Description The technology shift toward higher performance (low Dk,low Df,faster signal speeds) resin materials for high reliability high layer count multlayer interconnect devices is moving rapidly. PWB fabricators are discovering that the bond strength ... read more

Description This paper describes a copper electroplating enabling technology for filling microvias. Driven by the need for faster,smaller and higher performance communication and electronic devices,build-up technology ... read more

Description With an increasing number of designers specifying conductive material for plugging through-holes,a more robust process to produce 100% fill is needed for the whole range of aspect ratios. With via sizes ranging from 8 to 20 mils in diameter and ... read more

Description There is increased interest in the printed wiring board (PWB) industry with regards to the use of periodic pulse reverse (PPR) plating to electroplate printed circuit boards. PPR plating offers several advantages over DC plating including improved ... read more

Description Colloidal graphite direct metalization processes have proven their usefulness as a replacement for electroless copper. This is especially the case in high technology and quick turn applications. The consistency of colloidal graphite direct metalization ... read more

Description Mass transfer effects and reactor design play an important role in the plating process of electronic interconnects. To improve the behaviour and performance of the plating reactors used for electronic modules,a better understanding of the electrolyte ... read more

Description Lean and Continuous Improvement are distinct performance improvement strategies. Each has its own objective and methodology and is highly inter-woven. Lean Manufacturing uses the strategy of Kaikaku and Continuous Improvement takes the approach of Kaizen. ... read more

Description Loyal customers are customers who will pay premium price for exceptional products and services,refer other customers to buy products and services,buy a whole range of products and services from the company,assist in product and services ... read more

Description The overall mission and foundation of business today,as it was yesterday and undoubtedly will be tomorrow,is to maximize customer service. Customer Relationship Management (CRM),although a relatively new term in the world of Information ... read more

Description Today,there are only three certainties in a circuit board market that for the last three years has proven anything but certain: death,taxes,and military business. As the overall North American electronics market has declined and manufacturing ... read more

Description To estimate the ability of a process to perform according to the product’s design (i.e.,specification),process capability indices (Cp,Cpk,etc.) are used. What most people fail to realize,however,is that the actual process capability indices should ... read more

Description We often hear or use the terms “World Class Manufacturing” or “Best in Class Manufacturing” in reference to our manufacturing operation or perhaps a competitor’s or supplier’s manufacturing operation. However no formal industry ... read more

Description Epoxy molding compounds are used extensively in the electronics industry to encapsulate surface mount Integrated Circuits (ICs). The primary purpose of encapsulating the SMT package using these molding compounds is to protect them from ... read more

Description Successful reflow soldering is a key to productivity and profitability,yet many assemblers may be using a nonoptimized reflow profile. Years ago,when IR ovens were the norm and solder pastes were relatively unsophisticated,initial reflow profiles were ... read more

Description When transitioning to lead-free reflow,consideration should be given to the additional costs of operation,above and beyond material costs.1 Impacts to the overall reflow process should be carefully reviewed. Due to the higher operating temperatures ... read more

Description The impedance and electrical property variation resulting from spatial patterns in woven glass reinforced laminate materials are greatly impacting high speed interconnect designs. As the transfer rates of PCB interconnects increase,the allowable ... read more

Description This paper will discuss the two primary transmission components that concern designers today. These components affect the signal integrity of all high-speed transmissions in printed circuit boards (PCBs). ... read more

Description Efforts to reduce high frequency signal losses associated with dielectric materials have driven development and commercialization of more cost effective low loss laminate materials. These developments have been facilitated by the use of ... read more

Description A common industry practice is to confirm the characteristic impedance of critical PCB traces meet specified performance tolerances before any components are attached. A popular technique is to use a time domain reflectometery (TDR) to derive ... read more

Description This paper will discuss how R/flex® 3000 LCP materials from Rogers Corporation are "pushing the envelope" for high - frequency & flex designs by examining: ... read more

Description Numerous technical articles have dealt with machine parameters,and their effect on wave soldering of Printed Circuit Boards in the range of 40-93 mils and the typical 6 to 8 layers. This research concentrates on identifying the key process parameters ... read more

Description Surface mount assembly has dominated its through-hole predecessor since the early 1990s. The higher density and lower ultimate cost of SMT makes it a preferred assembly technology. However,the mechanical strength of through-hole ... read more

Description Solder preforms are precise shapes of metal,produced by the high-speed stamping or forming of solder wire or ribbon. Preforms provide a highly repeatable volume of solder,with 100% metal content by volume. They are commonly used in ... read more

Description Environmental regulations are forcing the elimination of lead (Pb) from electronic equipment. Solders containing lead have been the standard in printed circuit assembly processes. Lead-free solders currently being used and developed for printed ... read more

Description A new set of constitutive equations for a class of lead-free solder alloys,Sn(3.5-3.9)wt%Ag(0.5-0.8)wt%Cu is proposed in this investigation. These equations are applied to a 256PBGA (plastic ball grid array) package assembly. The creep results in ... read more

