Description Conductive anodic filament (CAF) formation is a failure mode associated with electronic circuits which operate at high voltage gradients and which are stored under high humidity conditions. Certain soldering fluxes and hot air solder leveling (HASL) fluids enhance this failure mechanism. ... read more

Description The formation of underfill voids is an area of concern in the low cost,high throughput,or “no-flow” flip chip assembly process. This assembly process involves placement of a flip chip device directly onto the substrate pad site covered with pre-dispensed no-flow underfill. ... read more

Description Residue left behind from no-clean assembly is a visually obvious artifact of the manufacturing process that can cause concern to those with RF circuit assemblies. This paper describes a test vehicle and test procedure, ... read more

Description Group technology (GT) concepts can be applied in printed circuit board (PCB) assembly when determining a setup strategy for a single machine. ... read more

Description Surface Insulation Resistance (SIR) Testing,has been used traditionally to characterise process materials, ... read more

Description Vapor phase soldering is in discussion of the recent past. Some of the topics of our own work are presented in this paper,like the combination of vapor phase reflow soldering with wave soldering process. ... read more

Description Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter,and less expensive packages,and flip chip is an important enabling technology for these product trends. ... read more

Description Lead-free wave soldering was studied in this work using Sn/Ag/Cu alloy. A process DOE was developed,with three ... read more

Description In-line inspection equipment has become common place in the PCB assembly industry. This equipment is intended to both eliminate defects at an early stage of production and to be used as a process control tool to prevent these defects from occurring in the first place. ... read more

Description The use of Chip Scale Packaging (CSP) is rapidly expanding,particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these applications. ... read more

Description Automated X-ray inspection (AXI) is more often a part of an effective test strategy for today's PCBAs1 because of the benefits it provides manufacturers in meeting challenges resulting from2: •?Continued product miniaturization amid increased product functionality ... read more

Description Three epoxy systems were evaluated for physical and optical properties. The three systems chosen for the study were selected on the basis of their optical clarity,color and chemistry. Three distinctly different chemistries were chosen,aromatic epoxy- amine cured. ... read more

Description The purpose of this study is to understand the capability of both AOI and AXI machines and where the two could be combined to increase the inspection coverage,reduce the overall cycle time of the inspection process and provide the most cost effective solution. ... read more

Description Application of solder paste by using stencil-printing process is a commonly used method for high volume electronics circuits manufacturing. This process has proved to be the fastest and most cost-efficient. ... read more

Description Many papers and articles are claiming that a majority of the defects detected after reflow are coming from the solder paste application process. However,very little real data seems to be available to support this claim. ... read more

Description The control of moisture-sensitive devices (MSDs) prior to SMT reflow is a critical assembly issue that has a direct impact on final product reliability and customer satisfaction as well as manufacturing costs. ... read more

Description As 0402 has become a common package for printed circuit board (PCB) assembly,research and development on mounting 0201 components is emerging as an important topic in the field of surface mount technology for PWB miniaturization. ... read more

Description Like many other phrases carelessly thrown around by economists and business consultants,Return on Investment has become the overused acronym ROI,and has gained popularity so quickly that engineers more accustomed to dealing with SMT,VOC,PTH and ICT now use ROI as part of their everyday working la ... read more

Description Eutectic Bi-42Sn solder is a low melting point alternative to lead-based solders,particularly for low cost,consumer electronics. In earlier work,the mechanical properties of this solder have been enhanced by small additions of silver (0.5%-3%). ... read more

Description This paper will discuss the implementation of real-time automated SPC for the Reflow Process. ... read more

Description Wafer-applied underfills are key to the widespread acceptance of flip chip technology. This NIST-ATP funded consortium is developing the materials and processes for achieving a wafer-applied underfill system that is both self-fluxing and reworkable. ... read more

Description Flip Chip on Board (FCOB) is one of the most quickly growing segments in advanced electronic packaging. ... read more

Description Automated Optical Inspection (AOI) equipment has become an option for electronics manufacturers who are considering how to improve performance on the production line. During the last few years rapid changes have occurred in mounting technology for PCB assemblies. ... read more

Description The latest types of components launched by the leading component manufacturers have increased the need for process control in rework. ... read more

Description As imaging requirements continue to move towards finer resolution,accurate layer-to-layer alignment becomes an increasingly important factor that influences product yield. One of the major contributors to yield loss in fine-line products is the dimensional instability of the substrate. ... read more

