IPC Conference Paper Archive

Failure of a printed circuit board assembly (PCBA) can occur because of design, manufacturing, mechanical, or electrochemical issues. A propagating fault is a severe failure mechanism in whi .. weiterlesen

Fluororesins such as PTFE, which have excellent low-dielectric properties, are used as substrates for high-capacity, high-speed transmission, and their application is increasingly promising .. weiterlesen

The search for novel adhesion promoters (AP) for inner-layer bonding of printed circuit boards that meet the requirements of high-frequency applications is driving the surface treatment indu .. weiterlesen

An electrical model of a thermally damaged microvia has been constructed incorporating observations from electrical test, Scanning Electron Microscopy (SEM), Transmission Electron Microscopy .. weiterlesen

Open circuit failure in microvias is an important issue for critical device reliability yet remains poorly understood. Separations at the microvia-target pad interface caused by board-normal .. weiterlesen

The ongoing COVID-19 pandemic has highlighted the importance of remote healthcare for the well-being of society. On-body devices designed to detect vital signals, dispense medications, and p .. weiterlesen

Heterogeneous integration has become one of the most important approaches in the semiconductor technology world. The process nodes are constantly shrinking from 16nm to 5nm and lower, with C .. weiterlesen

The use of modern laser systems for depaneling printed circuit boards can present many advantages as well as some challenges for the production engineer compared to conventional mechanical s .. weiterlesen

Increasing demands on printed circuit boards require new production methods. For years, lasers were mainly used for application with the highest accuracy requirements. Today, laser depanelin .. weiterlesen

IPC-4552 and IPC-4556 are industry performance specifications for ENIG (Electroless Nickel/Immersion Gold) and ENEPIG (Electroless Nickel/Electroless Palladium/Immersion Gold) as used for th .. weiterlesen

Cupric chloride etchants are often used in PCB fabrication. They use Cu+2 to oxidize solid copper producing two Cu+ ions.[3] During operation, the etchant is overloaded with copper ions. To .. weiterlesen

In the printed circuit board (PCB) industry, the surface finish acts as both protection layer and as active enabler for a broad variety of interconnecting techniques. The deposition of gold .. weiterlesen

This paper describes the novel use of Fused Filament Fabrication (FFF) 3D-printing technology to create plastic, positioning and retaining structures directly onto the surface of standard FR .. weiterlesen

Direct Digital Manufacturing (DDM) combines additive and subtractive manufacturing methods to fully fabricate Printed Circuit Structures (PCS). Harnessing the flexibility of additive methods .. weiterlesen

High reliable lead-free alloys are suitable for high operating temperatures and longer temperature-cycling time. The Innolot alloy,for example, is based on the tin-silver-copper (SAC) metall .. weiterlesen

When evaluating solder paste for use, mechanical reliability is one feature of interest. The performance of an electronic assembly in a vehicle, for example, may hinge on a solder alloy’s re .. weiterlesen

For an automotive transmission control unit (TCU) platform, the bottom ground pad of a high power low-profile quad flat package (LQFP) component soldered to the thermal pad of the PCB had a .. weiterlesen

The research goal was to establish a limit for the number of rework cycles for Ball Gird Arrays (BGAs) and to determine the clearance required between a BGA and its surrounding components on .. weiterlesen

Repair of soldered components is a constant necessity in the electronics industry. Product performance enhancement, damaged components, and exchange of wrong placed components are some of th .. weiterlesen

During the past few years, it has become increasingly difficult to physically rework printed circuit board (PCB) assemblies. Such mundane operations as soldering, desoldering and component r .. weiterlesen

Highly reliable and high-yield prototyping in the early stages of development is crucial for innovations in next generation microelectronic systems to demonstrate the results of research. Th .. weiterlesen

Different types of components with soldered bottom terminations are increasingly used in the electronics industry with the principal objective to improve heat dissipation. The larg .. weiterlesen

The Semi-Additive Process (SAP) is a standard process to enable very fine lines and spaces to produce highly sophisticated Integrated Circuit Substrates (ICS). When operating with lines and .. weiterlesen

The next generation devices using high frequency of 5G to mmWave and greater has called for innovation in materials used in electronics manufacturing to realize the optimum signal integrity .. weiterlesen