Description Applications using flip chips in high temperature and high current designs have increased in recent years,and this trend is expected to continue. Markets utilizing these designs include high performance ASIC,high frequency/RF,and mid I/O ... read more

Description Electroplated pure tin and tin alloys such as Sn99.3Cu0.7%,Sn98%Bi2% and Sn96.5%Ag3.5% have been identified as viable drop-in replacements to tin-lead solder. High melting point tin alloys such as Pb97%Sn3% and Au80%Sn20% are also ... read more

Description There has been much recent interest in printing solder paste onto UBM pads of a wafer. Usually the wafer pad is overprinted using a stencil aperture that is larger than the wafer pad. This permits optimum bump height after reflow. There is also ... read more

Description A conceptual framework for a new type of flip chip attachment is proposed. Gold stud bumps are provided on the chips,and wells filled with solder paste are provided on a flexible substrate serving as the system board. Pushing the stud bumps into ... read more

Description Use of solder paste as a material to bump silicon wafers for interconnection to other level of package interconnection is a simple and cost effective process. However,the material properties of the paste become critical if the quality of the bumps is ... read more

Description Manufacturers of consumer electronic products are continuously striving to confer greater functionality to smaller,lighter, and less expensive packages,and flip chip is an important enabling technology for these product trends. Underfill between ... read more

Description The underfill process has become common practice in the assembly of flip chip and CSP devices and the practice of area array assembly has been adopted by many board designers and component assemblers. The range of devices underfilled has ... read more

Description During the last several years there has been and continues to be an enormous investment by both governments and industry in the development and manufacture of fuel cells. The United States,Japan,and European Union have invested billions of ... read more

Description This paper presents a new joining technology for high-temperature application of solder joints,based on the results of the joint research project "TLSD". By the use of temporary liquid solder joints,it is possible to ensure operating temperatures up ... read more

Description The 3-D interconnection and packaging emerged from the last decade. Today,the 3-D interconnection technologies are becoming mature and their reliability assessed. 3-D technology constitutes the technical core of the VIGOR project which is ... read more

Description The electronics industry is constantly growing and introducing new technology sometimes faster than we can keep up with. This paper reviews one of the single most important,but sometimes overlooked or taken for granted,aspects of the electronics ... read more

Description There are many ways of specifying units for many different measurements,and over the years they have developed a life of their own. For example,length was once measured with glorious imprecision. In 100AD King Edgar of Saxony defined the ... read more

Description One of the most enabling product industries in the world today is Computer Automated Design (CAD). Can you imagine how far technology would have progressed if not for the automation of computer design? CAD has had a major impact on ... read more

Description Microvias are the fastest growing new technology for printed circuits. This talk will highlight the procedures,standards and conditions that designers needs to consider to introduce microvias to their printed circuit board designs. The basis for these ... read more

Description This paper presents a functional signature analysis method for the end-of-life management of products,particularly for electrical-electronics and electromechanical applications. ... read more

Description This paper describes the life-cycle impact assessment methodology developed by the University of Tennessee to calculate the impacts resulting from the use of lead and lead-free solders during the manufacture and assembly of electronics. Formulas ... read more

Description At times,the electronics industry changes faster than the testing and regulatory groups serving the industry. In this case,the electronics supply chain thoroughly evaluated the new printed circuit board (PCB) surface finish Immersion Silver. The ... read more

Description To meet the emerging requirement of eliminating lead from electronics,the printed wiring board (PWB) industry is migrating from hot-air-leveled SnPb solder to alternative final finishes. A thin layer (2-3 microinches) of silver coating on copper has ... read more

Description The influence of co-deposited Phosphorous (P) (from low to high P) within an electroless Nickel layer,regarding the reliability of the solder joint integrity was investigated. The solder joint evaluation was carried,using solder mask defined ... read more

Description With the electronics industry rapidly moving to lead-free soldering and requirements for long term reliability of the assembly becoming more critical,fabricators and OEM’s must determine the most cost effective and reliable means of achieving bare ... read more

Description An Electroless Nickel and Immersion Gold (ENIG) plating process with a middle phosphorous content nickel layer is currently a mainstream final finishing application for mobile phone Printed Wiring Boards (PWB). As a trend according to ... read more

Description A study was conduced to see if faster laser ablation rates,improved fracture resistance and better copper adhesion after electroless plating could be engineered into existing Resin Coated Foils (RCF) with out diminishing any thermal, ... read more

Description There is continued interest in utilizing alternatives to bromine-based flame retardants for printed wiring boards. As a result,a wide variety of phosphorus and non-phosphorus systems have been developed for various thermoset resin systems. The ... read more

Description Enclosed print heads have recently been available to circuit board manufacturers as an alternate technology to conventional squeegee printing. By design,enclosed print heads offer several advantages one of which is isolating the solder paste from ... read more

Description The printing process is always highlighted as contributing the most process defects to a surface mount manufacturing production facility; typical values presented are around the 60% range. Fact or not it does focus the mind on the ... read more