Description The full hermetic package for electronics and optoelectronic (OE) devices was first developed in the 1800’s and has served these industries well. The earliest optoelectronic devices,cathode ray tubes (CRT) demonstrated in the late 1800’s,used a sealed ... read more

Description With the Waste Electrical and Electronic Equipment (WEEE) Directive in Europe outlawing lead from many electronic devices produced and imported in the EU by July 2006,as well as with foreign competition driving the implementation of lead-free ... read more

Description The Massachusetts Toxics Use Reduction Institute (TURI) has sponsored a consortium of Massachusetts based corporations to investigate lead-free (Pb-free) surface mount soldering technology. The current effort is a Design of ... read more

Description Intermetallic formation and growth were studied for the alloys Sn-3.2Ag-0.8Cu,Sn-3.5Ag,Sn-0.7Cu,and Sn-9Zn. Coupons of solder joints (prepared by melting some of each solder alloy on a copper-plated circuit board) were ... read more

Description The introduction of Pb-free solder into the electronics industry has required changes to the standard surface mount process. The largest changes are in the reflow process,as Pb-free pastes require higher temperatures and tighter process controls than ... read more

Description Within the Surface Mount Assembly (S.M.A.) process,solder paste is primarily used as a mechanical and electrical connection. Solder paste is generally deposited using a mass imaging process,such as squeegees,however this paper ... read more

Description The popular tin (Sn) rich lead free solders are causing severe corrosion to many of the materials used in today’s Wave Solder systems. Users are experiencing higher maintenance frequency and reduced life of wave solder ... read more

Description Wave Soldering continues to be a necessity for many applications in the PCB assembly arena. One of the drawbacks to the Wave Soldering process is the high cost associated with maintaining and operating the machines. Dross ... read more

Description The electronic industry is under extreme pressure to remove tin-lead solders from electronic components. Pure tin is one of the alternatives and may be the simplest system as a “drop-in” replacement for SnPb surface finishes. ... read more

Description Tin alloys such as Sn 0.7% Cu and Sn 2%Bi were identified as a viable alternative to tin-lead finish. Electroplating of these alloys is challenging because of great difference in reduction potentials of the individual elements and ... read more

Description This paper provides an assembly process comparison of Pb-free alloys with a Sn/Pb alloy using a test vehicle designed to resemble real world manufacturing applications. Four different Pb-free alloy systems,including two ... read more

Description Shelf life is one of the most important characteristics of solder paste. Many pastes exhibit good print characteristics when fresh but then suffer rapid degradation. Although rosin based pastes are most susceptible to this phenomena ... read more

Description With the growth of the concern on the environment,more and more efforts have been done to protect the earth,to minimize the pollution on the environment. The use of the lead free solder is replacing that of the conventional solder-Sn-37Pb in many electronic industry fields. ... read more

Description The world is stating to focus on tin-silver copper as the lead-free alloy of choice. This paper discusses the commercially available tin-silver-copper alloys and their processing and reliability as well as the world-wide level ... read more

Description Over the years,electronic components have become increasingly smaller and integrated. Spacing between components and line to line spacing has continually shrunk. This miniaturization has magnified the importance of choosing appropriate components and ... read more

Description Conformal or protective coatings are widely used in the electronics industry today and are available in a large variety of different types and adjustments. The "classic" or conventional conformal coatings are mainly based on epoxy,polyurethane or acrylic ... read more

Description As line speeds increase and production looks to decrease size and energy requirements,radiation curing becomes a more attractive technology option over the incumbent thermal and moisture curing technologies. This paper reviews ... read more

Description Boeing Commercial Electronics (BCE),a subsidiary of The Boeing Company,is a leading supplier of avionics and cabin management systems for the Boeing family of commercial airplanes. Boeing specifications require conformal ... read more

Description The use of no-clean solder paste and flux has become widely accepted as a cost saver in the SMT assembly process. The presence of solder flux residues,solder mask,underfill or any SMT material not accounted for in the design can ... read more

Description The ability of a solder paste particles to coalesce and wet the Printed Wiring Board (PWB) and component lead is key to proper solder joint formation. Robust solder paste performance is needed over a range of typical ... read more

Description Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC package terminals in terms of solder wetting ability. Current industrial standard procedures for solderability ... read more

Description National Electronics Manufacturing Initiative (NEMI) initiated six projects in late 2001 and 2002 addressing key issues identified by the industry. These cover the areas of Fiber Management,Signal Integrity,Splicing,Selective ... read more

Description High speed systems operating at speeds of 2GHz and above are placing increasing demands on the specifications of substrates and packaging of components used within these systems. BPA has reviewed those systems that are driving technology developments These are: ... read more

Description We have organized in JPCA a committee for the standardization of optoelectronic assembly technology in collaboration with JIEP (Japan Institute of Electronics Packaging) with cooperation of JEITA (Japan Electronics and ... read more

Description The OEM desires identified in the 2002 – 2003 roadmap clearly identify,through their emulators,the present and future needs of the products that the emulators represent. There are a total of eight emulators. Each emulator is broken down into the ... read more

