Description All manufacturers in the printed circuit board (PCB) industry have experienced lack of reliability,maintenance,and performance problems with their machines. These challenges decrease manufacturing productivity and increase ... read more

Description The IPC 2501 Web Service Definition for the exchange of XML data provides an XML middleware integration environment that enables the deployment of IPC Computer Aided Manufacturing using XML (CAMX) -based ... read more

Description Yield and defect levels in the manufacturing of high-complexity and high-reliability Printed Circuit Board Assemblies (PCBAs) are extremely sensitive to variations in the process,component quality and workmanship. Any ... read more

Description Numerous studies and anecdotal data suggest that most SMT assembly lines are not optimized. This situation is true whether one looks at the individual processes,such as stencil printing or placement,or the entire SMT assembly line ... read more

Description Wave soldering fluxes are currently used in hand soldering operations as a matter of course and with little regard for flux deposition amounts. This use has led to the investigation of fluxes used in hand soldering ... read more

Description Surface Mount Rework systems have evolved into sophisticated thermal processing tools with the ability to accurately mimic original reflow oven profiles at a localized rework site. Features such as automated profile ... read more

Description SMT rework machines are vital tools to many production engineers. They can be used to correct process errors and repair test failures. They can also be used to service and upgrade products returned from the field. ... read more

Description Current circuit board designs,particularly those in telecommunications,are so densely populated that they do not provide enough clearance between SMT components and through-hole components to allow assemblers to use ... read more

Description Wave and reflow soldering are well known,successfully proven mass soldering techniques. They offer the ability to solder printed circuit boards in high volumes quickly with low defect levels,producing high quality solder joints. ... read more

Description The use of laser technology has found increasing applications in the electronics assembly industry. This non-contact heating technique is ideal for components that require careful handling which otherwise might be damaged due to ... read more

Description In both the server and portable electronic markets,monotonic mechanical overstress has become a primary issue in manufacturing and field usage. Appropriate test methods,including four point bending,can be used for pro-active design optimization. ... read more

Description To meet the complex design requirements of the electronics industry,there is an increased need for large size high I/O BGA packages. The size of these large BGA packages (up to 50 mm2 and 1157+ I/O) creates additional ... read more

Description Electronic package size reduction and demand for increased functions within less board space make a challenge for the PCB designer to find smaller footprint components that will out perform larger sized components. The signal ... read more

Description Solderability testing is carried out at the IC (Integrated Circuit) manufacturer’s end to evaluate the quality of the IC package terminals in terms of solder wetting ability. Current industrial standard procedures for solderability ... read more

Description With the increasing demands of complex functions in a single chipset or microprocessor,the development of large size high I/O Flip Chip BGA (FCBGA) package becomes very important in recent years. In general,the component ... read more

Description In the present study,a simplified analysis methodology is used to evaluate thermal fatigue damage of solder joints of a leadless ceramic chip carrier (LCCC) or a leadless chip capacitor/resistor (LCC/LCR). During temperature ... read more

Description The energy consumed during the reflow assembly of printed wiring board assemblies is expected to be environmentally significant within the solder product life-cycle. Wide differences in the melting temperatures of lead and lead-free solders ... read more

Description Circuit pack assembly involves the use of numerous materials and processes of environmental concern,including electronic components and associated assembly operations. It is necessary to be able to evaluate these in a robust, ... read more

Description Much of the environmental emphasis is currently on elimination of undesirable elements and compounds such as lead or halogens. The unintended consequences are huge in terms of diversion of resources (at a time of great strain ... read more

Description This paper will focus on Dr. Taguchi’s Robust Engineering methodology,measurement methods and experimental results for the optimization of a lead free SMT process for use in an Automotive Electronics application. The key ... read more

Description With the US military now committed to the phasing out of lead-containing solders via the Joint Group on Pollution Prevention (JG-PP) the electronics industry has moved beyond debate about whether to make this move and onto the question of how to implement the ... read more

Description The goal of SMT production is a zero-defect process in which flawed materials never get to the customer; however, in the ideal scenario,zero-defect production would mean that no flawed products ever come off the production line. ... read more

Description For test engineers and managers,automated optical inspection (AOI) systems have emerged as a countermeasure to the growing threats of lost physical or electrical access to assembled PCB. AOI systems are successfully employed in high volume ... read more

Description The economic environment in the electronics industry has changed dramatically over the last two years. The focus on the production floor has moved from increasing capacity to improving the yield. One of the major consequences of this shift in focus has ... read more

Description The slowdown in the electronics industry has allowed the management of electronics products manufacturers to dedicate time to reconsider their manufacturing strategy. For most of these companies,outsourcing has been in its ... read more

