Description The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments,including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. ... read more

Description Development of information and the telecommunications network has been outstanding in recent years,and it is required for the related equipment such as communication base stations,servers and routers,to process huge amounts of data in short periods of time. ... read more

Description The High Density Packaging (HDP) user group working on high frequency test methods,used for speeds above 2.0 GHz,is developing a way of comparing how sensitive each of the various high frequency test methods are in measuring the effect of moisture content on a laminate material’s dielectric const ... read more

Description Due to the arrayed nature of the Computed Tomography (CT) Detector,high density area array interconnect solutions are critical to the functionality of the CT detector module. ... read more

Description Automated Optical Inspection (AOI) is advantageous in that it enables defects to be detected early in the manufacturing process,reducing the Cost of Repair as the AOI systems identify the specific components that are failing removing the need for any additional test troubleshooting. ... read more

Description The industry continues to face the challenges associated with BGA,QFN/BTC,and LED packages. The demand for more performance by consumers drives change,which results in greater component density. ... read more

Description The electronics industry has widely adopted Sn-3.0Ag-0.5Cu solder alloys for lead-free reflow soldering applications and tin-copper based alloys for wave soldering applications. In automated soldering or rework operations,users may work with Sn-Ag-Cu or Sn-Cu based alloys. ... read more

Description Soldering is the bonding of metallic surfaces via an intermetallic compound (IMC). The interaction between thermal energy delivery,flux chemistry,and solder chemistry creates the solder bond or joint. ... read more

Description The development of novel interconnection materials for production of electronics is of considerable interest to fulfill increasing demands on interconnect reliability in increasingly demanding environments with respect to temperature extremes,mechanical stresses and/or production limitations. ... read more

Description With the rapid trend towards miniaturization in surface mount and MEMs lid-attach technology,it is becoming increasingly challenging to dispense solder paste in ultra-fine dot applications such as those involving chip capacitors or BGA packages,as well as dispensing ultra-fine lines in MEMs lid-a ... read more

Description Surface mount components are commonly evaluated for out-of-plane warpage levels across reflow temperatures. Decision making from these measurements is primarily based on signed warpage of a single component surface,per industry standards. ... read more

Description Numerous 3D stack packaging technologies have been implemented by industry for use in microelectronics memory applications. ... read more

Description The multilayer ceramic capacitor (MLCC) has become a widely used electronics component both for surface mount and embedded PCB applications. ... read more

Description Ionic contamination testing as a process control tool a newly developed testing protocol based on IPC-TM6502.3.25,was established to enable monitoring of ionic contamination within series production. ... read more

Description There are several industry-accepted methods for determining the reliability of flux residues after assembly. The recommended methods of test sample preparation do not always closely mimic the thermal cycle experienced by an assembly. ... read more

Description Quad Flat Non-lead (QFN) packages are finding increased uses in high reliability applications due to their smaller footprints,improved thermal and electrical performance [1] and as such there is increased focus on their reliability performance in harsh environments [2 to 5]. ... read more

Description Status of flip chip technology such as wafer bumping,package substrate,flip chip assembly,and underfill will be reviewed in this study. Emphasis is placed on the latest developments of these areas in the past few years. Their future trends will also be recommended. ... read more

Description Glass offers a number of advantages as a dielectric material,such as a low coefficient of thermal expansion (CTE),high dimensional stability,high thermal conductivity and suitable dielectric constant. ... read more

Description Electronics industry has grown immensely over the last few decades owing to the rapid growth of consumer electronics in the modern world. New formulations are essential to fit the needs of manufacturing printed circuit boards and semiconductors. ... read more

Description Polymer Thick Film (PTF)-based printed electronics (aka Printed Electronics) has improved in durability over the last few decades and is now a proven alternative to copper circuitry in many applications once thought beyond the capability of PTF circuitry. ... read more

Description One specific market space of interest to emerging printed electronics is In Mold Label (IML) technology. IML is used in many consumer products and white good applications. When combined with electronics,the In Mold Electronics (IME) adds compelling new product functionality. ... read more

Description Printed electronics is a familiar term that is taking on more meaning as the technology matures. Flexible electronics is sometimes referred to as a subset of this and the printing approach is one of the enabling factors for roll to roll processes. ... read more

Description Bottom terminated components,or BTCs,have been rapidly incorporated into PCB designs because of their low cost,small footprint and overall reliability. ... read more

Description Voids in solder joints plague many electronics manufacturers. Do you have voids in your life? ... read more

Description Counterfeit electronic components are finding their way into today’s defense electronics. The problem gets even more complex when procuring DMS (diminishing manufacturing source) parts. ... read more