Description Tin whiskers found in electroplated deposits are known to be single crystals which spontaneously grow. Thus whisker growth can be regarded as a grain growth phenomenon. In this paper we examine whisker grain growth in ... read more

Description Over the past years there has been consistent growth in the use of electroless nickel/immersion gold (ENIG) as a final finish. The finish is now frequently being used for PBGA,CSP,QFP and COB and more recently gathered ... read more

Description The wetting of alternative PCB surface finishes,including immersion silver (I-Ag) and immersion tin (I-Sn),by Sn/Ag/Cu solder and Sn/Pb solder,was studied in this work,along with electroless nickel/immersion gold (Ni/Au) ... read more

Description Lead-free soldering technology is still in its infancy with technical and cost issues posing major challenges for the industry. It is expected that soldering in a nitrogen atmosphere might overcome some of the technical barriers and ... read more

Description The impact cooling rates exert on the reflow process is identified. The trends in shear strength and the microstructural evolution of the solder joints are described. Lead free (Sn/3.5Ag/0.7Cu) and tin lead (63Sn/37Pb) ... read more

Description Flux management methods for reflow soldering have been debated for years. Current data suggests that multi-stage filtration systems offer many benefits,particularly in dealing with the byproducts of new solder/flux paste ... read more

Description Stability and repeatability are imperative in any reflow oven today. If oven operation is not validated periodically,all subsequent profiles and adjustments are not reliable in finding or maintaining an optimum reflow process window for products. This is ... read more

Description One of the electronic assembly markets that has been emerging in recent years is the automation equipment associated with odd form component placement and final product assembly. As with insertion mount and surface mount equipment,the ... read more

Description The advent of fine pitch area array components and the constant drive to reduce the cost of electronic products mandate the enhancement of manufacturing systems and assembly yields. In fine pitch area array packaging, ... read more

Description Support tooling for circuit boards whose undersides are populated with electronic components is delicate,time consuming to setup,and relatively expensive. This is because support pins or dedicated work holders have to avoid ... read more

Description Flip chip assembly is a key capability to enable product miniaturization. Our previous studies have investigated several flip chip interconnection types including anisotropic conductive film or paste,and Au-Au thermosonic bonding. This project is focused ... read more

Description The increasing demand for portable electronic products has accelerated the quest for even greater miniaturization. At the current state of electronic production technology,volume and weight reductions have been achieved through the ... read more

Description As outsource to EMS,the requirement for Automated Optical Inspection (AOI) equipment changes as well. Due to the diversity of the business,EMS providers require equipment that can handle a myriad of different components. ... read more

Description In a low-volume,high-mix electronics manufacturing environment,the ability to delineate design concerns before a customer’s product goes to production is paramount. Design deficiencies or deviations from standards,or designs ... read more

Description The internet explosion of the 90’s created much hype around public exchanges that has never materialized. The current business environment of a multi-company value chain,alliances and partnership selling has highlighted the ... read more

Description With the increase in outsourcing activity throughout the electronics industry,OEM’s are turning to Electronic Manufacturing Services (EMS) to provide quality quick turn prototypes and fast New Product Introduction (NPI). ... read more

Description The relationship between the OEM and the EMS provider (Electronic Manufacturing Services) has evolved with the increase in outsourcing of manufacturing services. This has resulted in the consequent evolution of the quality and ... read more

Description The outsourcing trend within the electronics industry continues to accelerate as OEMs focus their limited resources on core competencies that enhance shareholder value. This outsourcing trend is driving OEM Design and NPI Supply Chains to ... read more

Description With the ban of CFC’s,various cleaning processes have emerged and have been established as viable alternatives1,2,3. Several cleaning processes such as ultrasonic and spray in air batch and in-line have become ... read more

Description The evaluation of a new solvent blend to clean printed wire boards is reported. Ethyl nonafluorobutyl ether (HFE- 7200) provides the fluid dynamics to build engineered cleaning fluids that exhibit superior cleaning on a wide range ... read more

Description To meet today’s environmental demands,new VOC-free and low-VOC cleaning agents have been formulated that exhibit outstanding cleaning performance for a variety of flux residues. The new cleaning agents were tested for defluxing watersoluble, ... read more

Description As technologies evolve with the onset of smaller and smaller components,different flux residues,and the no-lead solders,manufacturing companies are asking questions regarding what they need to consider for the future to ... read more

Description A novel liquid halide-free PK-002,epoxy flux,is reported for SnAgCu soldering,where the thermally cured flux residue is designed to provide an interference-free service performance,in addition to the low cost advantage of a ... read more

Description Applying underfill materials to the bottom of components prior to shipping to the 2nd level end-user is very desirable in that it would eliminate the underfill process from the end-users assembly line. The overall value to the end-user is ... read more

Description A simple and cost effective method has been developed in order to test adhesion of components to a circuit board via a reflow encapsulant. Originally,a mechanical shock test similar to current methods was used that involved ... read more