Description Shrinking profits and overcapacity have forced Electronics Manufacturers to squeeze every last penny out of Site Operations. To reduce conversion costs in a short timeframe,some facilities have employed Motorola's ... read more

Description Manufacturers can use DPMO metrics to reduce the cost of PCB assembly with fewer resources. DPMO data can be used for predicting the fault spectrum on future products,quoting new business,setting quality targets for ... read more

Description The electronics content of many consumer products has increased substantially over the past decade. Several of the electronics added to the automobile control vehicle functions that have a direct bearing on the well being and safety ... read more

Description For high reliability applications,the use of x-ray technique has become an additional inspection requirement for quality control and detection of unique defects due to manufacturing of advanced electronic packages such as ball ... read more

Description The advent of miniature surface mount components coupled with increasing lead counts has posed tremendous challenges during assembly. This is especially true in an Electronics Manufacturing Service (EMS) industry where ... read more

Description This paper will discuss: a. Boundary scan as a key test tool that enables the leveraged test approach b. The advantages of standardizing and reusing design verification tests and PLD programs in the manufacturing test environment ... read more

Description Boundary-scan has achieved many of the goals envisioned by its original architects and today is in use in thousands of production facilities around the world to test complex digital printed circuit boards. The original vision of the ... read more

Description In recent years,technological advances in electronics manufacturing have allowed high volume manufacturers to significantly improve process control and documentation. Manufacturers have accelerated the use of solder paste ... read more

Description The drive for electronic devices to become lightweight,more portable,and posses increased functionality has driven electronic components to smaller and smaller sizes. This decease in size does not only apply to active devices such ... read more

Description Solder beading and tombstoning are observed increasingly with chip components as their size decreases. This is even more crucial in today’s packaging,due to the high ratio of passive components in comparison to active ... read more

Description The trend in electronics packaging towards product miniaturization,has forced the industry to use fine pitch area array packages instead of fine pitch leaded packages. These area array packages enable higher production yields and ... read more

Description Quantitative solder paste performance or use testing enables material formulators to focus on and maximize key material traits such as wettability and printability. These same material test methods and tools allow SMT engineers ... read more

Description Today’s SMT assemblies are being driven toward SMD’s with higher lead densities as well as smaller packages. This places additional performance requirements on the printing process. The stencil printing process has a major ... read more

Description In the complex electronics industry,supply chain costs can have a major impact on a company’s profitability. Like the industrial supply chain,where costs are estimated to account for as much as 8% of a company’s operating ... read more

Description Solder paste for use in wafer bumping applications is becoming an extremely viable technology. Yields from solder paste printing applications are approaching that of typical bumping technologies. The lower cost associated with ... read more

Description The relentless trend for smaller,lighter,cheaper consumer products continues to fuel the demand for new,smaller, efficient electronic packages. In recent years wafer level packaging concepts have emerged,providing multiple ... read more

Description A technique that enhances the release of solder paste from stencils during the print process has been developed. The technique is based on applying variable high frequency and low amplitude vibrations to the stencil during the ... read more

Description Chip Scale Package (CSP) technology is growing at a rapid pace since its emergence in the electronics manufacturing industry. As the solder joint size decreases,it has become apparent that underfill is necessary to meet ... read more

Description Underfill technology has been used to minimize the mismatch of the Coefficient of Thermal Expansion (CTE) in flip chip technology. An extension of this application has been used to increase the mechanical strength of Chip Scale Packages (CSPs). ... read more

Description The trend in optical communications is toward all-optical Networks,which transmit,manage and route traffic over extended distances in the optical domain,without the need for power-hungry and bandwidth-limiting electronic ... read more

Description The outgassing level of materials (such as adhesives,composites,plastics,etc.) that are used to assemble and construct optoelectronic packages,sub-assemblies,and other electronic materials is becoming more of a necessary ... read more

Description Electronic devices become more and more smaller. Electronic assemblies are sensitive against electrostatic discharge just as much as its smallest and most sensitive element. So protection systems are necessary in all areas,where these ... read more

Description Sandia National Laboratories has programs covering the range of MEMS technologies from LIGA to bulk to surface micromachining. These MEMS technologies are being considered for an equally broad range of applications,including sensors, ... read more

Description One of the greatest obstacles in commercialization of MEMS is the cost of packaging and assembly. Packaging needs for MicroSystems and MEMS technology vary by structure and application. Major improvements in MEMs ... read more

Description A new type of Micro-Electro-Mechanical System (MEMS) structure has been developed on a printed wiring board (PWB) platform. PWB,embedded passives (EP) and High Density Interconnect (HDI) technologies were utilized to ... read more