Description In this work,we have evaluated the use of underfill to enhance the reliability of small BGAs in the automotive thermal cycling environment. Best parameters for underfilling of BGAs were developed during a processing study, ... read more

Description It is stated that some degree of voiding is acceptable and inevitable when soldering electronic components,and specifically BGAs. There have been many publications which discuss this phenomena,the reasons for,how to ... read more

Description The endless quest for increased performance in less space has recently manifested itself in 0.5mm pitch Chip Scale Packages (CSP). The footprints of these packages are only about half the size that of a 0.8 mm-pitch CSP but they ... read more

Description To characterize the paste printing process,both the individual aspects of the process and the interactions between the aspects must be understood. The main aspects of the printing process are paste,stencil,printer and board. Each can ... read more

Description Solder voiding is present in the majority solder joints and is generally accepted when the voids are small and the total void content is minimal. X-ray methods are the predominate method for solder void analysis but this method ... read more

Description A number of prior studies have established that solid state migration of solder alloy elemental phases will occur as a function of temperature,time and voltage bias through the solder joint. This study undertakes to develop and ... read more

Description Although wave soldering has not historically been considered a well-controlled process,its evolution over the past decade makes it a prime candidate for effective control methods. These methods are not complex,but relatively ... read more

Description Currently,PWB industry is striving for the cost down at the daily PWB manufacturing,and at the same time,they are developing the higher density PWB for the future application. ... read more

Description Today’s HDI field of technology is coming under more and more pressure to increase wiring density and,even more importantly,to decrease manufacturing costs. The current technological approach does not permit an adequate response to ... read more

Description JPCA has been developing standards necessary for adoption of optoelectronic technology especially for consumer applications for years. The subjects being drafted are the technology that is fairly matured and actually used in some ... read more

Description Reliable copper interconnects are a primary requirement for most printed wiring board applications. A variety of wet manufacturing processes play an important role in the formation of durable interconnects,including plated thru ... read more

Description Two years ago when IBM Endicott,now Endicott Interconnect (EI),was preparing to install a new Acid Copper plating system,the Periodic Reverse Pulse (PRP) tanks installed at the end of the line were seen as a current density ... read more

Description The Cray X1™ system dramatically extends the capability of supercomputers with High efficiency and extreme performance. Specifically designed to meet the needs of the high-end user,the Cray X1 provides exceptional ... read more

Description Design of printed wiring boards allowing devices to function at increasing signal transmission rates is a difficult task. As operating frequencies increase beyond one Gigahertz the availability and accuracy of Dielectric Constant and Dissipation ... read more

Description This paper addresses the growing need in the Printed Wiring Board industry to measure and test propagation delay parameters of board interconnects within the fabrication process. The state of current art is detailed in discussions of four ... read more

Description Designing a signal path to provide a particular impedance is thought to be a well understood science. The first issue which is often overlooked is to analytically establish the need for specifying a controlled impedance signal path. After determining ... read more

Description Abstract Electroplated tin and tin alloy coatings are used in electronics plating applications as a solderable and corrosion resistant surface finish for components and printed circuit boards (PCBs). Though applications vary,there are some commonalities ... read more

Description For decades,tin-lead has been used as the primary surface finish for compliant pins and plated through holes (PTH) of printed circuit board (PCB) in press-fit connections. Therefore,most test results on press-fit performance are focused on the ... read more

Description As an EMS provider of high complexity backpanel assemblies,traceability of components with performance issues found at system test,functional test and in the field was limited to the ability to trace the raw board or fab defects and not much more. ... read more

Description Fabricators,and the copper plating process they choose,can have considerable influence on their customers' solder joint reliability. In the case of high density assemblies,via-in-pad designs often cause solder joint void formation due to the ... read more

Description In the United States,focus turns toward enabling technology for quick-turn printed circuit board and laminate package manufacturing. The current corporate mandate is to develop advanced,enabling technology,and to integrate it rapidly. ... read more

Description Optomec is developing an aerosol-based technology for high-precision,maskless deposition of a wide variety of materials. The system functions by atomizing commercial inks and pastes,and then depositing the droplets under ... read more

