Description Conformal coatings are applied to protect electronic assemblies from adventitious environmental factors,which include,for example,corrosive gases,corrosive fluids and high humidity. ... read more

Description Pitting/Crevice corrosion on printed circuit boards has not been well studied in the industry. ... read more

Description In a global market,it is often difficult to determine the best PCB suppliers for your technology needs,while also achieving the lowest costs for your products. ... read more

Description Electronics manufacturers protect their circuit boards with conformal coatings. Conformal coatings serve as a barrier from environmental hazards and internal shorts,tin whiskers,and corrosion at the board level. ... read more

Description As consumer products continue to reduce in price,pressure is placed upon the manufacturing of sub-components for improving cost. ... read more

Description An ever-increasing number of electronics assembly applications are using flip chip packages that require large volume underfill. Large volume underfill is typically defined as being for a die size greater than 12 x 12 millimeters and requiring the underfill volume to be >20 milligram (mg). ... read more

Description •Nano-electronics potential •Barriers to entry – and opportunities •Examples –Nano-solder –Capacitor materials –Graphene •Opportunities for rapid commercialization? ... read more

Description The use of copper foils laminated to polyimide (PI) as flexible printed circuit board precursor is a standard practice in the PCB industry. ... read more

Description Flux consumption for wave soldering tends to decrease,mainly due to its gradual replacement by reflow soldering methods (i.e. pin-in-paste) in many electronics applications. ... read more

Description No-clean soldering processes continue to dominate the electronics manufacturing world,especially amongst consumer-type electronics. For many years,type 3 was pretty much the “standard” solder paste particle size with a distribution of 25 – 45 microns (-325/+500 mesh). ... read more

Description When designing PCBs,solder paste selection is critical. Once a specific paste type and supplier are identified,the manufacturing process is developed and refined. Critical to the quality of the solder joint is an effective thermal profile. ... read more

Description The electronic industry is currently very interested in low temperature soldering processes,such as using Sn/Bi alloy,to improve process yield,eliminate the head-in-pillow effect,and enhance rework yield. ... read more

Description The dissipation of heat from a power die,such as those used to drive the increasingly popular LED arrays,has traditionally been achieved by use of a thermal interface material (TIM) and a metallic heat sink. ... read more

Description While a significant level of voiding can be tolerated in solder joints where electrical conductivity is the main requirement,voiding at any level severely compromises thermal conductivity. ... read more

Description Due to the ongoing trend towards miniaturization of power components,the need for increased thermal conductivity of solder joints in SMT processes gains more and more importance. Therefore,the role of void free solder joints in power electronics becomes more central. ... read more

Description PCB manufacturers use a wide variety of solder pastes and fluxes including No-Clean,RMA and OA,both leaded and lead-free within their processes. As part of the manufacturing process,components are soldered using reflow ovens and/or wave solder systems. ... read more

Description With the wide breadth of component types used in complex electronic equipment,implementation of the European Union Restriction of Hazardous Substances 2011/65/EU/ (RoHS) is a challenge. ... read more

Description Over fifteen years has passed since North America and Europe ceased being the center of worldwide PCB fabrication,and were supplanted by a Far East market with low cost labor,more relaxed environmental requirements,and strong government support. ... read more

Description Additive Manufacturing has recently been brought into the spotlight as an alternative manufacturing method. ... read more

Description Wetting balance testing has been an industry standard for evaluating the solderability of final finishes on printed circuit boards (PCB) for many years. ... read more

Description The risk associated with whisker growth from pure tin solderable terminations is fully mitigated when all of the pure tin is dissolved into tin-lead solder during SMT reflow. ... read more

Description Ever since there has been a widespread usage of surface mount parts,the trend of continued shrinkage of devices with ever finer pitches has continued to challenge PCB assemblers for the rework of same. ... read more

Description Certain types of nano-coated stencils dramatically improve the transfer efficiency of solder paste during paste printing. These nano-coatings also refine the solder paste brick shape giving improved print definition. ... read more

Description As a surface finish for PCBs,Electroless Nickel/Electroless Palladium/Immersion Gold (ENEPIG) was selected over Electroless Nickel/Immersion Gold (ENIG) for CMOS image sensor applications with both surface mount technology (SMT) and gold ball bonding processes in mind based on the research availa ... read more

Description Wire bonded packages using conventional copper leadframe have been used in industry for quite some time. ... read more

