Description When using standard approaches to PCB design and manufacture,there are a number of different elements that can impact signal integrity at high data rates including: inconsistencies in dielectric properties,inconsistencies in trace width,variation in ... read more

Description The IPC study mentioned in the title looked at the effects of time,temperature and humidity on the solderability of true bare copper,immersion silver,immersion tin,organic soldering preservative,reflowed tin/lead and immersion gold/electroless nickel circuit board finishes. ... read more

Description The deployment of non-Lead (Pb) surface finishes is well underway throughout the electronics industry. Printed circuit boards,which for many years had relied on Hot Air Solder Level (HASL) finishing,have been using new flatter,Pb-free solderable finishes. ... read more

Description x ... read more

Description While silicon density doubles approximately every 18 months,following Moore’s law,PWB electrical technology advances much more slowly,Up until now trace impedance has been a sufficient high speed electrical specification for PWB traces. ... read more

Description This paper presents the qualification of a new,very thin,printed circuit board (“PCB”) dielectric substrate (“core”) to meet Teradyne’s performance and reliability design goals for a power supply (“PS”) printed circuit board. ... read more

Description Lead-free soldering is expected to become the new standard in the future. Different legislations or draft directives target the restriction or the ban of the use of lead in the world. ... read more

Description x ... read more

Description Embedded passive components are resistors,capacitors and inductors buried within a multilayer PCB. Embedded components pass standard reliability test methods,however,the higher temperatures required for lead-free solders increase the physical stress in the board. ... read more

Description Over the past six years Motorola has shipped over 47 million phones incorporating Embedded Passives (EP) technology. The EP modules shipped in phones have included small modules such as voltage controlled oscillators as well as large modules comprising full phone functionality. ... read more

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Description The number of applications using Embedded capacitor technology on Printed Wiring Boards (PWBs) is increasing. One of the increasing applications using embedded capacitor is high-speed digital application and another is module for hand held devices. ... read more

Description This paper is the second concerning the use of existing electrical test equipment being programmed to first measure the values of plated additive resistors manufactured on circuit board inner layers. ... read more

Description This work initially started with some research into ink jet technology materials for legend printing. Our company in Hong Kong was working at the time with a Japanese company with the end goal being the development of a new machine for PCB legend printing. ... read more

Description Pure and doped barium titanate thin films have been prepared by chemical solution deposition on 18 µm thick,industry standard copper foils. Films are approximately 0.6 µm thickness and exhibit randomly oriented equiaxed BaTiO3 grains. ... read more

Description Last spring at EXPO,embedded passives came into its own by being escalated from a sub-committee with 4 task groups to a general committee with 4 sub-committees. Dave McGregor of Dupont now chairs the new general committee D-50 with Richard Snogren of Bristlecone as vice chair. ... read more

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Description Traditionally microvias have been considered to be the most reliable interconnect structure within a printed wiring board (PWB). ... read more

Description The following report is fundamentally focused on how three popular lead-free alloys react in a wave solder application. The alloys were SAC305,SAC405 and a proprietary,low silver SAC alloy. ... read more

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Description As the global electronic industry marches toward the brave new world of environmentally conscious electronic manufacturing,lead free soldering has made some fundamental shifts in the processing approaches to print wired assembly (PWA). ... read more

Description Due to the European legislations (RoHS and WEEE) consumer products need to be soldered with lead-free solders from the first of July 2006. ... read more

Description In response to growing concerns about the effects of hazardous materials in the waste stream on the environment,the European Union (EU) passed a directive in 2002 entitled the Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment (RoHS). ... read more

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Description The widespread use of electrotechnical products has drawn increased attention to their impact on the environment. In many countries all over the world this has resulted in the adaptation of regulations affecting wastes,substances and en-ergy use of electrotechnical products. ... read more

Description As the electronics industry prepares for the elimination of the six chemical substances banned by the European Union’s Restriction of the Use of Certain Hazardous Substances in Electrical and Electronic Equipment Directive and the waste recovery requirements of the Waste Electrical and Electronic ... read more

Description Component Material Declarations are a key building block for all OEMs (Original Equipment Manufacturer) and CMs (Contract Manufacturer) preparing a sound due diligence case for RoHS Compliance. ... read more

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Description The Chinese printed circuit industry has seen rapid growth in the past years,from barely nothing to more than 6.05 billion USD production value in 2003. The association of the industry,CPCA,also has seen similar growth. This article introduces ... read more

Description Conductive Anodic Filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament,a copper salt,grows from anode to cathode along the epoxy -glass interface. ... read more

Description Area Array Packages (AAPs) with 1.27 mm pitch have been the packages of choice for commercial applications; they are now starting to be implemented for use in military and aerospace applications. Thermal cycling characteristics of plastic ball grid ... read more

Description Plastic IC Packages are generally considered to be not as reliable as their ceramic counterparts. One of the major reasons is the question of hermeticity. Plastic materials generally allow moisture/ humidity to penetrate through the body of the ... read more

Description The assembly of thinned silicon die (25-100µm) onto flex substrates provides options for ultra thin,flexible electronics for applications ranging from smart cards to space-based radars. For high density applications,3-D modules can be fabricated by ... read more

Description Thermoset epoxies,discovered nearly 80 years ago,remain the workhorse materials for electronic packaging and printed circuit boards,but this may change with increasing technical,economic and regulatory demands. Modern halogen-free ... read more

Description Hand-held communication and entertainment products continue to dominate the consumer markets worldwide,and with each generation,companies are offering more and more features and/or capability. Even though the actual functionality of the new ... read more

Description Meeting RoHS requirements is confusing at best. Currently,RoHS bans the presence of 6 substances,: Lead (Pb),Cadmium (Cd),Mercury (Hg),Hexavalent Chromium (Cr6+),Polybrominated biphenyl (PBB) and Polybrominated diphenylether (PBDE). ... read more

Description This paper describes flexible printed circuit boards,used as “Product Boards” or “Interposers”,chip mounting structures. Traditionally,flexible circuit boards are made with polyimide dielectric cores. ... read more

Description X ... read more

Description Hand-held communication and entertainment products continue to dominate the consumer markets worldwide and,with each generation,offering more and more features and/or capability. ... read more

Description Recent advances in chip technologies have prompted a rapid increase in the density of solder joints in electronic components. Further reductions in pitch are likely,leading to joint structures exhibiting sub 0.100mm (100µm) dimensions. ... read more

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Description A flexible circuit is more than just thin materials made into an interconnecting device. ... read more

Description Two emerging board technologies,embedded passives and embedded optical waveguides,have the potential to change the way that printed wiring boards operate. No longer will interconnects be relegated to copper,but true passive electrical functionality will be incorporated into the board. ... read more

Description Embedding resistors right into the printed circuit board substrate is not new,but it is gaining momentum as a rapidly emerging and pivotal technology for the PCB industry,perhaps preceded only by the plated thru hole in the 50s and ... read more

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Description As IC technology advances,electronic packaging for the ICs has had to advance as well. The package methodology has become technically more sophisticated and physically more complex. For many IC package applications,the lead-frame package technology of the past is not adequate. ... read more

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