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Description A vertically configured package technology developed by Tessera is proving to be a practical multi-die solution for any number of single and multiple functional combinations. The enabling technology for this stacking approach allows different ... read more

Description The adoption of three-dimensional System-in-Package (3D-SiP) is progressing rapidly,driven primarily my mobile electronic applications such as mobile phones,PDAs,digital still cameras,and digital video recorders. The underlying,enabling Chip ... read more

Description Buried Capacitance1 (BC) laminates products have been in use in many high-speed applications for more than ten years. BC products are a significant contributor to complex multi-layer printed circuit board construction and also a ... read more

Description Electronic devices with high performance are becoming smaller and lighter. The passive components required to enable high performance consume premium space on the surface of the printed circuit board. Integrating the resistor ... read more

Description Lower cost is frequently listed as the main driver for moving to embedded passives. Unfortunately,understanding the true cost difference between a design using embedded passives and the same design using discrete passives is ... read more

Description This paper presents an emerging technology for embedding discrete ceramic thick-film capacitors directly into printed circuit boards. Their use frees up surface real estate allowing for smaller boards and/or for more silicon on ... read more

Description Successive generations of ICs demand higher peak current levels and faster current rise times,challenging traditional surface mount decoupling. The considerably lower parasitic inductance of integrated capacitors and the structures associated with ... read more

Description Embedded passives are entering a new phase of improved product capability and enhanced processes. Thinner, higher capacitance embedded distributed capacitance (EDC) materials are coming to market. Alternate resistor ... read more

Description This paper will highlight the shortcomings of each of the commonly used surface finishes available on the market today. The goal is to spark the industry interest,that it may double its efforts in resolving the technical issues ... read more

Description The development of two new industry specifications – IPC-4553 (immersion silver IAg) and IPC-4554 (immersion tin ISn) are well under way. Following in a tradition started with the development of the 4552 ENIG specification,it is customary for ... read more

Description Sn/Cu lead-free solder is a good alternative to 63/37 solder for use in HASL processes. Solderability of Sn/Cu surface exceeds that of 63/37 solder,nickel-gold,OSP,silver,and immersion tin both before and after heat induced aging. ... read more

Description With increased environmental legislation against lead in the electronics industry1,circuit board manufacturers are expecting chemical suppliers to formulate lead free alternatives with the same functionality as tin/lead. These ... read more

Description Numerous industry studies have been performed examining the compatibility between new plating finishes and other metals used in printed wiring assemblies. The transition to the new printed wiring board finishes has been driven by global lead-free ... read more

Description Traditionally,the evolution of advanced IC assemblies has been due to defense and aerospace applications,where reliability,size and weight were at a premium,and cost was a secondary consideration. In the 1980’s,high ... read more

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Description Teradyne,Inc. has been involved with Conductor Analysis Technologies,Inc. (CAT Inc.) for over 4 years and the IPC D-36 Subcommittee for over 2 years. This paper describes the initial motivation for selecting "CAT" test ... read more

Description Benchmarking of industry fabrication capability,feature tolerances and material property variation is essential to aligning product requirements and industry capability. Statistical based characterization of feature tolerances and ... read more

Description New component packaging formats create the need for greater production process stability,reproducibility and precision. This leads to a growing demand for process control solutions. ... read more

Description Dramatic changes are underway in the computer,telecommunication,automotive,and consumer electronics industries. Changes that demand common and pervasive requirements for active assemblies such as: (1) ultra-low ... read more

Description To successfully navigate the transition from an entrenched Pb-based electronics manufacturing model to a fully integrated Pb-free manufacturing operation will require significant and coordinated modifications to many elements of currently operating electronics manufacturing organizations. ... read more

Description Optical connectors are used to connect optical devices to other optical devices or systems. The presence of these optical connectors makes it possible to switch conveniently from one device or system to another. ... read more

Description Two new electrolytically plated lead-free surface finishes,satin bright tin on nickel and palladium-cobalt on nickel followed by gold flash coating,are evaluated for their wettability,bond strength,and voiding performance,and are compared with electrolytic nickel gold and OSP. ... read more

Description Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. ... read more