Description Polyimides have proven their performance in electronic applications demanding high strength,increased durability, broader temperature ranges and exceptional chemical resistance. They serve as the material of choice for fabricating ... read more

Description ??Machine Technology designed for the manufacture of Ultra Fine Line product ??Machine design provides clean production environment ??Latest State of the Art,Horizontal Wet Processing Equipment ??Intelligent Machines with high levels of automation,self cleaning ... read more

Description With the printed circuit board becoming increasingly complex,there is an ever-growing need to implement manufacturing standards that ensure high productivity at even higher yields. Factors such as operator error and ... read more

Description A new thermosetting resin system with modified cyanate ester resins having a loose cross-linked structure and alloyed with polymers was developed to provide low dielectric constant (Dk) and low dissipation factor (Df) ... read more

Description Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities for very high speed applications. The challenge of opto-electronics and integration of photonics down onto the printed circuit ... read more

Description There is a growing need in today’s electronic market for high performance Printed Circuit Boards (PCBs) with highspeed signals and enhanced performance. However,they must maintain signal integrity,PCB reliability,quality,and meet the overall thickness constraints of the application. ... read more

Description There is a contingent in the industry that feels reinforced substrates are needed to meet the performance requirements of HDI microvia technology. Concerns that non-reinforced resin coated foils,or non-woven substrates, ... read more

Description The combination of high speed and accuracy laser beam deflection,the know-how on wet chemical processes for Printed Circuit Boards (PCB’s),as well as CAD/CAM implementation for Laser direct Structuring (LS) of PCB’s ... read more

Description The electronics market demands for smaller,faster,more reliable and less costly products continues to fuel major changes in printed wiring board designs. Higher layer counts,increasing circuit densities and HDI technologies have ... read more

Description Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with improved dielectric properties. This paper focuses on new laminate materials with potential uses in multilayer ... read more

Description Successful copper plating of blind micro-vias is very strongly dependant on the effective mass transport of copper ions into the vias. This mass transport limitation is demonstrated by a rough or even in extreme cases at high aspect ... read more

Description Laser drilling has clearly captured the technology lead in the formation of HDI microvias with a 78% ownership,1 currently dominating over photo defined,plasma etched and mechanically drilled methods. Processing speeds are ... read more

Description In the Printed Wiring Board (PWB) industry,the growing demand for a higher number of circuit components to be contained in smaller circuit areas requires that some of the passive components (resistors,capacitors,etc) are now ... read more

Description Highs Density Interconnects (HDI) printed circuits are now being designed in ever increasing quantities. HDI brings some interesting new solutions to age-old signal integrity (SI) concerns,and concerns that will grow as rise-times continue to drop. ... read more

Description Because high performance products are limited in speed by packaging and interconnections,signal integrity analysis and PWB simulation become nowadays very pressing and key issues. Taking into account these aspects,the ... read more

Description A concern in the manufacture of laminate PWB’s is the transfer of interior circuit patterns to the surface of the board. This can lead to difficulties in forming the external circuitry. Typically,a number of identical boards are ... read more

Description This paper discusses two typical PTH failures – barrel cracking and post separation – induced by accelerated testing or observed during manufacturing. Finite element models have been developed to help understand the effect of the ... read more

Description Motorola has developed a suite of technologies for embedding resistors,inductors,and capacitors in HDI printed ... read more

Description The power attenuation of the optical fiber due to bends is investigated for the feasibility of the integration optical fiber into PCBs. ... read more

Description A novel technology for embedding discrete capacitors in a mezzanine layer of an HDI PWB was developed and implemented by Motorola in partnership with its PWB supply chain. The technology is based on the use of a ... read more

Description Design and processing of ceramic resistors and capacitors fired onto copper foil and embedded into FR4 circuit boards are presented and discussed. Evolution of design guidelines and processing for embedded ceramics is ... read more

Description Various requirements have developed for printed wiring boards regarding the minimum spacing between features. Creepage distances per UL-60950 call out 1.2mm for voltages up to 50v,and call out 1.4mm for voltages up to ... read more

Description This paper describes a process for plating of interconnects for advanced electronic modules. In contrast to traditional chemical mediation of plating processes,this process is electrically mediated and does not rely on difficult to control ... read more

Description Many printed circuit board manufacturers report that the measured value of the differential impedance is a few ohms greater than the calculated value when the substrate is FR4. There may be several reasons for these differences: ???accuracy of the software used ... read more