PCB Fabricators have long since abandoned Hot-Air Levelling, with several alternative final finishes (ImAg, ImSn, OSP, ENIG and ENEPIG) now well established as having a track record of meeti .. weiterlesen

Aerospace and defense applications present unique challenges for material suppliers. As increasingly adoption of wide bandgap semiconductor materials and advanced diverse accessible heteroge .. weiterlesen

The rapid change to and steep rise of electric vehicles (EV) results in many challenges for the design, manufacturing, testing, and the understanding of reliability and robustness for printe .. weiterlesen

“Light weighting” has become an important trend in numerous manufacturing divisions. Lightweight materials are particularly valuable in any portable device including mass transit systems, au .. weiterlesen

Selective soldering utilizes wettable metal nozzles for controlled application of solder to components. The wetting of solder to the nozzles is part of a complex mechanism that causes wear o .. weiterlesen

Surface mount technology was developed in the 1960s and implemented on printed circuit boards in the 1980s. High-density electronic assemblies are dominated nowadays by surface mount devices .. weiterlesen

Advanced implementation of wearables and IOT applications require attachment of components on lightweight, mechanically flexible, and low-cost substrates. Candidate materials that meet these .. weiterlesen

Selective electrodeposition (brush plating) was successfully used to rework a solder-contaminated, hard gold-plated copper flag connector for a circuit card assembly (CCA). The localized rep .. weiterlesen

The iNEMI flowers of sulfur (FoS) corrosion chamber was developed to study creep corrosion on printed circuit board assemblies(PCBAs). The chamber, typically run at 50 or 60oC, has corrosive .. weiterlesen

Environmental dust accumulation on electronic equipment can impact the performance and reliability of the equipment in various ways. This includes mechanical effects (such as obstructions of .. weiterlesen

Inspection means have increasingly been incorporated into typical manufacturing of boards, substrates and/or systems. A significant number of automatic inspections rely on the analysis of im .. weiterlesen

Digitalization changes everything, everywhere. It is inevitable, new business drivers are forcing the Electronics industry to rethink every element of their business. Virtually every company .. weiterlesen

As the reflow soldering process is the main energy consumer in a SMT assembly line, there is a high potential for cost reduction by significantly reducing the amount of energy needed. Meltin .. weiterlesen

As miniaturization trends continue in the electronics industry, System in Package (SiP) technology is gaining more and more traction. In many ways, some SiP modules are just surface mount te .. weiterlesen

The advance in technology and its relentless develop mentis delivering yet another surface mount assembly challenge. To meet the market demand for products with higher functionality whilst r .. weiterlesen

Polymer coating materials protect electronics from harsh environments, assuring safe and reliable performance. To reach the highest level of reliability, coatings must be selectively applied .. weiterlesen

The development of an automated circuit card assembly(CCA)conformal coating process using a low outgassing polyurethane material was essential for meeting the increase in customer demand fro .. weiterlesen

Light-curable materials can provide significant benefits over conventional technologies, including lower operating costs driven by lower labor needs, space savings, lower energy demand, and .. weiterlesen

To support regulations on hazardous substances in materials and in products like the automotive EU End of Life Vehicle (ELV) directive, the Electronics and Electrical Equipment Restriction o .. weiterlesen

Until recently, virtually all restricted materials in electronics were classified as either carcinogens (e.g. Pb) or reproductive toxins (e.g. phthalates). Two new categories of restricted m .. weiterlesen

The High Density Packaging (HDP) User Group has completed a project based upon an earlier project evaluating the different types of high frequency test methods used in the industry for measu .. weiterlesen

Earlier HDP User Group project work that has been completed and published compared the different types of high frequency test methods used in the industry for measuring Dk and Df at high fre .. weiterlesen

As electronic assembly designs have increased in density and component packaging size and lead pitch have decreased in size, this has placed tighter requirements on manufacturing processes. .. weiterlesen

This slide show presents solutions to the relevant Power Module question: "What has to be considered within a PCB, if currents with about 50 A and voltages above 500 V should be designed?"&n .. weiterlesen

The operation and reliability of any electronic assembly is very dependent on the performance, quality and consistency of the bare printed circuit board (PCB). Without good quality bare boar .. weiterlesen

A number of similar Printed Wiring Assemblies (PWAs) had been subjected to final electrical tests on automated test equipment when a common test failure was recognized. All PWAs were failing .. weiterlesen