Bi low temperature alloys for soldering. Eutectic Sn-Bi alloy is usu .. weiterlesen

Sn3Ag0.5Cu (SAC305)is the major solder alloy after RoHS was adopted by the European Union. Since its melting temperature is relatively higher than eutectic SnPb alloy, the peak reflow temper .. weiterlesen

The world as we know it is changing. Electronic megatrends are impacting the world and rapidly changing the way we experience day-to-day life. The imminent 5Gwireless infrastructure will be .. weiterlesen

This paper presents assembly challenges of mixed area array technologies covering Very Thin ChipArray® Ball Grid Array (CVBGA) and its Land Grid Array version (CV-LGA), embedded Wafer Level .. weiterlesen

Board level reliability testing is becoming a requirement amongst users for acceptance of components and packages. Standard component level JEDEC tests are not sufficient to qualify a suppli .. weiterlesen

In recent years there has been an increased demand for electronic products with high reliability solder alloys having improved performance in thermal cycle resistance for harsh working envir .. weiterlesen

Advanced Packaging is one of the key growing segments with high adoption rates and strong technology advantages and offersa pathway moving forward to support industry roadmaps. Sputtered see .. weiterlesen