Description As DMSMS and Obsolescence relate to printed circuit boards (PCB),there is an ever increasing need for maintaining spare and replacement boards for legacy systems that are operating well past their intended lifecycle. ... read more

Description In recent years,a growing number of electronic devices are being incorporated into automotive and other high reliability end products where the challenge is to make these devices more reliable. ... read more

Description It is well known that structures at fine pitches with flux residues are more susceptible to corrosion issues and electrochemical migration (ECM) problems. Characterization of flux residues in terms of ECM are commonly characterized using SIR testing. ... read more

Description No-clean solder pastes are widely used in a number of applications that are exposed to wide variations in temperature during the life of the assembled electronics device. ... read more

Description Smartphones and tablets require very high flexible and sever bending performance to the Flexible Printed Circuits (FPCs) to fit into their thinner and smaller body designs. ... read more

Description As a result of the continuous industrial trend towards high density packaging there is a growing demand for highly thermally-stable laminate materials. ... read more

Description With complexities of PCB design scaling and manufacturing processes adopting to environmentally friendly practices raise challenges in ensuring structural quality of PCBs. This makes it essential to have a good ‘Design for Test’ (DFT) to ensure a robust structural test. ... read more

Description This paper will discuss the expanded use of boundary-scan testing beyond the typical manufacturing test to capture structural defects on a component/devices in a printed circuit board assembly (PCBA). ... read more

Description Manufacturers test to ensure that the product is built correctly. Shorts,opens,wrong or incorrectly inserted components,even catastrophically faulty components need to be flagged,found and repaired. ... read more

Description To answer the high functionality expected of mobile device terminals,such as smartphones and wearable devices,panels need to be created even smaller while increasing the quantity of parts and maintaining a large-capacity battery space. ... read more

Description The art of screen printing solder paste for the surface mount community has been discussed and presented for several decades. However,the impending introduction of passive Metric 0201 devices has reopened the need to re-evaluate the printing process and the influence of stencil architecture. ... read more

Description Reduction of first pass defects in the SMT assembly process minimizes cost,assembly time and improves reliability. These three areas,cost,delivery and reliability determine manufacturing yields and are key in maintaining a successful and profitable assembly process. ... read more

Description For a demanding automotive electronics assembly,a highly thermal fatigue resistant solder alloy is required,which makes the lead-free Sn-Ag-Cu type solder alloy unusable. ... read more

Description Driven by miniaturization,cost reduction and tighter requirements for electrical and thermal performance,the use of lead-frame based bottom-termination components (LF-BTC) as small-outline no-leads (SON),quad-flat no leads (QFN) packages etc.,is increasing. ... read more

Description The miniaturization trend is driving industry to adopting low standoff components. The cost reduction pressure is pushing telecommunication industry to combine assembly of components and electromagnetic shield in one single reflow process. ... read more

Description Creep corrosion on printed circuit boards (PCBs) is the corrosion of copper metallization and the spreading of the copper corrosion products across the PCB surfaces to the extent that they may electrically short circuit neighboring features on the PCB. ... read more

Description Reliability Expectations of Highly Dense Electronic Assemblies is commonly validated using Ion Chromatography and Surface Insulation Resistance. Surface Insulation Resistance tests resistance drops on both cleaned and non-cleaned circuit assemblies. ... read more

Description Creep corrosion testing of printed circuit boards (PCBs) using a specially designed flowers of sulfur chamber has been developed by an iNEMI technical committee. ... read more

Description Millimeter-wave (mmWave) frequency applications are becoming more common. There are applications utilizing PCB technology at 60 GHz,77 GHz and many other mmWave frequencies. ... read more

Description Higher functionality,higher performance and higher reliability with smaller real estate are the mantras of any electronic device and the future guarantees more of the same. ... read more

Description Six decades of legacy experience makes the specification and production of screens and masks to produce repeatable precision results mostly an exercise in matching engineering needs with known ink and substrate performance to specify screen and stencil characteristics. ... read more

Description One of the major concerns with screen printing of low temperature curing polymer thick film (PTF) pastes onto common flexible PET substrate materials is the overwhelming spread of the paste beyond the design line width after printing. ... read more

Description This study investigates the scooping effect during solder paste printing as a function of aperture width,aperture length and squeegee pressure. The percent of the theoretical volume deposited depends on the PWB topography. ... read more

Description Solder paste printing is the first step in the surface mount manufacturing process for PCBA assembly. When the solder paste printing process is uncontrolled,defects can be produced,which may not become apparent until the PCBA is downstream. ... read more

Description Existing coated microstrip trace impedance estimation usually uses the dielectric constant (Dk) of solder mask ink measured at 1 MHz from its datasheet. ... read more