Description New vertical continuous plating equipment has been developed while taking into consideration production and environmental requirements. The vertical continuous plating equipment conveys printed circuit boards continuously without using any racks and carries out high quality plating. ... read more

Description Permittivity and dissipation factor (Dk and Df) are effects of polarization of different components of the dielectric substrate material when subjected to an electrical field. ... read more

Description Using conventional PWB copper electroplating techniques (DC bath chemistry with air agitation),non-uniform deposition inside blind via features may arise when the vias have diameters less than 6 mils and aspect ratios greater than one. ... read more

Description Among the many advantages of Periodical Pulse Reverse (PPR) technology,improvement in throwing power and plating thickness uniformity are the most obvious. ... read more

Description Copper plating in the printed circuit board industry has traditionally used soluble copper anodes in a vertical configuration. ... read more

Description This paper presents a method both to enhance the yield of embedded resistor processes and to print embedded resistors using drop-on-demand ink-jet device capable of dispensing a precise volume of intrinsically conductive polymers (ICPs) onto plated or screen printed resistors. ... read more

Description It is not often understood that when electrical signals travel along a wire or trace --- they reflect. Always! We intuitively understand that when we send audio waves across a room,a field or a canyon,they reflect. ... read more

Description If in designing your next product you are interested in cost reduction,reliability improvement,and increased electrical performance,then you should be considering using laser-drilled vias. ... read more

Description Several of the major OEMs are introducing a variety of thermal reliability requirements for printed wiring boards as a result of increasing demands during assembly. ... read more

Description Reliability assessment of Printed Wiring Boards and Assemblies using High Humidity at elevated temperatures has been done for a number of years. Many companies,including the IPC have published test requirements for products at high humidity at elevated temperatures. ... read more

Description A uniform transmission line is described electrically by a characteristic impedance and a time delay. From the length of the line and the time delay,the effective dielectric constant can be extracted. ... read more

Description Automation,change and complexity have become the normal working environment in the PCB market. ... read more

Description Inventory has been a hotly debated topic in many organizations. Since inventory is directly visible in company financials,there is a high degree of sensitivity to excessive inventory levels in the management ranks. ... read more

Description Solid Solder Deposit (SSD) technology was developed in the early and mid-1990's to improve first pass yields in the manufacture of electronic devices. ... read more

Description In many areas conductive polymers have already gained full acceptance as a reliable and qualitatively outstanding metallization process and as a true competitor for electroless Cu. ... read more

Description Processing thin core capacitor materials can be challenging,particularly those with non-reinforced dielectric less than 0.001” thick. Several processing steps require special attention to ensure the material is not damaged during manufacturing. ... read more

Description A new versatile laser technology is available that is capable of working with both rigid and flexible boards using only one laser source. This system is based on a THG-UV laser (355 nm) and vector data software. This system can be used for drilling,cutting and structuring. ... read more

Description Because of environmental concerns,elimination of lead from electronic components has been recently encouraged,and as a result,lead-free solders are frequently adopted for solder mounting. ... read more

Description The market for optical communication equipment and components has grown significantly since the early 1980s with growth rates exceeding 50% annually in the late 1990s. Although demand has dropped significantly since 2000,the underlying drivers for demand are still operating. ... read more

Description An optical interconnection technology for multi-layer printed circuit boards is presented. The application of this technology enables onboard data rates of several Gbps whereas at the same time a significant improvement on the electromagnetic compatibility (EMC) can be achieved. ... read more

Description The rapid developments of IT equipment are placing increased demands on printed wiring boards (PWBs) in terms of high efficiency,high-density and lightweight. ... read more

Description The next generation of surface finish coatings to replace HASL are now being installed by various PWB manufacturers and have been implemented by many OEMs. Coating thickness requirements are part of the OEMs’ specification given to the board manufacturer. ... read more

Description Dry film photoresist to produce highly integrated and advanced PWBs has been developed to meet more demanding fine line requirements. Advantages for volume production of fine features below 50?m with high yield are now available with newly ... read more

Description We will present a new positive working dry film resist system that is suitable for high accuracy use. The new positive working dry film resist is composed of base polymers with active hydrogen functionality,and a ... read more

Description Prepregs used in the PCB industry possess various properties and need to be handled with care to maintain ... read more