Description The ideal outer layer has a uniform circuit height throughout the board. This is a challenge to produce with pattern plating,because the plated metal height depends on the current density,which varies across the board,based on the ... read more

Description The demand for small packaging for portable electronic equipment and reduced chip form factor with higher interconnect fan-out,is driving printed circuit substrate technology rapidly forward. The demand is for smaller,thinner,lighter,more reliable and,of course,cheaper devices. ... read more

Description The development of digital printing systems for printed circuit board legends (a.k.a. nomenclature,indent or letter screening) is a major technological leap. Legend marking on printed circuit boards (PCB) is presently being ... read more

Description This paper presents a comparison of several resin systems on different support reinforcements including on Thermount®1 (or NWA),E-Glass (or E),and NE-Glass2 (SITM) (or NE). The resin systems compared in this paper ... read more

Description The physical placement of embedded singulated capacitors in relation to one another and to other board structures could have an impact on the measured capacitance of individual capacitors. ... read more

Description Typically thermal cycle test requirements for printed wiring boards (PWBs) are somewhat arbitrarily established for a particular product. Many programs simply default to a standard test without much quantitative analysis. With ... read more

Description Utilizing continuous lamination techniques,new materials are being developed to meet demanding market requirements. Laminates produced using Thermosetting Polymer Alloys (TPA) are cost effective products that ... read more

Description Direct Current plating in acid copper baths containing organic supplements shows us that during electrolysis,these organic additives are attracted by the copper anode and being adsorbed on its surface. ... read more

Description The design rule of PWBs and substrates for plastic packages is moving towards higher density as semiconductor chip design evolves into increasingly finer lines. First,it was studied how fine the conventional subtractive process ... read more

Description As the trend to increased interconnection density continues,conductive printed circuit board features become closer and closer together. It is now common to see 3 mil lines and spaces on local areas of circuit boards,and via spacing of less than 10 mils. ... read more

Description With increasing focus on reliability and miniaturized designs,Conductive Anodic Filament (CAF) as failure mechanism is gaining a lot of attention. Smaller geometries make the printed circuit board (PCB) susceptible to ... read more

Description Electronic components are being used in increasingly more severe shock environments. This combined with an industry trend of increased component reliability to help reduce electronic system downtime has created an ... read more

Description This paper addresses the challenges of pre-production engineering,why the engineering department is viewed as a bottleneck in many PCB companies,and how a dedicated software system breaks the information bottleneck and ... read more

Description Some new alternative PWB surface finishes have been entering the industry over the past few years. In order for any new board surface finish to be accepted for general use,it must be approved by the OEM as well as the EMS ... read more

Description According to Michael Shernerof of Scientific American (Jan. 2002) technology has advanced more in the past one century than in the previous one hundred centuries. ... read more

Description Designs of new electronic products show a significant drive for smaller and more complex PWBs. This continuing trend of miniaturization affects components in the same way as for the connecting pads on a printed circuit board. ... read more

Description The technology for embedding components in PWBs will change the process how PWB are fabricated over the next few years. At the present time,polymer thick film is the most frequently used material to embed “passives” in ... read more

Description This paper describes a new technology for speeding the initiation and uniformity of electroplating deposits that does not depend on modifying the chemistry or physical environment of the plating bath. Rather,it involves the treatment ... read more

Description This paper provides a comparison of the air-to-air thermal cyclic reliability and associated failure modes of second level interconnects in lead-free,1.27 mm pitch,256 I/O BGA devices with eutectic tin -lead assemblies. ... read more

Description A comparative study of package-to-board interconnections of a 1.27mm pitch BGA package using two Pb-free alloys and Sn-Pb solder in extended –40 to 125°C thermal cycling is described. ... read more

Description X ... read more

Description The texture of a tin deposit has been described as a key factor influencing whisker growth. Based on X-ray diffraction (XRD) and whisker growth data,this paper intends to show one possible mechanism that contributes to the formation of whiskers. ... read more

Description X ... read more

Description There are two main driving forces that are causing the electronics industry to take a look at alternatives to hot air solder leveling (HASL) as a surface finish for printed wiring boards (PWB). ... read more

Description X ... read more

Description Lead-free manufacturing is becoming an industry initiative for environmental and legislative reasons. ... read more