Description Portable electronics demand that inductors and transformers be implemented in low profile surface mount packages. In communication systems,magnetic components are used for impedance matching,voltage isolation,energy storage,noise filtering,and combining signals. ... read more

Description The electronics industry is experiencing a renaissance in semiconductor package technology. A growing number of innovative 3D package assembly methodologies have evolved to enable the electronics industry to maximize their products functionality. ... read more

Description Traceability has grown from being a specialized need for certain safety critical segments of the industry,to now being a recognized value-add tool for the industry as a whole. ... read more

Description With technology these days,we often find solutions without a problem,rather than the other way around. The concept of the “Internet of Manufacturing” (IoM),combined with the evolution toward automated and computerized factories,is an exciting subject for engineers. ... read more

Description The highly-automated and connection-driven methods in Electronics Manufacturing is a more and more important topic in the industry today. Advances in modern manufacturing technologies make factories smarter,safer and more environmentally sustainable. ... read more

Description While flex and rigid flex (IPC-6013 Types 1 through 4i[1]) have always been important in 3D packaging to help resolve space constraints and meet other design requirements,the continued push for denser packaging and higher performance has only increased the demand for more complex interconnects. ... read more

Description With the rapid development of the information industry,increasing attention is being paid to the dielectric performance of base materials including copper-clad laminates (CCL) and prepregs. ... read more

Description The miniaturization trend is driving industry to adopting low standoff components or components in cavity. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. ... read more

Description Controlled humidity and temperature controlled surface insulation resistance (SIR) measurements of flux covered test vehicles,subject to a direct current (D.C.) bias voltage are recognized by a number of global standards organizations as the preferred method to determine if no clean solder paste ... read more

Description The selection of a liquid flux for use in wave soldering operations is extremely critical to both the manufacturing assembly process and the long term reliability of electronic assemblies. ... read more

Description In this rapidly moving electronics market,fast to market with new products is what separates top performing companies from average companies. A survey conducted by Arthur D. ... read more

Description Sustaining the results of any continuous improvement effort can be challenging. With Lean improvement,constant monitoring,coaching and tweaking is often required to keep the "old ways" from creeping back into the process. ... read more

Description In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect board warpage during reflow soldering. ... read more

Description In the high temperatures during board assembly reflow soldering,the base material becomes soft and there is a severe risk for permanent warpage. There are many parameters that could affect board warpage during reflow soldering. ... read more

Description The electronics markets place widely varying demands on products,thus necessitating a great deal of complexity with regard to board design and connector technology. ... read more

Description Whilst many companies invest time,effort and cost into up front work to fix snags which would lead to issues with yield during production,this paper shows the efforts of the company who looks to take things further. ... read more

Description Plated Though Hole (PTH) vias are common in the PCB industry,however their impact on electrical performance can sometimes be unclear. The confusion can be due to several different issues. ... read more

Description Currently there is no industry standard test method for measuring dielectric properties of circuit board materials at frequencies greater than about 10 GHz. Various materials vendors and test labs take different approaches to determine these properties. ... read more

Description Determining the root cause of a failure in a complex system is a demanding task that requires a structured and disciplined approach. ... read more

Description Thermo-electric coolers (TEC's) are becoming increasingly popular in the medical device industry,where design space is limited and high heat transfer capacity is needed. ... read more

Description The selective soldering application requires a combination of performance attributes that traditional liquid fluxes designed for wave soldering applications cannot fulfill. First,the flux deposition on the board needs to be carefully controlled. ... read more

Description Selective soldering,along with pin-in-paste reflow and press fit,is the primary assembly method for through-hole components. The reflow process is limited by component dimensions and heat resistance. Press fit becomes expensive when defects occur that cannot be repaired. ... read more

Description Wave soldering of pin through hole devices has been around for a very long time. It is a process that everyone says will go away and each year it is still being used. ... read more

Description High Power Transistors contain materials and structure that pose unique challenges to AXI technologies. The work discusses traditional AXI imaging and processing techniques and their limitations in very heavily shaded,and non-uniformly shaded situations. ... read more

Description C-mode scanning acoustic microscopy (C-SAM) is a non-destructive inspection technique showing the internal features of a specimen by ultrasound. The C-SAM is the preferred method for finding “air gaps” such as delamination,cracks,voids,and porosity. ... read more